MCIMX513CJM6C

IC MPU I.MX51 600MHZ 529BGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX51 1 Core, 32-Bit 600MHz 529-BGA (19x19)

Quantity 587 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 513
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-BGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 95°C (TC)Package / Case529-LFBGARAM ControllersLPDDR, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Speed600MHzSupplier Device Package529-BGA (19×19)USBUSB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX513CJM6C – IC MPU I.MX51 600MHz 529-BGA

The MCIMX513CJM6C is an NXP Semiconductors i.MX 513 series microprocessor built around a single ARM® Cortex®-A8 core running at 600 MHz. Designed for embedded and industrial applications, it combines a 32-bit core with multimedia coprocessor support and broad I/O to address connectivity, display and secure-boot use cases.

With LPDDR/DDR2 memory controller support, multiple USB interfaces, 10/100 Ethernet and a 529‑BGA package, this device targets compact, industrial-grade designs that require on-chip security features and extended temperature operation.

Key Features

  • Processor Core — ARM® Cortex®-A8 single core, 32-bit architecture at 600 MHz for embedded compute tasks.
  • Multimedia & SIMD — Integrated multimedia coprocessor support and NEON™ SIMD for optimized media and signal processing workloads.
  • Memory Interfaces — Built-in controllers for LPDDR and DDR2 memories for flexible system memory choices.
  • Display & HMI — Display interface controllers including LCD and keypad support for user interfaces.
  • Connectivity — 10/100 Mbps Ethernet (1) and multiple USB options: USB 2.0 (3) plus USB 2.0 with PHY (1) to support a range of peripheral and network connections.
  • Security — On-chip security features including ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory and Secure RTC to support secure boot and runtime protection.
  • Package & Mounting — 529-LFBGA / 529-BGA (19×19) surface-mount package suitable for compact board layouts.
  • Industrial Qualification & Temperature Range — Industrial-qualified device rated for operation from −40 °C to 95 °C.
  • Additional Interfaces — 1‑Wire support for low-pin-count peripherals and sensors.
  • Graphics — No dedicated graphics acceleration.
  • RoHS — Compliant with RoHS environmental requirements.

Typical Applications

  • Industrial Control — Leverage Ethernet, robust temperature range and industrial qualification for process control and measurement systems.
  • Human–Machine Interfaces — LCD and keypad interface support plus USB connectivity for operator panels and local control units.
  • Embedded Networking Appliances — Integrated 10/100 Mbps Ethernet and multiple USB ports enable networked embedded devices and gateways.

Unique Advantages

  • Integrated Security Suite: Comprehensive on-chip security features help simplify secure boot and runtime protection strategies.
  • Flexible Memory Support: LPDDR and DDR2 controllers enable designers to choose memory configurations that match performance and cost targets.
  • Multiple Connectivity Options: Combined USB and Ethernet interfaces reduce external bridge components and streamline system design.
  • Industrial-Grade Operation: Industrial qualification and an operating range of −40 °C to 95 °C support deployment in harsh environments.
  • Compact BGA Packaging: 529‑BGA (19×19) package enables high-density, surface-mount board designs for space-constrained applications.
  • NEON™ SIMD and Multimedia Support: On-chip multimedia coprocessor and NEON SIMD accelerate signal and media processing tasks without external accelerators.

Why Choose MCIMX513CJM6C?

The MCIMX513CJM6C positions itself as a robust, industrially qualified single-core Cortex‑A8 MPU for embedded systems that require a balance of compute performance, integrated security and broad I/O connectivity. Its support for LPDDR/DDR2 memory, multiple USB ports, Ethernet, and display interfaces makes it suitable for compact, connected embedded designs.

Backed by NXP Semiconductors and provided in a space-efficient 529‑BGA package, this part is well suited for developers and OEMs building industrial control, HMI and networked embedded appliances that demand long-term availability and on-chip security capabilities.

Request a quote or submit an inquiry to receive pricing, availability and technical support information for the MCIMX513CJM6C.

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