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Suntsu Electronics is your reliable source for hard-to-find and obsolete electronic components. Our advanced part search tool makes it easy to quickly find the products you need. You can search by part number, manufacturer, or specifications to instantly access a comprehensive database of electronic components.

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Total Products: 3,239
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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MPC8323VRAFDCA
MPC8323VRAFDCANXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
1,689
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MPC8323ZQADDC
MPC8323ZQADDCNXP SemiconductorsIC MPU MPC83XX 266MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
195
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MPC8323ZQAFDC
MPC8323ZQAFDCNXP SemiconductorsIC MPU MPC83XX 333MHZ PBGA516Microprocessors516-PBGA (27x27)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300c2
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
333MHz
Co-Processors/DSP:
Communications; QUICC Engine
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100Mbps (3)
USB:
USB 2.0 (1)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
516-BBGA
Supplier Device Package:
516-PBGA (27×27)
220
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N/A
MPC8343CRADDBNXP SemiconductorsPOWERQUICC II PRO PROCESSORMicroprocessors620-TEPBGA II (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-TEPBGA II (29×29)
1,563
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MPC8343CVRADD
MPC8343CVRADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,417
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MPC8343CVRADDB
MPC8343CVRADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,172
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MPC8343CVRAGD
MPC8343CVRAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
250
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MPC8343CVRAGDB
MPC8343CVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
460
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MPC8343CZQADD
MPC8343CZQADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
982
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MPC8343CZQADDB
MPC8343CZQADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,314
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MPC8343CZQAGDB
MPC8343CZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,160
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MPC8343ECVRAGDB
MPC8343ECVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,414
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QUOTE
MPC8343ECZQADDB
MPC8343ECZQADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
836
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MPC8343ECZQAGDB
MPC8343ECZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,561
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MPC8343EVRADD
MPC8343EVRADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
762
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QUOTE
MPC8343EVRADDB
MPC8343EVRADDBNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
309
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N/A
MPC8343EVRAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
959
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QUOTE
MPC8343EZQAGD
MPC8343EZQAGDNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
1,398
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QUOTE
MPC8343EZQAGDB
MPC8343EZQAGDBNXP SemiconductorsIC MPU MPC83XX 400MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Security; SEC
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
547
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MPC8343VRADD
MPC8343VRADDNXP SemiconductorsIC MPU MPC83XX 266MHZ 620HBGAMicroprocessors620-HBGA (29x29)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e300
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
RAM Controllers:
DDR, DDR2
Graphics Acceleration:
No
Ethernet:
10/100/1000Mbps (3)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.8V, 2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Package / Case:
620-BBGA Exposed Pad
Supplier Device Package:
620-HBGA (29×29)
640
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