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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
| N/A | R8A774A3HA01BG#G7 | Renesas | SOC RZ/G2M HDMI ON (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40 °C – 85 °C | Speed: 1.2 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit RAM Controllers: LPDDR4 Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-R7 Display & Interface Controllers: HMI SATA: SATA 16Gbps (1) Qualification: Industrial | 525 | ||
| N/A | R8A774A3HA01BG#GV | Renesas | SOC RZ/G2M HDMI ON (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit Speed: 1.2GHz, 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HMI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 277 | ||
| N/A | R8A774A3HA01BG#U7 | Renesas | SOC RZ/G2M HDMI ON (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40 °C – 85 °C | Speed: 1.2 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit RAM Controllers: LPDDR4 Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-R7 Display & Interface Controllers: HMI SATA: SATA 16Gbps (1) Qualification: Industrial | 620 | ||
| N/A | R8A774A3HA01BG#UV | Renesas | SOC RZ/G2M HDMI ON (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 2 Core, 64-Bit Speed: 1.2GHz, 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: HMI Ethernet: 10/100/1000Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,817 | ||
 | N/A | R8A774B0HA01BG#G0 | Renesas | IC MPU RZ/G2N 1.5GHZ 1022FPBGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (2) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA | 1,020 | |
| N/A | N/A | R8A774B0HA01BG#G2 | Renesas | SOC RZ/G2N HDMI OFF(FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI Ethernet: 10/100/1000Mbps (2) SATA: SATA 16Gbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,799 | |
 | N/A | R8A774B0HA01BG#U0 | Renesas | IC MPU RZ/G2N 1.5GHZ 1022FPBGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (2) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA | 162 | |
| N/A | R8A774B0HA01BG#U2 | Renesas | SOC RZ/G2M HDMI OFF | Microprocessors | N/A | N/A | -40 °C – 85 °C | Speed: 1.5 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR4 SATA: SATA 16Gbps (1) Qualification: Industrial | 49 | ||
 | N/A | R8A774B1HA01BG#G0 | Renesas | IC MCU 32BIT RZ/G2E HDMI OFF | Microprocessors | 1022-FCBGA (29x29) | N/A | -40 °C – 85 °C | Speed: 1.5 GHz Voltage – I/O: 1.8 V – 3.3 V Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: LPDDR4 Ethernet: 10/100/1000Mbps (2) USB: USB 2.0 OTG (2), USB 3.0 (1) Graphics Acceleration: Yes Co-Processors/DSP: ARM® Cortex®-R7 Display & Interface Controllers: LVDS, MIPI-CSI SATA: SATA 16Gbps (1) Qualification: Industrial | 1,740 | |
| N/A | N/A | R8A774B1HA01BG#G2 | Renesas | SOC RZ/G2N HDMI ON(FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI Ethernet: 10/100/1000Mbps (2) SATA: SATA 16Gbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 522 | |
| N/A | N/A | R8A774B1HA01BG#U2 | Renesas | SOC RZ/G2N HDMI ON(BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A57 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.5GHz Co-Processors/DSP: ARM® Cortex®-R7 RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: LVDS, MIPI-CSI Ethernet: 10/100/1000Mbps (2) SATA: SATA 16Gbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,431 | |
 | R8A774C0HA01BG#G0 | Renesas | IC MPU RZ/G2E 1.2GHZ 552FBGA | Microprocessors | 552-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 552-FBGA Supplier Device Package: 552-FBGA (21×21) | 601 | ||
 | R8A774C0HA01BG#GA | Renesas | IC MPU RZ/G2E 1.2GHZ 552FPBGA | Microprocessors | 552-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-FPBGA | 871 | ||
 | R8A774C0HA01BG#U0 | Renesas | IC MPU RZ/G2E 1.2GHZ 552FBGA | Microprocessors | 552-FBGA (21x21) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 552-FBGA Supplier Device Package: 552-FBGA (21×21) | 899 | ||
 | R8A774C0HA01BG#UA | Renesas | IC MPU RZ/G2E 1.2GHZ 552FPBGA | Microprocessors | 552-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.2GHz Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3L Graphics Acceleration: No Display & Interface Controllers: MIPI-CSI Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB 2.0 (1), USB 3.0 (1) Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 552-BGA Supplier Device Package: 552-FPBGA | 946 | ||
 | N/A | R8A774E0HA01BN#G0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (4) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA | 657 | |
| N/A | R8A774E0HA01BN#G6 | Renesas | SOC RZ/G2H HDMI OFF (FULL) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DU Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 451 | ||
 | N/A | R8A774E0HA01BN#U0 | Renesas | IC MPU RZ 1.2GHZ/1.5GHZ 1022BGA | Microprocessors | 1022-FPBGA | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 8 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: No Display & Interface Controllers: DU Ethernet: 10/100Mbps (1), 100/1000Mbps (1) USB: USB (4) Voltage – I/O: 0.82V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 1022-BGA Supplier Device Package: 1022-FPBGA | 290 | |
| N/A | R8A774E0HA01BN#U6 | Renesas | SOC RZ/G2H HDMI OFF (BULK) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DU Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 1,833 | ||
| N/A | R8A774E0HA01BN#YBC | Renesas | SOC RZ/G2H HDMI OFF (CS) | Microprocessors | 1022-FCBGA (29x29) | N/A | -40°C ~ 85°C | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-A57 Number of Cores/Bus Width: 4, 4 Core, 64-Bit Speed: 1.2GHz, 1.5GHz RAM Controllers: LPDDR4 Graphics Acceleration: Yes Display & Interface Controllers: DU Ethernet: 10/100Mbps (1) USB: USB 2.0 OTG (2), USB 3.0 (1) Voltage – I/O: 3.3V Operating Temperature: -40°C ~ 85°C Security Features: AES, ARM TZ, Hash, RSA, Secure Boot, TRNG Mounting Type: Surface Mount Package / Case: 1022-BFBGA, FCBGA Supplier Device Package: 1022-FCBGA (29×29) | 795 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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