MCIMX535DVV1C2R2

IC MPU I.MX53 1GHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1GHz 529-FBGA (19x19)

Quantity 34 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 535
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 70°C (TA)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1GHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX535DVV1C2R2 – IC MPU I.MX53 1GHZ 529FBGA

The MCIMX535DVV1C2R2 is an NXP Semiconductors i.MX 535 series application microprocessor built around a single ARM® Cortex®-A8 core running at 1 GHz. Designed for embedded and consumer applications, it combines general-purpose processing with multimedia acceleration, flexible memory support and a broad set of peripheral interfaces.

This device targets portable multimedia and consumer embedded systems that require integrated connectivity, storage interfaces and on-chip security features while maintaining surface-mount 529-FBGA packaging for compact board-level integration.

Key Features

  • Core & Architecture Single ARM® Cortex®-A8 32-bit core at 1 GHz with NEON™ SIMD multimedia acceleration for improved media and signal-processing workloads.
  • Memory Support Integrated controllers for LPDDR2, DDR2 and DDR3 external memories, enabling flexible DRAM choices for different performance and power targets.
  • Storage & Connectivity On-chip interfaces include one 10/100 Mbps Ethernet MAC, one SATA 1.5 Gbps port and multiple USB 2.0 ports (two USB 2.0 and two USB 2.0 + PHY) to support a range of wired peripherals and mass storage options.
  • Display & HMI Display interface controllers for LCD panels and keypad support plus integrated graphics acceleration to enable responsive user interfaces.
  • Security Features Hardware security capabilities including ARM TrustZone (ARM TZ), boot security, cryptography engines, RTIC, secure fusebox, secure JTAG, secure memory and secure RTC with tamper detection for embedded security and authenticated boot flows.
  • Power & Efficiency Series-level Dynamic Voltage and Frequency Scaling (DVFS) support is documented for reducing power consumption by adjusting operating voltage and frequency according to workload.
  • Package & Temperature 529‑FBGA package (19 × 19 mm), surface-mount mounting and a consumer-grade operating temperature range of −20 °C to 70 °C. RoHS compliant.
  • Additional Interfaces Support for 1‑Wire and a range of peripheral interfaces to connect sensors and auxiliary devices.

Typical Applications

  • Portable Multimedia Devices — Leverages the 1 GHz Cortex‑A8 core and NEON SIMD to handle audio/video playback and media applications in compact consumer products.
  • User Interfaces & Embedded HMIs — Integrated graphics acceleration with LCD and keypad controllers for responsive embedded graphical user interfaces.
  • Connected Consumer Devices — On-chip Ethernet, multiple USB ports and SATA support enable networking, peripheral connectivity and local storage for consumer systems.

Unique Advantages

  • Highly integrated peripheral set: Combines Ethernet, SATA, USB and display controllers on a single die to reduce BOM and simplify board design.
  • Flexible memory options: Support for LPDDR2, DDR2 and DDR3 memory controllers allows designers to choose memory technology that best suits cost and performance targets.
  • Multimedia acceleration: NEON SIMD and graphics acceleration enable efficient handling of multimedia workloads without adding external coprocessors.
  • Comprehensive security: Multiple hardware security mechanisms including TrustZone, secure boot and cryptography accelerate secure system design and protect critical assets.
  • Power management capability: Documented DVFS support helps optimize power consumption across use cases where energy efficiency matters.
  • Compact, industry-standard packaging: 529‑FBGA (19 × 19 mm) surface-mount package supports compact board layouts for space-constrained designs.

Why Choose MCIMX535DVV1C2R2?

The MCIMX535DVV1C2R2 positions itself as a balanced, highly integrated application processor for consumer embedded systems that need multimedia capability, broad peripheral connectivity and on-chip security. With a 1 GHz ARM® Cortex®-A8 core, multimedia acceleration and flexible memory interface options, it supports responsive user experiences while simplifying system architecture.

This part is suited for designers seeking a single-chip solution that combines compute, display, storage and connectivity in a compact 529‑FBGA package, backed by NXP’s i.MX 53 series documentation and semiconductor ecosystem.

Request a quote or submit a product inquiry to obtain pricing, lead time and additional procurement information for MCIMX535DVV1C2R2.

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