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Total Products: 3,238
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
N/A
FS32V234BMN2VUBNXP SemiconductorsIC MPU FS32V23 800MHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
800MHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
900
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QUOTE
N/A
FS32V234CKN1VUBNXP SemiconductorsISP CSE 1GHZ 4 CORESMicroprocessorsN/AN/AN/A

N/A

1,150
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QUOTE
N/A
FS32V234CKN1VUBRNXP SemiconductorsISP CSE 1GHZ 4 CORESMicroprocessorsN/AN/AN/A

N/A

897
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QUOTE
N/A
FS32V234CKN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
819
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QUOTE
N/A
FS32V234CKN2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
424
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QUOTE
FS32V234CMN1VUB
FS32V234CMN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,351
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QUOTE
N/A
FS32V234CMN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
313
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QUOTE
FS32V234CON1VUB
FS32V234CON1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
716
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QUOTE
N/A
FS32V234CON1VUBRNXP SemiconductorsISP GPU CSE 1GHZ 4 COMicroprocessorsN/AN/AN/A

N/A

351
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QUOTE
N/A
FS32V234CON2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
105
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QUOTE
N/A
FS32V234CON2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,209
GET A
QUOTE
N/A
FS32V234CTN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,271
GET A
QUOTE
N/A
FS32V234CTN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
Additional Interfaces:
I2C, SPI, PCI, UART
1,914
GET A
QUOTE
N/AN/AG4860NSE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
581
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QUOTE
N/AN/AG4860NSN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A0°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
0°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
552
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QUOTE
N/AN/AG4860NXE7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
134
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QUOTE
N/AN/AG4860NXN7QUMDNXP SemiconductorsIC MPU QORIQ 1.6GHZ 1020FCPBGAMicroprocessors1020-FCPBGA (33x33)N/A-40°C ~ 105°C (TA)
Core Processor:
PowerPC e6500
Number of Cores/Bus Width:
4 Core, 64-Bit
Speed:
1.6GHz
Co-Processors/DSP:
Signal Processing; SC3900FP FVP – 6 Core
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
No
Ethernet:
1/2.5Gbps (4), 1/2.5/10Gbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
1V, 1.2V, 1.35V, 1.5V, 1.8V, 2.5V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, DES, 3DES, HMAC, Ipsec, Kasumi, MD5, SHA-1/2, SNOW-3D, ZUC
Mounting Type:
Surface Mount
Package / Case:
1020-BBGA, FCBGA
Supplier Device Package:
1020-FCPBGA (33×33)
Additional Interfaces:
I2C, MMC/SD, RapidIO, SPI, UART
824
GET A
QUOTE
N/A
KC13213NXP SemiconductorsMC13213 - Microprocessor CircuitMicroprocessorsN/AN/AN/A

N/A

1,272
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QUOTE
KMC68302EH25C
KMC68302EH25CNXP SemiconductorsIC MPU M683XX 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
Additional Interfaces:
GCI, IDL, ISDN, NMSI, PCM, SCPI
1,451
GET A
QUOTE
KMC68360AI33L
KMC68360AI33LNXP SemiconductorsIC MPU M683XX 33MHZ 240FQFPMicroprocessors240-FQFP (32x32)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32+
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (1)
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
240-BFQFP
Supplier Device Package:
240-FQFP (32×32)
Additional Interfaces:
SCC, SMC, SPI
478
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QUOTE

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