MCIMX535DVP1C2
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1GHz 529-FBGA (19x19) |
|---|---|
| Quantity | 1,286 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 535 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-FBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | N/A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 85°C (TC) | Package / Case | 529-FBGA | RAM Controllers | LPDDR2, DDR2, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 1.5Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1GHz | Supplier Device Package | 529-FBGA (19×19) | ||
| USB | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.3V, 1.8V, 2.775V, 3.3V |
Overview of MCIMX535DVP1C2 – IC MPU I.MX53 1GHz 529-FBGA
The MCIMX535DVP1C2 is a single-core ARM® Cortex®-A8 microprocessor from the i.MX 535 series by NXP Semiconductors, specified at 1 GHz and delivered in a 529-FBGA (19 × 19 mm) surface-mount package. Designed for embedded applications, it targets portable and industrial-class systems that require balanced compute performance, extensive peripheral integration, and hardware-based security.
With a broad set of on-chip interfaces and memory controller options, this device is positioned for multimedia-enabled embedded designs, networking and storage endpoints, and systems that require secure boot and runtime protections.
Key Features
- Core ARM® Cortex®-A8 single-core, 32-bit processor operating at 1 GHz for responsive application performance.
- Multimedia Acceleration Built-in multimedia DSP capabilities and NEON™ SIMD support to accelerate audio, video and signal-processing workloads.
- Memory Support Integrated controllers supporting LPDDR2, DDR2 and DDR3 external memories to match system performance and cost targets.
- Display and UI On-chip display interface controllers including LCD and keypad support for rich user-interface implementations.
- Connectivity Integrated 10/100 Mbps Ethernet (1) and multiple USB options: two USB 2.0 ports, one USB 2.0 + PHY, and one USB 2.0 OTG + PHY for flexible peripheral connectivity.
- Storage Interfaces SATA 1.5 Gbps (1) provides direct connection for storage devices and host applications.
- Security Comprehensive hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection for enhanced device integrity.
- Additional I/O 1-Wire interface and other peripheral connections for sensors and simple control devices.
- Package & Mounting 529-FBGA supplier device package (19 × 19 mm) with surface-mount design; package details reference a 19 × 19 mm 0.8 mm pitch FBGA.
- Operating Range & Compliance Consumer-grade qualification and an operating temperature range of −20 °C to 85 °C. RoHS compliant.
Typical Applications
- Portable Multimedia Devices Single-core Cortex‑A8 performance and NEON acceleration support audio/video decode and responsive UIs in portable systems.
- Industrial Embedded Systems Robust connectivity and security features make this device suitable for industrial control and monitoring applications.
- Imaging and Camera Systems On-chip multimedia support and multiple peripheral interfaces enable camera sensor integration and image processing pipelines.
- Networking and Storage Endpoints Integrated Ethernet and SATA support provide direct connectivity for networked and storage-enabled embedded products.
Unique Advantages
- Highly integrated I/O: A broad set of on-chip interfaces (Ethernet, multiple USB variants, SATA, display controllers, 1-Wire) reduces external component count and simplifies board design.
- Flexible memory options: Support for LPDDR2, DDR2 and DDR3 allows designers to optimize for cost, power and performance across target products.
- Hardware security stack: Built-in TrustZone, secure boot and related cryptographic features provide layered device protection for sensitive applications.
- Multimedia acceleration: NEON SIMD and multimedia DSP capabilities accelerate media processing without offloading to external processors.
- Compact package: 529-FBGA (19 × 19 mm) packaging enables a compact board footprint while supporting a high-pin-count feature set.
- Consumer-grade temperature and compliance: −20 °C to 85 °C operating range and RoHS compliance align with consumer and many embedded product requirements.
Why Choose MCIMX535DVP1C2?
The MCIMX535DVP1C2 combines a 1 GHz ARM® Cortex®-A8 core with an extensive peripheral set, flexible memory interfaces and a comprehensive hardware security feature set, making it well suited for embedded designs that require balanced compute, multimedia capability and secure operation. Its FBGA packaging and integrated interfaces help streamline BOM and board complexity for compact, connected products.
This device is ideal for engineers building portable multimedia systems, industrial embedded applications, imaging solutions, and networked storage endpoints that need a single-core Cortex‑A8 platform with hardware security and broad I/O support.
Request a quote or submit a purchase inquiry for MCIMX535DVP1C2 to get pricing and availability information tailored to your project requirements.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
Employees: 38,000+
Revenue: $10.53 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016