MCIMX513CJM6C
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX51 1 Core, 32-Bit 600MHz 529-BGA (19x19) |
|---|---|
| Quantity | 587 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 513 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-BGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 95°C (TC) | Package / Case | 529-LFBGA | RAM Controllers | LPDDR, DDR2 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | ||
| Speed | 600MHz | Supplier Device Package | 529-BGA (19×19) | USB | USB 2.0 (3), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.2V, 1.875V, 2.775V, 3.0V |
Overview of MCIMX513CJM6C – IC MPU I.MX51 600MHz 529-BGA
The MCIMX513CJM6C is an NXP Semiconductors i.MX 513 series microprocessor built around a single ARM® Cortex®-A8 core running at 600 MHz. Designed for embedded and industrial applications, it combines a 32-bit core with multimedia coprocessor support and broad I/O to address connectivity, display and secure-boot use cases.
With LPDDR/DDR2 memory controller support, multiple USB interfaces, 10/100 Ethernet and a 529‑BGA package, this device targets compact, industrial-grade designs that require on-chip security features and extended temperature operation.
Key Features
- Processor Core — ARM® Cortex®-A8 single core, 32-bit architecture at 600 MHz for embedded compute tasks.
- Multimedia & SIMD — Integrated multimedia coprocessor support and NEON™ SIMD for optimized media and signal processing workloads.
- Memory Interfaces — Built-in controllers for LPDDR and DDR2 memories for flexible system memory choices.
- Display & HMI — Display interface controllers including LCD and keypad support for user interfaces.
- Connectivity — 10/100 Mbps Ethernet (1) and multiple USB options: USB 2.0 (3) plus USB 2.0 with PHY (1) to support a range of peripheral and network connections.
- Security — On-chip security features including ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory and Secure RTC to support secure boot and runtime protection.
- Package & Mounting — 529-LFBGA / 529-BGA (19×19) surface-mount package suitable for compact board layouts.
- Industrial Qualification & Temperature Range — Industrial-qualified device rated for operation from −40 °C to 95 °C.
- Additional Interfaces — 1‑Wire support for low-pin-count peripherals and sensors.
- Graphics — No dedicated graphics acceleration.
- RoHS — Compliant with RoHS environmental requirements.
Typical Applications
- Industrial Control — Leverage Ethernet, robust temperature range and industrial qualification for process control and measurement systems.
- Human–Machine Interfaces — LCD and keypad interface support plus USB connectivity for operator panels and local control units.
- Embedded Networking Appliances — Integrated 10/100 Mbps Ethernet and multiple USB ports enable networked embedded devices and gateways.
Unique Advantages
- Integrated Security Suite: Comprehensive on-chip security features help simplify secure boot and runtime protection strategies.
- Flexible Memory Support: LPDDR and DDR2 controllers enable designers to choose memory configurations that match performance and cost targets.
- Multiple Connectivity Options: Combined USB and Ethernet interfaces reduce external bridge components and streamline system design.
- Industrial-Grade Operation: Industrial qualification and an operating range of −40 °C to 95 °C support deployment in harsh environments.
- Compact BGA Packaging: 529‑BGA (19×19) package enables high-density, surface-mount board designs for space-constrained applications.
- NEON™ SIMD and Multimedia Support: On-chip multimedia coprocessor and NEON SIMD accelerate signal and media processing tasks without external accelerators.
Why Choose MCIMX513CJM6C?
The MCIMX513CJM6C positions itself as a robust, industrially qualified single-core Cortex‑A8 MPU for embedded systems that require a balance of compute performance, integrated security and broad I/O connectivity. Its support for LPDDR/DDR2 memory, multiple USB ports, Ethernet, and display interfaces makes it suitable for compact, connected embedded designs.
Backed by NXP Semiconductors and provided in a space-efficient 529‑BGA package, this part is well suited for developers and OEMs building industrial control, HMI and networked embedded appliances that demand long-term availability and on-chip security capabilities.
Request a quote or submit an inquiry to receive pricing, availability and technical support information for the MCIMX513CJM6C.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016