R9A07G043U12GBG#BC0
| Part Description |
ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G 4 Core, 64-Bit 200MHz, 1GHz 361-BGA (13x13) |
|---|---|
| Quantity | 45 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | R9A07G043 |
| Manufacturer | Renesas Electronics Corporation |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 18 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A55, ARM® Cortex®-M33 | Device Package | 361-BGA (13x13) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Ethernet | GbE (2) | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 64-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 361-LFBGA | RAM Controllers | DDR4, DDR3L | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG | ||
| Speed | 200MHz, 1GHz | Supplier Device Package | 361-BGA (13×13) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 1.8V, 3.3V |
Overview of R9A07G043U12GBG#BC0 – ARM® Cortex®-A55 / Cortex®-M33 Microprocessor IC, 4-Core 64‑Bit 200MHz/1GHz, 361‑LFBGA
The R9A07G043U12GBG#BC0 is a Renesas RZ/G series microprocessor combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit architecture. It targets embedded and industrial applications that require balanced application-processing performance together with a microcontroller-class core for control and real-time tasks. Key value propositions include multicore processing, integrated security features, and a broad set of interfaces for networking and human-machine interfaces.
Key Features
- Core and Architecture ARM® Cortex®-A55 and ARM® Cortex®-M33 cores arranged as a 4‑core, 64‑bit configuration, providing a combination of application processing and control functionality.
- Performance Range Listed frequencies include 200 MHz and 1 GHz, indicating support for differentiated core performance within the device series.
- Security Built-in cryptographic and security primitives including AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256 and a TRNG for secure key generation and authenticated processing.
- Memory Support Integrated memory controller support for DDR4 and DDR3L memory types to accommodate varying system memory performance and power requirements.
- Interfaces and Connectivity Dual Gigabit Ethernet ports, two USB 2.0 ports, CANbus interface and LCD display controller support for networked and HMI-centric embedded systems.
- Multimedia Acceleration Multimedia coprocessors with NEON™ SIMD support for efficient media-oriented computations.
- Package and Mounting Supplied in a 361‑LFBGA (361‑BGA 13×13) surface-mount package for compact board-level integration.
- Industrial Qualification and Temperature Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in industrial environments.
- RoHS Compliant Device is RoHS compliant.
Typical Applications
- Industrial Control and Automation Use the multicore architecture and industrial temperature rating for control, protocol handling and secure data processing in factory and plant systems.
- Networked Gateways and Edge Devices Dual Gigabit Ethernet and USB 2.0 interfaces support networking and peripheral connectivity for edge gateway designs.
- Human‑Machine Interfaces (HMI) Integrated LCD display controller and multimedia acceleration make the device suitable for operator panels and graphical interfaces.
- Secure Embedded Systems On‑chip cryptography and TRNG support secure communications, boot and data protection for industrial and embedded applications.
Unique Advantages
- Heterogeneous Multicore Design: Combines ARM® Cortex®-A55 and Cortex®-M33 cores in a 4‑core, 64‑bit arrangement to partition application and control workloads effectively.
- Comprehensive Security Suite: Built-in AES, ECC, RSA, SHA family algorithms, GHASH and TRNG enable hardware-accelerated cryptographic functions and secure key generation without external accelerators.
- Flexible Memory Options: Support for DDR4 and DDR3L memory controllers allows designers to select memory technologies that match system cost and performance targets.
- Rich Connectivity: Dual GbE, USB 2.0 ports and CANbus provide the interfaces needed for networking, peripheral expansion and industrial fieldbus integration.
- Industrial Readiness: Industrial qualification and a −40 °C to 85 °C operating range support deployment in harsh and temperature‑sensitive environments.
- Compact Surface-Mount Package: 361‑LFBGA (13×13) packaging enables dense PCB layouts while maintaining robust board-level mounting.
Why Choose R9A07G043U12GBG#BC0?
The R9A07G043U12GBG#BC0 positions itself as a versatile embedded microprocessor for industrial and connected systems that demand a mix of application performance, control capability and integrated security. Its combination of ARM® Cortex®-A55 and Cortex®-M33 cores, network interfaces, memory flexibility and cryptographic features make it suitable for designs that require both processing throughput and secure operation.
Designers and procurement teams looking for a scalable, industrial‑qualified platform will find the R9A07G043U12GBG#BC0 provides a balanced set of hardware features and packaging for compact, rugged deployments supported by Renesas’ RZ/G family.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for R9A07G043U12GBG#BC0. Our team can assist with volume pricing, lead times and integration guidance.

Date Founded: 2002
Headquarters: Koto City, Tokyo, Japan
Employees: 21,000+
Revenue: $10 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016