MCIMX534AVV8C2R2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 62 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 534
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX534AVV8C2R2 – ARM Cortex-A8 800 MHz Microprocessor, 529-FBGA

The MCIMX534AVV8C2R2 is an ARM® Cortex®-A8 based microprocessor running up to 800 MHz in a 529-ball FBGA package (19 × 19 mm). It delivers an integrated multimedia-capable architecture with on-chip graphics acceleration and a rich set of interfaces for display, storage and peripheral connectivity.

This device is tailored for high-performance embedded multimedia, infotainment, telematics, HMI and display-focused systems that require processing efficiency, flexible memory support and extensive I/O integration.

Key Features

  • Core & Performance Single ARM® Cortex®-A8 core, 32-bit, operating at up to 800 MHz for general-purpose application processing.
  • Memory Support Integrated controllers supporting LPDDR2, DDR2 and DDR3 memory types for flexible system memory configurations.
  • Multimedia & Graphics On-chip 2D/3D graphics acceleration and multimedia DSP capabilities including NEON™ SIMD for enhanced media processing.
  • Display & Input Display interface controllers supporting LCD panels and keypad inputs for HMI and visual display applications.
  • Storage & Networking Integrated SATA 1.5 Gbps controller and a single 10/100 Mbps Ethernet MAC for storage and network connectivity.
  • USB Connectivity Multiple USB 2.0 interfaces (including USB 2.0 + PHY) to simplify host and peripheral integration.
  • Peripheral Interfaces Additional interfaces including 1-Wire for simple sensor and peripheral connectivity.
  • Security & Boot Hardware security features including ARM TrustZone, boot security, cryptography, secure fusebox, secure JTAG, secure memory and secure RTC, plus tamper detection.
  • Power & System Integrated system modules described in the datasheet including LDO voltage regulator parameters and detailed power sequencing/boot configuration.
  • Package & Temperature 529-FBGA (19 × 19 mm) surface-mount package; operating temperature range −40 °C to 125 °C.
  • Compliance RoHS compliant.

Typical Applications

  • Infotainment & Multimedia Systems — Processing and playback of audio/video content, UI rendering and media handling for integrated entertainment systems.
  • Human-Machine Interfaces (HMI) — Driving LCD displays and key input handling for interactive control panels and operator displays.
  • Telematics & Navigation — Enabling navigation and telematics applications that require map rendering, route computation and multimedia integration.
  • Speech & Audio Processing — High-performance speech recognition and audio playback tasks leveraging NEON™ SIMD and multimedia DSP capabilities.
  • Video Processing & Dual Displays — 1080i/p capable video processing and support for dual displays for advanced visual systems.

Unique Advantages

  • Highly integrated multimedia platform: Graphics acceleration plus NEON™ SIMD and multimedia DSP support reduce the need for external accelerators.
  • Flexible memory options: Support for LPDDR2, DDR2 and DDR3 gives designers choice in performance, cost and power trade-offs.
  • Comprehensive I/O set: Built-in SATA, Ethernet, multiple USB ports and display controllers simplify board-level integration and reduce BOM complexity.
  • Robust security primitives: On-chip TrustZone, cryptography and secure boot features enable protected boot and secure data handling.
  • Industrial temperature capability: −40 °C to 125 °C operating range supports deployment in thermally demanding environments.
  • Manufacturer documentation: Detailed datasheet and package information provide the necessary design and power-sequencing details for system integration.

Why Choose MCIMX534AVV8C2R2?

The MCIMX534AVV8C2R2 positions itself as a compact, integrated processing solution for designers requiring a single Cortex‑A8 core with strong multimedia and interface integration. Its combination of graphics acceleration, flexible memory support and extensive I/O makes it well suited to infotainment, HMI, telematics and display-centric embedded systems.

Designed and documented by NXP Semiconductors, this device provides the technical detail needed for system design, including power sequencing, package assignments and module timing—supporting long-term design stability and predictable system integration.

Request a quote or submit a procurement request to obtain pricing, availability and ordering information for the MCIMX534AVV8C2R2. Provide your requirements to start the quoting process.

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