MCIMX534AVV8C

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 782 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 534
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersLPDDR2, DDR2, DDR3
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (2)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX534AVV8C – IC MPU I.MX53 800MHz 529-FBGA

The MCIMX534AVV8C is an ARM® Cortex®-A8 based microprocessor operating at 800 MHz in a 529-ball FBGA (19 × 19 mm) package. It integrates a single 32-bit Cortex‑A8 core with multimedia acceleration and a wide set of peripheral interfaces aimed at infotainment, telematics, HMI, and display-focused designs.

With on-chip graphics and video processing support, multiple memory controller options, and comprehensive security features, the device delivers a balanced combination of processing, multimedia and I/O integration for embedded system designers.

Key Features

  • Core and Performance ARM® Cortex®-A8 single core, 32‑bit processor running at up to 800 MHz for general application processing and multimedia tasks.
  • Multimedia and Acceleration Integrated 2D/3D graphics acceleration and multimedia co‑processors including NEON™ SIMD to accelerate audio/video and signal processing workloads.
  • Memory Support Flexible external memory interface with controllers supporting LPDDR2, DDR2 and DDR3 memory types to match application performance and power targets.
  • Display and User I/O Display interface controllers for LCD and keypad, with architecture suited to HMI and multi‑display applications.
  • Connectivity Multiple host interfaces including one 10/100 Mbps Ethernet MAC, one SATA 1.5 Gbps interface, two USB 2.0 ports and two USB 2.0 ports with integrated PHY. Additional 1‑Wire interface for simple sensor/RTC connectivity.
  • Security and Trusted Boot Extensive security features including ARM TrustZone (ARM TZ), boot security, cryptography support, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection.
  • Package and Assembly 529‑FBGA package (19 × 19 mm, 0.8 mm pitch), surface‑mount for compact, high‑density board designs.
  • Operating Range Designed to operate across a wide temperature range from −40 °C to 125 °C for deployment in thermally demanding environments.
  • Standards and Compliance RoHS compliant.

Typical Applications

  • Infotainment Systems — Multimedia processing, display driving and audio playback for vehicle or fixed-location infotainment units.
  • Telematics and HMI — Human‑machine interfaces and telematics gateways leveraging graphics acceleration and multiple I/O options for sensors and displays.
  • Display Clusters and Instrumentation — Dual display and high‑resolution render support for instrument clusters and multi‑screen dashboards.
  • Embedded Multimedia Appliances — Video processing and user interface controllers in devices requiring integrated graphics and storage connectivity.

Unique Advantages

  • Integrated Multimedia Engine: On‑chip 2D/3D graphics and NEON SIMD co‑processing reduce external accelerator requirements and simplify board design.
  • Broad Memory Flexibility: Support for LPDDR2, DDR2 and DDR3 lets designers choose the optimal DRAM technology for performance, cost and power tradeoffs.
  • Comprehensive I/O Set: Built‑in Ethernet, SATA, multiple USB interfaces and display controllers consolidate peripheral connectivity and reduce bill‑of‑materials.
  • Extensive Security Suite: Multiple hardware security features including TrustZone, secure boot and tamper detection help protect system integrity and sensitive data.
  • Wide Operating Temperature: −40 °C to 125 °C rating supports deployment in demanding thermal environments.
  • Compact High‑Density Package: 529‑FBGA (19 × 19 mm) enables compact system layouts while providing large pinout density for peripherals.

Why Choose MCIMX534AVV8C?

The MCIMX534AVV8C delivers a balanced platform for embedded designs that require a single Cortex‑A8 processing core paired with dedicated multimedia acceleration and a broad set of high‑performance interfaces. Its combination of flexible memory support, integrated graphics/video capabilities, and extensive security features makes it suitable for designers building advanced infotainment, telematics or HMI systems.

Backed by comprehensive technical documentation and package information, this part supports robust system integration and long‑term design planning where multi‑media processing, secure boot and wide temperature operation are required.

Request a quote or submit an inquiry to receive pricing, availability and technical support for MCIMX534AVV8C tailored to your project needs.

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