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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MCIMX502EVM8BMCIMX502EVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A-20°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
273
MCIMX503CVM8BMCIMX503CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
168
MCIMX503CVM8BR2MCIMX503CVM8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
1,505
MCIMX507CVK8BMCIMX507CVK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
35
MCIMX507CVK8BR2MCIMX507CVK8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
488
MCIMX507CVM1BMCIMX507CVM1BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
534
MCIMX507CVM1BR2MCIMX507CVM1BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
829
MCIMX507CVM8BMCIMX507CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
676
N/AMCIMX508CVK1BNXP SemiconductorsIC MPU I.MX50 1.0GHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.0GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
1,975
MCIMX508CVK8BMCIMX508CVK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
1,090
MCIMX508CVK8BR2MCIMX508CVK8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 416MAPBGAMicroprocessors416-MAPBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-LFBGA
Supplier Device Package:
416-MAPBGA (13×13)
248
MCIMX508CVM8BMCIMX508CVM8BNXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
120
MCIMX508CVM8BR2MCIMX508CVM8BR2NXP SemiconductorsIC MPU I.MX50 800MHZ 400LFBGAMicroprocessors400-LFBGA (17x17)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
400-LFBGA
Supplier Device Package:
400-LFBGA (17×17)
316
N/AMCIMX508CZK8BNXP SemiconductorsIC MPU I.MX50 800MHZ 416VFBGAMicroprocessors416-VFBGA (13x13)N/A0°C ~ 70°C (TA)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, LPDDR2, DDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
EPDC, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 + PHY (2)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Boot Security, Cryptography, Secure JTAG
Mounting Type:
Surface Mount
Package / Case:
416-VFBGA
Supplier Device Package:
416-VFBGA (13×13)
471
MCIMX512CJM6CMCIMX512CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
988
MCIMX512CJM6CR2MCIMX512CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
743
MCIMX512DJM8CMCIMX512DJM8CNXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-20°C ~ 85°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-20°C ~ 85°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
1,137
MCIMX512DJM8CR2MCIMX512DJM8CR2NXP SemiconductorsIC MPU I.MX51 800MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-20°C – 85°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Mounting Type:
Surface Mount
931
MCIMX513CJM6CMCIMX513CJM6CNXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)N/A-40°C ~ 95°C (TC)
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2
Graphics Acceleration:
No
Display & Interface Controllers:
Keypad, LCD
Ethernet:
10/100Mbps (1)
USB:
USB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O:
1.2V, 1.875V, 2.775V, 3.0V
Operating Temperature:
-40°C ~ 95°C (TC)
Security Features:
ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Mounting Type:
Surface Mount
Package / Case:
529-LFBGA
Supplier Device Package:
529-BGA (19×19)
587
MCIMX513CJM6CR2MCIMX513CJM6CR2NXP SemiconductorsIC MPU I.MX51 600MHZ 529BGAMicroprocessors529-BGA (19x19)1.2V, 1.875V, 2.775V, 3.0V-40°C – 95°C
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
600MHz
Mounting Type:
Surface Mount
547

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