MCIMX535DVP1C2R2
| Part Description |
ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1GHz 529-FBGA (19x19) |
|---|---|
| Quantity | 744 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | i.MX 535 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 15 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 529-FBGA (19x19) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keypad, LCD | ECCN | N/A | Ethernet | 10/100Mbps (1) | ||
| Graphics Acceleration | Yes | HTS Code | N/A | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | -20°C ~ 85°C (TC) | Package / Case | 529-FBGA | RAM Controllers | LPDDR2, DDR2, DDR3 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | SATA | SATA 1.5Gbps (1) | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection | Speed | 1GHz | Supplier Device Package | 529-FBGA (19×19) | ||
| USB | USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1) | Voltage – I/O | 1.3V, 1.8V, 2.775V, 3.3V |
Overview of MCIMX535DVP1C2R2 – ARM Cortex-A8 1 GHz MPU in 529-FBGA
The MCIMX535DVP1C2R2 is an NXP Semiconductors i.MX 535 series microprocessor featuring a single ARM® Cortex®-A8 core running at 1 GHz in a 529-FBGA (19 × 19 mm, 0.8 mm pitch) package. It combines a 32-bit application core with multimedia acceleration and a broad set of peripheral interfaces to address embedded and consumer systems.
This device targets embedded markets that require balanced compute performance, integrated connectivity and storage interfaces, and on-chip security — suitable for portable and industrial embedded applications that need multimedia, display, and storage support within a compact surface-mount package.
Key Features
- Core — Single ARM® Cortex®-A8 32-bit core at 1 GHz for application-level processing.
- Multimedia & SIMD — Integrated multimedia co-processor and NEON™ SIMD acceleration to assist media and signal processing tasks.
- Memory support — Controllers for LPDDR2, DDR2 and DDR3 external memories to fit a range of system memory designs.
- Display and UI — Display interface controllers for LCD and keypad drivers to support human-machine interfaces.
- Connectivity & Storage — On-chip interfaces include 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1) and multiple USB 2.0 ports (2x USB 2.0, plus USB 2.0 with PHY and USB 2.0 OTG with PHY) for networking, peripherals and storage.
- Security — Hardware security features including ARM TrustZone (ARM TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
- System features — Graphics acceleration is available to offload GUI/graphics tasks; additional interfaces include 1-Wire for simple peripheral connectivity.
- Power management — Supports dynamic voltage and frequency scaling (DVFS) as documented in the i.MX53 series datasheet to optimize power versus performance.
- Package & mounting — 529-FBGA surface-mount package; package dimensions 19 × 19 mm with 0.8 mm pitch.
- Operating range — Rated for an operating temperature range of −20 °C to 85 °C.
- Compliance — RoHS compliant.
Typical Applications
- Portable multimedia devices — Single-core Cortex-A8 processing with multimedia acceleration and USB/SATA support enables media playback and storage in consumer portable systems.
- Human–machine interfaces (HMIs) — LCD and keypad controllers plus graphics acceleration make the device suitable for graphical user interfaces in embedded control panels.
- Imaging and sensor gateways — Multimedia co-processing and interfacing options enable integration with camera sensors and local processing for imaging applications.
- Networked embedded systems — Integrated 10/100 Ethernet and multiple USB ports support network connectivity and peripheral expansion for industrial and consumer embedded products.
Unique Advantages
- Balanced compute and multimedia: A 1 GHz ARM® Cortex®-A8 core combined with NEON™ SIMD and multimedia coprocessing provides capable application and media handling without a large multi-core footprint.
- Flexible memory options: Support for LPDDR2, DDR2 and DDR3 memory controllers allows designers to choose memory types that match performance and cost targets.
- Integrated connectivity and storage: On-chip Ethernet, SATA and multiple USB interfaces reduce external controller requirements and simplify board-level design.
- Comprehensive security: Built-in security blocks — including TrustZone, secure boot and secure JTAG — help protect boot and runtime assets in embedded systems.
- Compact package: 529-FBGA (19 × 19 mm, 0.8 mm pitch) surface-mount packaging delivers a high-density solution for space-constrained designs.
- Documented power management: DVFS capability documented in the series datasheet enables designers to tune power versus performance for battery-operated or thermally constrained products.
Why Choose MCIMX535DVP1C2R2?
The MCIMX535DVP1C2R2 positions itself as a compact, feature-rich embedded processor that balances application performance, multimedia capability and integrated interfaces. Its single ARM® Cortex®-A8 core at 1 GHz, combined with extensive peripheral support and on-chip security, makes it well suited for embedded designs that require multimedia, display, storage and network connectivity in a small surface-mount package.
Designed and documented by NXP Semiconductors as part of the i.MX 535 series, this device is appropriate for engineers seeking a documented platform with flexible memory options, integrated security features and a temperature range suitable for consumer and many embedded applications.
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