MCIMX535DVV1CR2

IC MPU I.MX53 1.0GHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 1.0GHz 529-FBGA (19x19)

Quantity 859 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 535
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-20°C ~ 85°C (TC)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed1.0GHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX535DVV1CR2 – IC MPU I.MX53 1.0GHZ 529FBGA

The MCIMX535DVV1CR2 is a single‑core ARM® Cortex®‑A8 microprocessor in the i.MX 535 series, clocked at 1.0 GHz and supplied in a compact 529‑FBGA package. It targets consumer multimedia and connected devices that require integrated processing, graphics acceleration, and a broad set of peripheral interfaces.

Built for efficient multimedia handling and system integration, this device combines a Cortex‑A8 core with NEON™ SIMD and multimedia co‑processors, flexible memory controller support, and a range of I/O for consumer‑oriented applications.

Key Features

  • Core – ARM® Cortex®‑A8 single 32‑bit core running at 1 GHz, with multimedia and NEON™ SIMD co‑processors for accelerated data and signal processing.
  • Memory Support – On‑chip controllers supporting LPDDR2, DDR2 and DDR3 memories for flexible system memory choices.
  • Display and Graphics – Integrated graphics acceleration and display interface controllers for LCD and keypad driven user interfaces.
  • High‑Speed Peripherals – SATA 1.5 Gbps interface and 10/100 Mbps Ethernet for storage and networking connectivity.
  • USB Connectivity – USB 2.0 interfaces listed as USB 2.0 (2) and USB 2.0 + PHY (2) to support a variety of peripheral configurations.
  • Security – Comprehensive security features including ARM TrustZone (ARM TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • System & Boot – Documented boot mode configuration and boot device allocation support to simplify system bring‑up and secure boot implementations.
  • Power and Integration – Integrated regulators and power management features are covered in the device documentation to assist optimized power sequencing and system design.
  • Package & Mounting – 529‑FBGA package, 19 × 19 mm with 0.8 mm pitch; surface‑mount package suited to compact consumer designs.
  • Operating Range & Compliance – Consumer‑grade qualification; operating temperature range −20 °C to 85 °C and RoHS compliant.

Typical Applications

  • Tablets and High‑End Mobile Internet Devices – Multimedia processing and graphics acceleration support responsive user interfaces and media playback.
  • Portable Media Players and Media Phones – Integrated multimedia engine, storage and USB/SATA interfaces enable audio/video playback and local storage options.
  • Netbooks, Nettops and Thin Clients – Single‑chip integration and Ethernet support provide connectivity and sufficient compute for lightweight computing platforms.
  • Portable Navigation and Consumer Smart Devices – Flexible memory support and peripheral I/O allow integration with sensors, displays and wireless modules.

Unique Advantages

  • Integrated Multimedia Acceleration: NEON™ SIMD and multimedia co‑processors deliver dedicated processing for media workloads while offloading the main core.
  • Flexible Memory Options: Support for LPDDR2, DDR2 and DDR3 simplifies BOM decisions across different performance and cost targets.
  • Broad Peripheral Set: On‑chip SATA, Ethernet, multiple USB interfaces, and display controllers reduce external component count and board complexity.
  • Comprehensive Security: Hardware security features including TrustZone, secure boot elements and tamper detection help protect device integrity and user data.
  • Compact Package: 529‑FBGA (19 × 19 mm, 0.8 mm pitch) enables dense, space‑constrained consumer designs with surface‑mount assembly.
  • Documentation‑Backed Design: Detailed datasheet coverage of electrical characteristics, boot configuration and package information supports robust system design and validation.

Why Choose MCIMX535DVV1CR2?

The MCIMX535DVV1CR2 positions itself as a practical, integrated solution for consumer multimedia and connected devices that need a balance of processing performance, graphics capability, and system I/O. Its ARM Cortex‑A8 core with NEON acceleration, broad memory support and on‑chip peripheral interfaces simplify board design and shorten development cycles.

This part is well suited to engineers developing tablets, portable media players, netbooks and other consumer electronics where space, integration and secure boot/system management are important. RoHS compliance and documented operating conditions support predictable manufacturing and deployment in consumer product lines.

Request a quote or submit a purchase inquiry to begin evaluation and sourcing for your next multimedia embedded design.

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