MCIMX516AJM6CR2

IC MPU I.MX51 600MHZ 529BGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX51 1 Core, 32-Bit 600MHz 529-BGA (19x19)

Quantity 564 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 516
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time0 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-BGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-LFBGARAM ControllersLPDDR, DDR2
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Speed600MHzSupplier Device Package529-BGA (19×19)USBUSB 2.0 (3), USB 2.0 + PHY (1)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX516AJM6CR2 – IC MPU I.MX51 600MHZ 529BGA

The MCIMX516AJM6CR2 is a single-core ARM® Cortex®-A8 microprocessor from NXP Semiconductors’ i.MX 516 series, running at 600 MHz in a 529-ball LFBGA package. It is a multimedia-focused application processor with integrated graphics acceleration and a rich set of I/O and security capabilities.

Designed for embedded systems requiring efficient single-core processing and media handling, the device targets multimedia and infotainment-style applications that need display interfaces, video processing, and secure boot and cryptography features while meeting industrial temperature requirements.

Key Features

  • Core — ARM® Cortex®-A8 single 32-bit core operating at 600 MHz.
  • Multimedia Acceleration — On-chip graphics acceleration, NEON™ SIMD and multimedia co-processor support for video and audio processing, including 720p video processing capabilities described in the series documentation.
  • Memory Interfaces — Supports LPDDR and DDR2 memory controllers for flexible memory subsystem design.
  • Display and HMI — Integrated display interface controllers (LCD and keypad) and dual-display/video features referenced in the product series documentation.
  • Connectivity — Multiple USB 2.0 ports (three USB 2.0 and one USB 2.0 + PHY) and a single 10/100 Mbps Ethernet controller.
  • Security — Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC.
  • Additional Interfaces — Includes 1-Wire interface and a broad set of I/O configured via IOMUX (per series documentation).
  • Package and Mounting — 529-LFBGA / 529-BGA package, 19 × 19 mm with 0.8 mm pitch; surface-mount device.
  • Operating Range — Industrial temperature qualification with an operating range of −40 °C to 125 °C.
  • Compliance — RoHS-compliant.
  • Power Management — Series documentation describes Smart Speed power-management features to optimize power across active and low-power modes.

Typical Applications

  • Infotainment and HMI — Multimedia-focused processing and display interfaces for human-machine interfaces and infotainment-style systems.
  • Video and Graphics Systems — 720p-capable video processing and on-chip graphics acceleration for rendering and display tasks.
  • Speech and Audio Processing — NEON SIMD and multimedia coprocessor support for high-performance speech processing and audio playback.
  • Embedded Networking Devices — Integrated 10/100 Mbps Ethernet and multiple USB ports for connected embedded applications.

Unique Advantages

  • Integrated Multimedia Subsystem: Graphics acceleration, NEON SIMD and on-chip video processing combine to reduce external component needs for media-rich designs.
  • Flexible Memory Support: LPDDR and DDR2 controller support enables adaptation to a range of memory architectures and cost/performance targets.
  • Comprehensive Security Suite: TrustZone, boot security, secure JTAG and cryptography features support secured boot and protected runtime operation.
  • Industrial Temperature Qualification: −40 °C to 125 °C operating range supports deployment in demanding environmental conditions.
  • Rich I/O Integration: Multiple USB ports, Ethernet, display controllers and 1-Wire simplify board-level design and reduce BOM complexity.
  • Documented Power Management: Smart Speed power-management features in the series documentation help optimize power across active and low-power modes.

Why Choose MCIMX516AJM6CR2?

The MCIMX516AJM6CR2 combines a 600 MHz ARM Cortex-A8 core with integrated multimedia acceleration, broad connectivity and an extensive security feature set to address embedded designs that require media handling, display control and secure operation. Its support for LPDDR/DDR2 memory and industrial temperature rating make it well suited for robust, multimedia-focused embedded systems.

Backed by NXP Semiconductors’ i.MX51-series documentation, the MCIMX516AJM6CR2 offers a compact 529-ball LFBGA package and a feature set aimed at reducing system complexity while enabling secure, high‑performance embedded applications.

Request a quote or contact sales to discuss pricing, lead times and integration support for the MCIMX516AJM6CR2.

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