MCIMX535DVP1C2

IC MPU I.MX53 1GHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1GHz 529-FBGA (19x19)

Quantity 1,286 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 535
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 85°C (TC)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1GHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX535DVP1C2 – IC MPU I.MX53 1GHz 529-FBGA

The MCIMX535DVP1C2 is a single-core ARM® Cortex®-A8 microprocessor from the i.MX 535 series by NXP Semiconductors, specified at 1 GHz and delivered in a 529-FBGA (19 × 19 mm) surface-mount package. Designed for embedded applications, it targets portable and industrial-class systems that require balanced compute performance, extensive peripheral integration, and hardware-based security.

With a broad set of on-chip interfaces and memory controller options, this device is positioned for multimedia-enabled embedded designs, networking and storage endpoints, and systems that require secure boot and runtime protections.

Key Features

  • Core  ARM® Cortex®-A8 single-core, 32-bit processor operating at 1 GHz for responsive application performance.
  • Multimedia Acceleration  Built-in multimedia DSP capabilities and NEON™ SIMD support to accelerate audio, video and signal-processing workloads.
  • Memory Support  Integrated controllers supporting LPDDR2, DDR2 and DDR3 external memories to match system performance and cost targets.
  • Display and UI  On-chip display interface controllers including LCD and keypad support for rich user-interface implementations.
  • Connectivity  Integrated 10/100 Mbps Ethernet (1) and multiple USB options: two USB 2.0 ports, one USB 2.0 + PHY, and one USB 2.0 OTG + PHY for flexible peripheral connectivity.
  • Storage Interfaces  SATA 1.5 Gbps (1) provides direct connection for storage devices and host applications.
  • Security  Comprehensive hardware security features including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory and tamper detection for enhanced device integrity.
  • Additional I/O  1-Wire interface and other peripheral connections for sensors and simple control devices.
  • Package & Mounting  529-FBGA supplier device package (19 × 19 mm) with surface-mount design; package details reference a 19 × 19 mm 0.8 mm pitch FBGA.
  • Operating Range & Compliance  Consumer-grade qualification and an operating temperature range of −20 °C to 85 °C. RoHS compliant.

Typical Applications

  • Portable Multimedia Devices  Single-core Cortex‑A8 performance and NEON acceleration support audio/video decode and responsive UIs in portable systems.
  • Industrial Embedded Systems  Robust connectivity and security features make this device suitable for industrial control and monitoring applications.
  • Imaging and Camera Systems  On-chip multimedia support and multiple peripheral interfaces enable camera sensor integration and image processing pipelines.
  • Networking and Storage Endpoints  Integrated Ethernet and SATA support provide direct connectivity for networked and storage-enabled embedded products.

Unique Advantages

  • Highly integrated I/O: A broad set of on-chip interfaces (Ethernet, multiple USB variants, SATA, display controllers, 1-Wire) reduces external component count and simplifies board design.
  • Flexible memory options: Support for LPDDR2, DDR2 and DDR3 allows designers to optimize for cost, power and performance across target products.
  • Hardware security stack: Built-in TrustZone, secure boot and related cryptographic features provide layered device protection for sensitive applications.
  • Multimedia acceleration: NEON SIMD and multimedia DSP capabilities accelerate media processing without offloading to external processors.
  • Compact package: 529-FBGA (19 × 19 mm) packaging enables a compact board footprint while supporting a high-pin-count feature set.
  • Consumer-grade temperature and compliance: −20 °C to 85 °C operating range and RoHS compliance align with consumer and many embedded product requirements.

Why Choose MCIMX535DVP1C2?

The MCIMX535DVP1C2 combines a 1 GHz ARM® Cortex®-A8 core with an extensive peripheral set, flexible memory interfaces and a comprehensive hardware security feature set, making it well suited for embedded designs that require balanced compute, multimedia capability and secure operation. Its FBGA packaging and integrated interfaces help streamline BOM and board complexity for compact, connected products.

This device is ideal for engineers building portable multimedia systems, industrial embedded applications, imaging solutions, and networked storage endpoints that need a single-core Cortex‑A8 platform with hardware security and broad I/O support.

Request a quote or submit a purchase inquiry for MCIMX535DVP1C2 to get pricing and availability information tailored to your project requirements.

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