MCIMX515DJM8C
| Part Description |
ARM® Cortex®-A8 Microprocessor IC - 1 Core, 32-Bit 800MHz 529-BGA Case 2017 (19x19) |
|---|---|
| Quantity | 926 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 515 |
| Manufacturer | NXP Semiconductors |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-BGA Case 2017 (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | 5A992 | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 85°C (TC) | Package / Case | 529-LFBGA | RAM Controllers | DDR2, LPDDR2 | ||
| REACH Compliance | REACH not applicable | RoHS Compliance | RoHS non-compliant | Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | ||
| Speed | 800MHz | Supplier Device Package | 529-BGA Case 2017 (19×19) | USB | USB 2.0 (3), USB 2.0 + PHY (1) | ||
| Voltage – I/O | 1.2V, 1.875V, 2.775V, 3V |
Overview of MCIMX515DJM8C – IC MPU 800MHZ 529BGA
The MCIMX515DJM8C is an embedded microprocessor from NXP Semiconductors' i.MX 515 series. It integrates a single ARM® Cortex®-A8 32-bit core running at 800 MHz with multimedia acceleration and NEON™ SIMD support for compute and media tasks.
Designed for embedded and consumer applications, the device combines connectivity (USB, Ethernet), display I/O (LCD, keypad), memory controller support, and an extensive security feature set to deliver a compact, integrated processing solution in a 529-LFBGA surface-mount package.
Key Features
- Core ARM® Cortex®-A8 single core, 32-bit architecture operating at 800 MHz for general-purpose and multimedia processing.
- Multimedia & DSP Integrated multimedia co-processor with NEON™ SIMD support for accelerated media and signal processing.
- Memory Controllers Supports DDR2 and LPDDR2 memory interfaces to match common embedded DRAM choices.
- Display Interfaces Built-in controllers for LCD and keypad interfaces to support user interface implementations.
- Connectivity Includes one 10/100 Mbps Ethernet interface and multiple USB 2.0 ports (three USB 2.0 ports plus one USB 2.0 with PHY).
- Additional I/O Provides a 1-Wire interface for simple single-pin peripheral communication.
- Security Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, and secure RTC.
- Package & Mounting 529-LFBGA / 529-BGA (2017, 19×19) surface-mount package for compact board-level integration.
- Operating Range Qualified for consumer applications with an operating temperature range of -20 °C to 85 °C.
- Compliance RoHS compliant.
Typical Applications
- Consumer Embedded Devices — Compact processing and multimedia support for consumer electronics requiring integrated connectivity and security.
- Human-Machine Interfaces (HMIs) — LCD and keypad controllers plus graphics acceleration enable responsive user interfaces.
- Multimedia Appliances — NEON™ SIMD and multimedia co-processor capabilities support media processing tasks in embedded appliances.
Unique Advantages
- Integrated Multimedia Acceleration: NEON™ SIMD and multimedia co-processor reduce external processing requirements for media workloads.
- Comprehensive Connectivity: Multiple USB 2.0 ports and a 10/100 Mbps Ethernet interface provide flexible I/O options for device networking and peripherals.
- Security Feature Set: On-chip ARM TZ, secure boot, cryptography, and secure JTAG/fusebox options help implement secure embedded designs.
- Flexible Memory Support: DDR2 and LPDDR2 controller support accommodates a range of memory choices for performance and cost trade-offs.
- Compact Surface-Mount Package: 529-LFBGA (19×19) package enables dense board layouts while supporting thermal and mechanical requirements for consumer products.
- Consumer Temperature Range: Rated for -20 °C to 85 °C to meet typical consumer product environments.
Why Choose MCIMX515DJM8C?
The MCIMX515DJM8C positions itself as a compact, integrated microprocessor for embedded and consumer applications that need a balance of CPU performance, multimedia capability, connectivity, and device-level security. Its ARM® Cortex®-A8 core at 800 MHz, combined with NEON™ SIMD and multimedia acceleration, supports a range of UI and media tasks while reducing external component count.
As part of the i.MX 515 series from NXP Semiconductors, this device is suited for designers seeking a single-chip solution with multiple USB ports, Ethernet, display interfaces, and robust security primitives in a 529-LFBGA surface-mount package. Its RoHS compliance and consumer temperature rating support reliable deployment in consumer embedded products.
Request a quote or submit a parts inquiry to receive pricing and availability for the MCIMX515DJM8C for your next embedded design.

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