MCIMX513DJM8C
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX51 1 Core, 32-Bit 800MHz 529-BGA (19x19) |
|---|---|
| Quantity | 637 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 513 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-BGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 85°C (TC) | Package / Case | 529-LFBGA | RAM Controllers | LPDDR, DDR2 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | ||
| Speed | 800MHz | Supplier Device Package | 529-BGA (19×19) | USB | USB 2.0 (3), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.2V, 1.875V, 2.775V, 3.0V |
Overview of MCIMX513DJM8C – IC MPU I.MX51 800MHZ 529BGA
The MCIMX513DJM8C is an NXP i.MX 513 series microprocessor IC featuring a single ARM® Cortex®-A8 core running at 800 MHz in a 529-ball LFBGA (19 × 19 mm) package. It targets embedded and consumer applications that require a 32-bit application processor with integrated memory controllers, multiple I/O interfaces and hardware security capabilities.
With LPDDR and DDR2 memory controller support, multiple USB ports, 10/100 Ethernet and display/keypad controllers, this device is suited for connected embedded designs that need balanced compute performance and system integration.
Key Features
- Core ARM® Cortex®-A8 32‑bit single core running at 800 MHz, providing general-purpose application processing for embedded systems.
- Multimedia/Acceleration Includes NEON™ SIMD multimedia co-processor capabilities to accelerate signal and media processing tasks.
- Memory Interfaces Integrated LPDDR and DDR2 memory controllers to support common embedded memory configurations.
- Display and User I/O Built-in LCD and keypad display interface controllers for simple human‑machine interfaces and control panels.
- Connectivity Wired networking and USB: one 10/100 Mbps Ethernet interface and multiple USB 2.0 interfaces (three USB 2.0 ports plus one USB 2.0 with integrated PHY).
- Security Comprehensive security feature set including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC to support protected boot and runtime operation.
- Additional Peripherals Includes a 1‑Wire interface for simple sensor or peripheral connectivity.
- Package & Mounting 529‑LFBGA (529‑BGA 19×19) surface‑mount package suitable for space‑constrained embedded boards.
- Operating Range Consumer‑grade operating temperature range of −20 °C to 85 °C and RoHS compliant.
Typical Applications
- Embedded Control Industrial and consumer embedded controllers that need a single 800 MHz application processor with Ethernet and multiple USB connections.
- Human‑Machine Interfaces (HMI) Devices with LCD and keypad interfaces that require local application processing and secure boot capabilities.
- Connected Devices Networked appliances and instruments leveraging 10/100 Ethernet and USB ports for connectivity and peripheral expansion.
- Secure Embedded Systems Applications that require on‑chip security features for protected boot, secure storage and cryptographic operations.
Unique Advantages
- Integrated system connectivity: Multiple USB ports and a 10/100 Ethernet interface reduce external controller requirements and simplify board design.
- Memory flexibility: Native LPDDR and DDR2 controller support enables designers to choose memory options that match performance and cost targets.
- Hardware security suite: On‑chip TrustZone, secure JTAG and cryptographic features support secure boot and runtime protection without extensive external security components.
- Compact BGA package: 529‑ball LFBGA (19×19) packaging provides a high pin count in a compact footprint for space‑constrained embedded systems.
- Multimedia acceleration: NEON™ SIMD co-processor accelerates media and signal processing workloads while offloading the main CPU.
- RoHS compliant consumer qualification: The device meets RoHS requirements and is supplied with consumer qualification for compatible product lines.
Why Choose MCIMX513DJM8C?
The MCIMX513DJM8C combines a proven ARM® Cortex®-A8 architecture at 800 MHz with integrated memory controllers, extensive I/O and a broad security feature set to address embedded and consumer designs requiring a compact, connected application processor. Its package and interface mix make it suitable for designs that need Ethernet, multiple USB ports and simple display/keypad support while maintaining secure boot and protected operation.
This part is ideal for engineers and product teams building connected consumer and embedded products that value system integration, hardware security and flexible memory support in a compact surface‑mount package. RoHS compliance and a consumer qualification profile support mainstream product development and supply continuity.
Request a quote or submit a procurement inquiry to get pricing and availability details for MCIMX513DJM8C.

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