MCIMX534AVP8C2R2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 681 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 534
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersDDR2, DDR3, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX534AVP8C2R2 – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX534AVP8C2R2 from NXP Semiconductors is an industrially qualified ARM® Cortex®-A8 microprocessor operating at up to 800 MHz in a 529‑FBGA (19 × 19 mm) package. This single‑core, 32‑bit applications processor integrates multimedia acceleration, rich security features, and a broad set of peripheral controllers targeted at embedded and industrial systems.

Designed for embedded applications that require sustained performance, secure boot and storage interfaces, and wide operating temperatures, the i.MX53 family delivers a balance of integration and system-level I/O to simplify designs for human‑machine interfaces, communication gateways, and multimedia-enabled products.

Key Features

  • Core and Performance ARM® Cortex®‑A8 single core at 800 MHz providing a 32‑bit application processor foundation with NEON™ SIMD and multimedia DSP capabilities for accelerated media processing.
  • Memory Support Integrated memory controllers for DDR2, DDR3 and LPDDR2; datasheet references support for DDR2/LVDDR2‑800, LPDDR2‑800 and DDR3‑800, enabling flexible DRAM choices.
  • Graphics and Multimedia Graphics acceleration and multimedia co‑processors (NEON™ SIMD) support user interfaces, video and imaging workflows; display controllers include LCD and keypad interfaces.
  • Interfaces and Connectivity Comprehensive I/O including 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1) for storage, multiple USB 2.0 ports (including OTG + PHY and dedicated PHY options), and a 1‑Wire interface for simple peripheral connections.
  • Security and Boot Robust security feature set including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection to support protected system designs.
  • Power Management Architecture and datasheet reference to dynamic voltage and frequency scaling (DVFS) for power reduction and scalable performance across operating points.
  • Package, Mounting and Thermal 529‑FBGA surface‑mount package (19 × 19 mm, 0.8 mm pitch) rated for industrial operation with an operating temperature range of −40 °C to 125 °C and RoHS compliance.

Typical Applications

  • Industrial Control and Automation – Embedded controllers and HMI systems leveraging the wide temperature range and industrial qualification for reliable operation in harsh environments.
  • Storage and Networked Devices – Gateways and appliances that combine 10/100 Mbps Ethernet and SATA 1.5 Gbps storage connectivity with USB host and OTG options.
  • Multimedia and Imaging Systems – Camera interfaces, video processing and display‑driven products that benefit from graphics acceleration and multimedia co‑processors.
  • Portable and Handheld Equipment – Battery‑sensitive applications that can use DVFS and integrated memory options to balance performance and power consumption.

Unique Advantages

  • Highly integrated I/O Multiple high-speed and peripheral interfaces (Ethernet, SATA, multiple USB ports, LCD and keypad controllers, 1‑Wire) reduce external components and simplify system design.
  • Security‑focused platform Built‑in TrustZone, boot security, cryptography and tamper detection enable secure device provisioning and runtime protection for connected systems.
  • Industrial temperature range −40 °C to 125 °C qualification supports deployment in industrial and outdoor equipment without additional thermal derating.
  • Flexible memory choices Support for DDR2, LPDDR2 and DDR3 memory technologies offers designers options to optimize cost, performance and power for target applications.
  • Compact BGA package 529‑FBGA (19 × 19 mm) footprint delivers a high pin‑count solution in a compact surface‑mount form factor suitable for space‑constrained designs.

Why Choose MCIMX534AVP8C2R2?

The MCIMX534AVP8C2R2 balances embedded performance, system integration and industrial robustness. With an 800 MHz ARM Cortex‑A8 core, multimedia acceleration, broad memory support and a comprehensive set of I/O and security features, it is positioned for designs that require a compact, secure and connected application processor.

Engineers designing industrial controllers, HMI, storage‑enabled appliances or multimedia products will find this device useful for reducing BOM complexity while meeting temperature and security requirements. Backed by NXP documentation and industrial qualification, the part supports long‑term deployment in production systems.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the MCIMX534AVP8C2R2. Our team will provide the details you need to evaluate this processor for your embedded design.

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