MCIMX502CVM8B

IC MPU I.MX50 800MHZ 400LFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX50 1 Core, 32-Bit 800MHz 400-LFBGA (17x17)

Quantity 1,373 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 502
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package400-LFBGA (17x17)
Display & Interface ControllersLCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 70°C (TA)Package / Case400-LFBGARAM ControllersLPDDR, LPDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Secure JTAG
Speed800MHzSupplier Device Package400-LFBGA (17×17)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX502CVM8B – IC MPU I.MX50 800MHZ 400LFBGA

The MCIMX502CVM8B is an NXP Semiconductors i.MX 502 series microprocessor based on a single ARM® Cortex®-A8 32-bit core running at 800 MHz. It is a highly integrated embedded applications processor that combines CPU performance, multimedia-friendly processing blocks and a compact 400‑LFBGA (17×17) package for space-constrained designs.

Designed for embedded and multimedia-focused applications, the device offers a balance of processing capability, display and I/O integration, and industrial qualification for reliable operation in commercial embedded products.

Key Features

  • Core — ARM® Cortex®-A8 single 32‑bit core at 800 MHz providing general-purpose processing for embedded applications.
  • Memory Controllers — Supports LPDDR, LPDDR2 and DDR2 memory types to match performance and power trade-offs in system designs.
  • Multimedia and DSP — Multimedia DSP and NEON™ SIMD support for accelerated signal and media processing tasks.
  • Graphics and Display — Graphics acceleration with LCD display controller and Pixel Processing Pipeline (ePXP) for responsive user interfaces and display handling.
  • Connectivity — Integrated 10/100 Mbps Ethernet (1) and dual USB 2.0 ports with PHY, plus a 1‑Wire interface for peripheral control and sensor connectivity.
  • Security — On-chip boot security, cryptography and Secure JTAG to support secure boot and secure debug workflows.
  • Package and Mounting — 400‑LFBGA package (17×17 mm) in a surface‑mount form factor for compact board designs.
  • Qualification and Compliance — Industrial qualification and RoHS compliance for commercial embedded deployments.
  • Operating Range — Specified operating temperature range: 0 °C to 70 °C suitable for many indoor and commercial embedded environments.

Typical Applications

  • Portable multimedia devices — Combines Cortex‑A8 processing, multimedia DSP and graphics acceleration to handle media playback and responsive interfaces.
  • Display-driven user interfaces — Integrated LCD controller and pixel processing support enable rich HMIs and control panels.
  • Networked embedded systems — On-chip 10/100 Ethernet and dual USB 2.0 with PHY simplify connectivity for industrial and commercial networked devices.
  • Secure embedded platforms — Boot Security, Cryptography and Secure JTAG provide hardware-level features useful for protected application deployment.

Unique Advantages

  • Integrated multimedia capabilities: Multimedia DSP, NEON SIMD and graphics acceleration reduce external processing requirements and simplify media pipeline design.
  • Flexible memory support: LPDDR/LPDDR2/DDR2 controller options allow tailoring memory choice to power, cost and performance goals.
  • Broad I/O integration: Ethernet, dual USB 2.0 with PHY and 1‑Wire support minimize the need for additional interface components.
  • Security-ready: Built-in boot security and cryptography accelerate development of secure firmware and device provisioning workflows.
  • Compact, production-ready package: 400‑LFBGA (17×17) surface-mount package balances pin count and PCB footprint for space-sensitive designs.
  • Industrial qualification and RoHS compliance: Supports deployment in commercial embedded systems with compliance to environmental requirements.

Why Choose MCIMX502CVM8B?

The MCIMX502CVM8B delivers a focused combination of single‑core ARM Cortex‑A8 performance, multimedia/DSP acceleration and integrated display and connectivity features within a compact 400‑LFBGA package. Its industrial qualification and on-chip security features make it suitable for embedded designs that require a balanced mix of processing, media handling, and secure operation.

This part is well suited to engineers designing compact, display- or media-centric embedded products that require integrated I/O and memory flexibility, while benefiting from NXP’s i.MX 502 series ecosystem and documentation for system bring‑up and development.

Request a quote or submit a product inquiry to receive pricing and availability information for the MCIMX502CVM8B.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up