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Microprocessors
Total Products: 5,357
| Image | Data Sheet | Part Number | Manufacturer | Description | Category | Device Package | Voltage | Operating Temp | Additional Specifications | Qty | Get A Quote |
|---|---|---|---|---|---|---|---|---|---|---|---|
 | ATSAMA5D42B-CUR | Microchip Technology | IC MPU SAMA5D4 600MHZ 361TFBGA | Microprocessors | 361-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (16×16) Grade: Industrial | 435 | ||
 | ATSAMA5D43A-CU | Microchip Technology | IC MPU SAMA5D4 600MHZ 289LFBGA | Microprocessors | 289-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14×14) Grade: Industrial | 692 | ||
 | ATSAMA5D43A-CUR | Microchip Technology | IC MPU SAMA5D4 600MHZ 289LFBGA | Microprocessors | 289-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14×14) Grade: Industrial | 1,449 | ||
 | ATSAMA5D43B-CU | Microchip Technology | IC MPU SAMA5D4 600MHZ 289LFBGA | Microprocessors | 289-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14×14) Grade: Industrial | 730 | ||
 | ATSAMA5D43B-CUR | Microchip Technology | IC MPU SAMA5D4 600MHZ 289LFBGA | Microprocessors | 289-LFBGA (14x14) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 289-LFBGA Supplier Device Package: 289-LFBGA (14×14) Grade: Industrial | 1,471 | ||
 | ATSAMA5D44A-CU | Microchip Technology | IC MPU SAMA5D4 600MHZ 361TFBGA | Microprocessors | 361-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (16×16) Grade: Industrial | 491 | ||
 | ATSAMA5D44A-CUR | Microchip Technology | IC MPU SAMA5D4 600MHZ 361TFBGA | Microprocessors | 361-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (16×16) Grade: Industrial | 1,755 | ||
 | ATSAMA5D44B-CU | Microchip Technology | IC MPU SAMA5D4 600MHZ 361TFBGA | Microprocessors | 361-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (16×16) Grade: Industrial | 797 | ||
 | ATSAMA5D44B-CUR | Microchip Technology | IC MPU SAMA5D4 600MHZ 361TFBGA | Microprocessors | 361-TFBGA (16x16) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-A5 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 600MHz Co-Processors/DSP: Multimedia; NEON™ SIMD RAM Controllers: LPDDR, LPDDR2, DDR2 Graphics Acceleration: Yes Display & Interface Controllers: LCD, Touchscreen Ethernet: 10/100Mbps (1) USB: USB 2.0 (3) Voltage – I/O: 1.2V, 1.8V, 3.3V Operating Temperature: -40°C ~ 85°C (TA) Security Features: AES, SHA, TDES, TRNG Mounting Type: Surface Mount Package / Case: 361-TFBGA Supplier Device Package: 361-TFBGA (16×16) Grade: Industrial | 699 | ||
| N/A | N/A | AW8063801211101 SR0T4 | Intel | IC MPU 2.4GHZ 988FCPGA | Microprocessors | 988-FCPGA (37.5x37.5) | N/A | 90°C (TJ) | Core Processor: Intel® Core™ i3-3110M Processor Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 2.4GHz RAM Controllers: DDR3, DDR3L Graphics Acceleration: Yes Operating Temperature: 90°C (TJ) Mounting Type: Through Hole Package / Case: 988-CPGA Supplier Device Package: 988-FCPGA (37.5×37.5) Grade: Commercial | 789 | |
| N/A | AY80609007293AA | Intel | IC MPU Z670 1.5GHZ 518BGA | Microprocessors | 518-PBGA (13.8x13.8) | N/A | 90°C (TJ) | Core Processor: Intel Atom® Processor Z670 Number of Cores/Bus Width: 1 Core, 32-Bit Speed: 1.5GHz Voltage – I/O: 1.1125V, 1.5V Operating Temperature: 90°C (TJ) Mounting Type: Surface Mount Package / Case: 518-BGA Supplier Device Package: 518-PBGA (13.8×13.8) Grade: Commercial | 187 | ||
| N/A | B4420NSE7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 (1) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 1,597 | ||
| N/A | B4420NSN7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 (1) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 427 | ||
| N/A | B4420NXE7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 (1) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 89 | ||
| N/A | B4420NXN7QQMD | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 2 Core, 64-Bit Speed: 1.6GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – Dual RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4) USB: USB 2.0 (1) Voltage – I/O: 1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 622 | ||
 | B4860NSE7QUMD | NXP Semiconductors | QORIQ QONVERGE SOC, 6X1.2GHZ STA | Microprocessors | N/A | N/A | N/A | Voltage – I/O: 1 V – 2.5 V Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Graphics Acceleration: No Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core | 324 | ||
| N/A | B4860NSN7QUMD | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 377 | ||
| N/A | B4860NXE7QUMD | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 1020FCPBGA | Microprocessors | 1020-FCPBGA (33x33) | N/A | -40°C ~ 105°C (TA) | Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit Speed: 1.8GHz Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core RAM Controllers: DDR3, DDR3L Graphics Acceleration: No Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Voltage – I/O: 1.0V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC Mounting Type: Surface Mount Package / Case: 1020-BBGA, FCBGA Supplier Device Package: 1020-FCPBGA (33×33) | 115 | ||
 | B4860NXN7QUMD | NXP Semiconductors | B4860 - QORIQ QONVERGE SOC, 6X1. | Microprocessors | N/A | N/A | N/A | Voltage – I/O: 1 V – 2.5 V Core Processor: PowerPC e6500 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3, DDR3L Ethernet: 1/2.5Gbps (4), 1/2.5/10Gbps (2) USB: USB 2.0 (1) Graphics Acceleration: No Co-Processors/DSP: Signal Processing; SC3900FP FVP – 6 Core | 198 | ||
 | N/A | BOXDX2ODPR66 | Intel | CPU 486DX266 OVERDRIVE 168PGA | Microprocessors | 168-PGA | N/A | N/A | Speed: 66 MHz Voltage – I/O: 5 V Core Processor: 80486DX Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Co-Processors/DSP: Integrated FPU | 1,720 |
About Microprocessors
Microprocessor products are specialized integrated circuits designed for processing information and data. Microprocessors typically do not include built-in working memory or mixed-signal peripherals. They are often used in more complex software environments that involve the use of an operating system to handle the simultaneous execution of multiple tasks. For applications requiring parallel processing and hardware-level flexibility, designers may also consider field programmable gate arrays.
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