MCIMX514AJM6CR2

IC MPU I.MX51 600MHZ 529BGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX51 1 Core, 32-Bit 600MHz 529-BGA (19x19)

Quantity 1,100 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 514
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-BGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-LFBGARAM ControllersLPDDR, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Speed600MHzSupplier Device Package529-BGA (19×19)USBUSB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX514AJM6CR2 – IC MPU I.MX51 600MHZ 529BGA

The MCIMX514AJM6CR2 is an ARM® Cortex®-A8 based microprocessor operating at 600 MHz in a 529-ball LFBGA (19 × 19 mm) package. Designed for embedded multimedia and HMI applications, it provides a single 32-bit core with integrated multimedia acceleration and a broad set of I/O to support displays, storage, networking and peripheral connectivity.

With industrial qualification and an extended operating temperature range, this device targets designs that require performance, functional integration and robust operation across demanding environments.

Key Features

  • Core – ARM® Cortex®-A8 single 32-bit core running at 600 MHz for general-purpose and multimedia processing.
  • Multimedia and DSP – Integrated multimedia co-processors and NEON™ SIMD acceleration for compute-intensive media and signal-processing tasks.
  • Memory Controllers – Support for LPDDR and DDR2 memory interfaces to accommodate a range of system memory designs.
  • Display and Graphics – Display interface controllers including LCD and keypad support, plus graphics acceleration for rendering and UI workloads.
  • Connectivity – Single 10/100 Mbps Ethernet port and multiple USB 2.0 interfaces (USB 2.0 (3) and USB 2.0 + PHY (1)) for networking and peripheral attachment.
  • Storage and Peripheral Interfaces – Wide peripheral support including 1-Wire and multiple serial interfaces documented in the device datasheet.
  • Security – Hardware security features including ARM TrustZone, boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC.
  • Package and Mounting – 529-LFBGA package in a 19 × 19 mm footprint with surface-mount assembly.
  • Industrial Qualification and Temperature – Qualification: Industrial; operating temperature range −40 °C to 125 °C for deployment in harsh environments.

Typical Applications

  • HMI and Navigation Systems – Graphics acceleration and display controllers support responsive human-machine interfaces and navigation displays.
  • Multimedia Devices – NEON™ SIMD and multimedia co-processors enable video and audio processing tasks in embedded multimedia players and streaming devices.
  • Speech and Audio Processing – On-chip multimedia DSP capabilities support high-performance speech recognition and audio applications with large data sets.
  • Embedded Networking and Peripherals – Integrated Ethernet and multiple USB 2.0 ports provide connectivity for networked embedded systems and USB peripherals.

Unique Advantages

  • Single-chip multimedia capability: Combines an ARM® Cortex®-A8 core with multimedia co-processors and NEON™ SIMD to reduce external processing requirements.
  • Broad peripheral integration: Multiple USB ports, Ethernet, display controllers and peripheral interfaces reduce BOM complexity and simplify board design.
  • Industrial-grade operation: Specified for −40 °C to 125 °C and industrial qualification to support deployments in challenging environments.
  • Comprehensive security: Built-in TrustZone, secure boot and cryptographic features protect system integrity from boot through runtime.
  • Memory flexibility: LPDDR and DDR2 controller support lets designers choose memory types to match performance and power targets.
  • Compact BGA package: 529-ball LFBGA (19 × 19 mm) provides a high-density footprint suitable for space-constrained embedded designs.

Why Choose MCIMX514AJM6CR2?

MCIMX514AJM6CR2 positions itself as an integrated solution for embedded systems that require multimedia processing, secure boot and wide I/O integration in an industrial-rated package. Its ARM® Cortex®-A8 core at 600 MHz, combined with NEON™ SIMD and dedicated multimedia blocks, delivers the processing capability needed for HMI, multimedia and audio processing tasks while minimizing additional external components.

This device is well suited to designers building industrial and embedded multimedia platforms that need a balance of compute performance, security features and broad peripheral support within a compact BGA footprint.

Request a quote or submit an inquiry for MCIMX514AJM6CR2 to receive pricing and availability information tailored to your project requirements.

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