MCIMX535DVV1C2

IC MPU I.MX53 1GHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1GHz 529-FBGA (19x19)

Quantity 317 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 535
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 70°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1GHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX535DVV1C2 – IC MPU I.MX53 1GHz 529-FBGA

The MCIMX535DVV1C2 is an NXP Semiconductors i.MX 535 series application processor featuring an ARM® Cortex®-A8 core running at 1 GHz in a 529‑FBGA (19×19 mm) package. It targets embedded and portable systems that require a single‑core 32‑bit application processor with multimedia acceleration and a broad set of peripheral interfaces.

Designed for integration into Connected Embedded and Industrial designs, the device combines processing performance with on‑chip security features and multiple memory and I/O controllers to simplify system design and accelerate time to market.

Key Features

  • Core — ARM® Cortex®-A8 single 32‑bit core at 1 GHz, providing the primary processing capability for application and multimedia tasks.
  • Memory Support — Integrated memory controllers for LPDDR2, DDR2 and DDR3, enabling flexible external DRAM choices to match system cost and performance targets.
  • Multimedia & Graphics — Graphics acceleration and NEON™ SIMD multimedia co‑processor support for enhanced audio/video and signal processing workloads.
  • Security — Comprehensive security feature set including ARM TrustZone®, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC and Tamper Detection to support secure boot and runtime protection.
  • Connectivity & I/O — Two USB 2.0 ports plus two USB 2.0 ports with integrated PHY, single 10/100 Mbps Ethernet port, and a 1‑Wire interface for simple peripheral connectivity.
  • Storage & External Interfaces — Integrated SATA 1.5 Gbps interface and support for multiple external flash and memory types to enable local storage and boot options.
  • Display & HMI — LCD and keypad display interface controllers to support user interface applications.
  • Package & Mounting — 529‑FBGA package (19×19 mm) with surface‑mount mounting for compact board designs.
  • Operating Range — Qualified for consumer applications with an operating temperature range of −20 °C to 70 °C.
  • Compliance — RoHS‑compliant.

Typical Applications

  • Portable multimedia devices — Single‑core processing with NEON SIMD and graphics acceleration to support audio/video playback and media applications.
  • Human machine interfaces (HMIs) — LCD and keypad controllers combined with graphics acceleration for industrial and consumer touch and display systems.
  • Connected embedded systems — Integrated Ethernet, multiple USB interfaces and SATA support for gateways, set‑top and networked appliances.
  • Imaging and sensor systems — Multimedia co‑processing and flexible memory interfaces to support camera sensors and local image processing pipelines.

Unique Advantages

  • Security‑rich architecture: Built‑in TrustZone and extensive secure boot and cryptography features help protect IP and user data at boot and runtime.
  • Flexible memory options: Support for LPDDR2, DDR2 and DDR3 lets designers balance cost, power and performance for their target application.
  • Broad peripheral integration: Ethernet, SATA, multiple USB ports and display interfaces reduce external controller needs and simplify BOM.
  • Compact package: 529‑FBGA (19×19 mm) enables high‑density board layouts for space‑constrained products.
  • Designed for embedded markets: Consumer qualification and an extended operating temperature range support a wide set of embedded and portable product designs.

Why Choose MCIMX535DVV1C2?

The MCIMX535DVV1C2 positions itself as a versatile single‑core application processor for embedded designs that require balanced CPU performance, multimedia capability and extensive I/O integration. Its combination of an ARM® Cortex®‑A8 core at 1 GHz, multimedia acceleration, flexible memory controllers and rich security feature set makes it suitable for development of connected devices, HMI products and multimedia systems.

Backed by NXP Semiconductors documentation and packaged in a compact 529‑FBGA, the device offers designers a pragmatic building block for consumer and embedded products where integration, security and interface breadth are priorities.

Request a quote or submit an inquiry to get pricing and availability for the MCIMX535DVV1C2 and evaluate it for your next embedded design.

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