MCIMX534AVP8C2

IC MPU I.MX53 800MHZ 529FBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX53 1 Core, 32-Bit 800MHz 529-FBGA (19x19)

Quantity 879 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 534
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time13 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package529-FBGA (19x19)
Display & Interface ControllersKeypad, LCDECCNN/AEthernet10/100Mbps (1)
Graphics AccelerationYesHTS CodeN/AMoisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case529-FBGARAM ControllersDDR2, DDR3, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 1.5Gbps (1)
Security FeaturesARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper DetectionSpeed800MHzSupplier Device Package529-FBGA (19×19)
USBUSB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)Voltage – I/O1.3V, 1.8V, 2.775V, 3.3V

Overview of MCIMX534AVP8C2 – IC MPU I.MX53 800MHZ 529FBGA

The MCIMX534AVP8C2 is an industrial‑qualified ARM® Cortex®‑A8 microprocessor operating at up to 800 MHz in a 529‑FBGA (19 × 19 mm) package. It is a single‑core, 32‑bit application processor designed to deliver balanced compute performance and integration for embedded and industrial designs.

Built for systems that require multimedia acceleration, flexible memory support and broad peripheral connectivity, this i.MX53 device targets industrial products and embedded applications where reliability, security features and interface integration are important design drivers.

Key Features

  • Core and Performance ARM® Cortex®‑A8 single core running up to 800 MHz with NEON™ SIMD multimedia co‑processor support for enhanced signal and media processing.
  • Memory Support Integrated controllers for DDR2, DDR3 and LPDDR2 memories and support for DDR2/LVDDR2‑800, LPDDR2‑800 or DDR3‑800 external memories to match a range of system memory requirements.
  • Multilevel Memory System L1 instruction/data caches and L2 cache plus internal and external memory hierarchy to optimize performance for application workloads.
  • Graphics & Multimedia Graphics acceleration and multimedia co‑processor capabilities enable user‑interface, video and audio tasks in embedded products.
  • Connectivity & Peripherals Multiple high‑speed and legacy interfaces including 10/100 Mbps Ethernet (1), SATA 1.5 Gbps (1), multiple USB 2.0 ports (including OTG + PHY and USB 2.0 + PHY variants), and 1‑Wire support.
  • Display & Input Integrated controllers for LCD and keypad interfaces to support human‑machine interfaces and display applications.
  • Security Features Built‑in security technologies including ARM TrustZone (TZ), boot security, cryptography, secure fusebox, secure JTAG, secure memory, secure RTC and tamper detection to strengthen system trust and data protection.
  • Power and System Management Device architecture includes support for Dynamic Voltage and Frequency Scaling (DVFS) to reduce power consumption during lower workload modes and integrated regulator parameters referenced in the datasheet.
  • Package & Temperature 529‑FBGA surface‑mount package (19 × 19 mm, 0.8 mm pitch) rated for industrial operating temperatures from −40 °C to 125 °C.
  • Qualification & Compliance Industrial qualification and RoHS compliance for deployments in industrial environments.

Typical Applications

  • Industrial HMI and Control Drives LCD user interfaces, keypad control and application logic in industrial operator panels and control equipment operating across −40 °C to 125 °C.
  • Imaging and Camera Systems Supports camera sensors and multimedia processing with NEON SIMD acceleration and a multilevel memory hierarchy for image handling and display.
  • Networked Embedded Storage Combines Ethernet and SATA interfaces for compact storage and networked devices that require integrated connectivity and storage I/O.
  • Portable and Connected Devices Enables portable and connected applications with multiple USB ports, OTG support and external memory options for flexible system configurations.

Unique Advantages

  • Highly integrated peripheral set: Multiple USB ports, Ethernet, SATA and display interfaces reduce external controller needs and simplify BOM.
  • Industrial temperature capability: −40 °C to 125 °C rating supports deployment in harsh and wide‑temperature environments.
  • Security‑focused features: On‑chip TrustZone, secure boot and cryptography primitives help protect systems from unauthorized access and tampering.
  • Flexible memory options: Support for DDR2, LPDDR2 and DDR3 memories enables designers to scale memory performance and power for target applications.
  • Power management support: DVFS and integrated regulator parameters in the datasheet enable designers to optimize power consumption for varying workloads.
  • Proven architecture: ARM® Cortex®‑A8 core with NEON™ SIMD provides a familiar development platform for embedded and multimedia applications.

Why Choose MCIMX534AVP8C2?

The MCIMX534AVP8C2 positions itself as a versatile, industrial‑qualified application processor that balances compute capability, security and connectivity in a compact 529‑FBGA package. Its single ARM® Cortex®‑A8 core, multimedia co‑processor support and broad peripheral integration make it suitable for embedded systems that require deterministic operation, multimedia handling and robust interfacing.

Designed by NXP Semiconductors for industrial products, this part offers long‑term applicability for developers and system integrators seeking a secure, connected platform with flexible memory and I/O options backed by formal datasheet specifications and industrial qualification.

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