R9A07G043U12GBG#BC0

IC MPU RZ/G 200MHZ/1GHZ 361LFBGA
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC RZ/G 4 Core, 64-Bit 200MHz, 1GHz 361-BGA (13x13)

Quantity 45 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesR9A07G043
ManufacturerRenesas Electronics Corporation
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package361-BGA (13x13)
Display & Interface ControllersLCDECCNN/AEthernetGbE (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit
Operating Temperature-40°C ~ 85°C (TA)Package / Case361-LFBGARAM ControllersDDR4, DDR3L
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256, TRNG
Speed200MHz, 1GHzSupplier Device Package361-BGA (13×13)USBUSB 2.0 (2)
Voltage – I/O1.8V, 3.3V

Overview of R9A07G043U12GBG#BC0 – ARM® Cortex®-A55 / Cortex®-M33 Microprocessor IC, 4-Core 64‑Bit 200MHz/1GHz, 361‑LFBGA

The R9A07G043U12GBG#BC0 is a Renesas RZ/G series microprocessor combining ARM® Cortex®-A55 and ARM® Cortex®-M33 cores in a 4‑core, 64‑bit architecture. It targets embedded and industrial applications that require balanced application-processing performance together with a microcontroller-class core for control and real-time tasks. Key value propositions include multicore processing, integrated security features, and a broad set of interfaces for networking and human-machine interfaces.

Key Features

  • Core and Architecture  ARM® Cortex®-A55 and ARM® Cortex®-M33 cores arranged as a 4‑core, 64‑bit configuration, providing a combination of application processing and control functionality.
  • Performance Range  Listed frequencies include 200 MHz and 1 GHz, indicating support for differentiated core performance within the device series.
  • Security  Built-in cryptographic and security primitives including AES, ECC, GHASH, RSA, SHA-1, SHA-224, SHA-256 and a TRNG for secure key generation and authenticated processing.
  • Memory Support  Integrated memory controller support for DDR4 and DDR3L memory types to accommodate varying system memory performance and power requirements.
  • Interfaces and Connectivity  Dual Gigabit Ethernet ports, two USB 2.0 ports, CANbus interface and LCD display controller support for networked and HMI-centric embedded systems.
  • Multimedia Acceleration  Multimedia coprocessors with NEON™ SIMD support for efficient media-oriented computations.
  • Package and Mounting  Supplied in a 361‑LFBGA (361‑BGA 13×13) surface-mount package for compact board-level integration.
  • Industrial Qualification and Temperature  Industrial qualification with an operating temperature range of −40 °C to 85 °C for deployment in industrial environments.
  • RoHS Compliant  Device is RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Use the multicore architecture and industrial temperature rating for control, protocol handling and secure data processing in factory and plant systems.
  • Networked Gateways and Edge Devices  Dual Gigabit Ethernet and USB 2.0 interfaces support networking and peripheral connectivity for edge gateway designs.
  • Human‑Machine Interfaces (HMI)  Integrated LCD display controller and multimedia acceleration make the device suitable for operator panels and graphical interfaces.
  • Secure Embedded Systems  On‑chip cryptography and TRNG support secure communications, boot and data protection for industrial and embedded applications.

Unique Advantages

  • Heterogeneous Multicore Design: Combines ARM® Cortex®-A55 and Cortex®-M33 cores in a 4‑core, 64‑bit arrangement to partition application and control workloads effectively.
  • Comprehensive Security Suite: Built-in AES, ECC, RSA, SHA family algorithms, GHASH and TRNG enable hardware-accelerated cryptographic functions and secure key generation without external accelerators.
  • Flexible Memory Options: Support for DDR4 and DDR3L memory controllers allows designers to select memory technologies that match system cost and performance targets.
  • Rich Connectivity: Dual GbE, USB 2.0 ports and CANbus provide the interfaces needed for networking, peripheral expansion and industrial fieldbus integration.
  • Industrial Readiness: Industrial qualification and a −40 °C to 85 °C operating range support deployment in harsh and temperature‑sensitive environments.
  • Compact Surface-Mount Package: 361‑LFBGA (13×13) packaging enables dense PCB layouts while maintaining robust board-level mounting.

Why Choose R9A07G043U12GBG#BC0?

The R9A07G043U12GBG#BC0 positions itself as a versatile embedded microprocessor for industrial and connected systems that demand a mix of application performance, control capability and integrated security. Its combination of ARM® Cortex®-A55 and Cortex®-M33 cores, network interfaces, memory flexibility and cryptographic features make it suitable for designs that require both processing throughput and secure operation.

Designers and procurement teams looking for a scalable, industrial‑qualified platform will find the R9A07G043U12GBG#BC0 provides a balanced set of hardware features and packaging for compact, rugged deployments supported by Renesas’ RZ/G family.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for R9A07G043U12GBG#BC0. Our team can assist with volume pricing, lead times and integration guidance.

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