MCIMX503CVM8B

IC MPU I.MX50 800MHZ 400LFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX50 1 Core, 32-Bit 800MHz 400-LFBGA (17x17)

Quantity 168 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 503
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package400-LFBGA (17x17)
Display & Interface ControllersLCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 70°C (TA)Package / Case400-LFBGARAM ControllersLPDDR, LPDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Secure JTAG
Speed800MHzSupplier Device Package400-LFBGA (17×17)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX503CVM8B – IC MPU I.MX50 800MHz 400-LFBGA

The MCIMX503CVM8B is an NXP Semiconductors microprocessor IC from the i.MX 503 series. It integrates a single ARM® Cortex®-A8 core running at 800 MHz and is targeted at embedded applications that require multimedia-capable processing in a compact surface-mount package.

Designed for display-driven and connected embedded systems, the device combines a Cortex‑A8 core with multimedia acceleration, integrated memory controllers and multiple peripheral interfaces to deliver a balanced mix of performance, integration and platform security.

Key Features

  • Core and Performance — ARM® Cortex®‑A8 single core at 800 MHz, 32‑bit processing for general-purpose embedded compute tasks.
  • Multimedia Acceleration — Integrated multimedia/DSP capabilities with NEON™ SIMD and graphics acceleration to support 2D graphics and pixel processing.
  • Memory Interfaces — Built-in controllers for LPDDR, LPDDR2 and DDR2 memory types to enable flexible memory configurations and performance/power trade-offs.
  • Display and Graphics — LCD display controller and Pixel Processing Pipeline (ePXP) support for display‑centric applications.
  • Connectivity — On‑chip Ethernet 10/100 Mbps (1) and two USB 2.0 ports with PHY for wired network and peripheral connectivity; additional 1‑Wire interface for simple sensor and ID connections.
  • Security — Boot security, cryptography and Secure JTAG features for protected boot and secure debug/access control.
  • Industrial Qualification — Listed as Industrial qualification and supplied in a 400‑LFBGA (17 × 17 mm) surface-mount package for compact system integration.
  • Operating Range and Compliance — Documented operating temperature range of 0 °C to 70 °C and RoHS compliance for environmental standards.

Typical Applications

  • Portable multimedia devices — Single‑core Cortex‑A8 processing with graphics acceleration and display controller for compact multimedia player and handheld UI designs.
  • Embedded display systems — LCD controller and pixel processing provide the building blocks for industrial HMIs and consumer display panels.
  • Connected devices — Integrated Ethernet and USB 2.0 with PHYs enable networked embedded products and peripheral connectivity.
  • Secure embedded platforms — Boot security, cryptography and Secure JTAG support secure boot and protected firmware update workflows.

Unique Advantages

  • Balanced compute and multimedia — Cortex‑A8 core plus NEON SIMD and graphics acceleration provides a compact solution for compute and visual processing without separate coprocessors.
  • Flexible memory support — Support for LPDDR, LPDDR2 and DDR2 memory types allows designers to select appropriate memory for performance and power targets.
  • Integrated connectivity — Built‑in Ethernet and dual USB 2.0 with PHYs reduce BOM and simplify board design for networked and peripheral‑rich products.
  • Security built in — On‑chip boot security, cryptography and Secure JTAG improve platform integrity and help protect firmware and debug access.
  • Compact, production-ready package — 400‑LFBGA (17 × 17 mm) surface‑mount package offers high pin density suitable for space-constrained embedded boards.
  • Documented platform — Supported by a detailed technical datasheet and package information for design and validation efforts.

Why Choose MCIMX503CVM8B?

The MCIMX503CVM8B positions itself as an integrated embedded application processor combining an ARM® Cortex®‑A8 core at 800 MHz with multimedia and graphics acceleration, diverse memory controller support, and multiple connectivity interfaces. Its security features and industrial qualification make it suitable for projects that require a mix of media handling, secure boot and networked peripheral support.

This part is well suited for engineers designing compact, display‑oriented embedded systems that need a single‑core processor with built‑in interfaces and documented package and electrical details to streamline development and production.

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