MCIMX508CVM8BR2

IC MPU I.MX50 800MHZ 400LFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC i.MX50 1 Core, 32-Bit 800MHz 400-LFBGA (17x17)

Quantity 316 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 508
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time15 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package400-LFBGA (17x17)
Display & Interface ControllersEPDC, LCDECCN5A992CEthernet10/100Mbps (1)
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 70°C (TA)Package / Case400-LFBGARAM ControllersLPDDR, LPDDR2, DDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesBoot Security, Cryptography, Secure JTAG
Speed800MHzSupplier Device Package400-LFBGA (17×17)USBUSB 2.0 + PHY (2)
Voltage – I/O1.2V, 1.875V, 2.775V, 3.0V

Overview of MCIMX508CVM8BR2 – IC MPU I.MX50 800MHZ 400LFBGA

The MCIMX508CVM8BR2 is an ARM® Cortex®-A8 based microprocessor IC from the i.MX 508 series, implemented as a single 32‑bit core running at 800 MHz. It is designed as a multimedia-focused, low‑power applications processor with integrated display and graphics capabilities.

Targeted at portable multimedia and embedded consumer/industrial designs, this device combines a high‑performance Cortex‑A8 core with on‑chip graphics/display functions, flexible memory controller support, and integrated connectivity and security features to simplify system design and reduce BOM complexity.

Key Features

  • Core — ARM® Cortex®‑A8 single 32‑bit core at 800 MHz with NEON™ SIMD multimedia co‑processor support for improved media processing.
  • Memory — Integrated controllers for LPDDR, LPDDR2 and DDR2 memory; series documentation notes DRAM support at clock rates up to 266 MHz to enable performance vs. power trade‑offs.
  • Graphics & Display — Built‑in 2D GPU and Pixel Processing Pipeline (ePXP) plus integrated electrophoretic display (EPDC) support and LCD interface controllers for advanced display handling.
  • Connectivity — 10/100 Mbps Ethernet (1), two USB 2.0 ports with PHY, and additional interfaces including 1‑Wire for peripheral connectivity.
  • Security & Debug — Hardware features including boot security, cryptography and Secure JTAG to support secure boot and debug workflows.
  • Package & Thermal — 400‑LFBGA surface‑mount package (17 × 17 mm) and specified operating temperature range of 0 °C to 70 °C; RoHS compliant and Industrial qualification.

Typical Applications

  • Portable Multimedia Devices — High efficiency Cortex‑A8 core with NEON and integrated 2D GPU for handheld media playback and UI tasks.
  • E‑Readers and Electronic Paper Displays — Integrated EPDC and display controllers enable compact, power‑efficient e‑paper designs.
  • Industrial HMI and Embedded Displays — Industrial qualification, integrated display engine and connectivity make the part suitable for human‑machine interfaces and embedded display systems.
  • Consumer Embedded Products — Flexible memory and peripheral support for consumer devices requiring multimedia, secure boot and network connectivity.

Unique Advantages

  • Integrated multimedia platform: On‑chip 2D GPU, ePXP and NEON SIMD reduce the need for external graphics accelerators.
  • Flexible memory support: LPDDR, LPDDR2 and DDR2 controllers allow designers to choose the optimal memory technology for power and performance.
  • Comprehensive peripheral set: Built‑in Ethernet, dual USB 2.0 with PHY and 1‑Wire interface lower system BOM and simplify board design.
  • Security features on‑chip: Boot security, cryptography and Secure JTAG support help secure device firmware and development workflows.
  • Industrial qualification and RoHS compliance: Designed for industrial applications with RoHS status compliant to support regulatory requirements.
  • Compact, manufacturable package: 400‑LFBGA (17×17 mm) surface‑mount package for high‑density, space‑constrained PCBs.

Why Choose MCIMX508CVM8BR2?

The MCIMX508CVM8BR2 positions itself as a balanced solution for embedded and portable multimedia designs that require a capable ARM Cortex‑A8 core, integrated graphics and display support, flexible memory options, and a practical set of peripherals. Its industrial qualification and on‑chip security features make it suitable for applications where robustness and secure boot are required.

Designers benefit from a documented platform with detailed technical resources and series‑level architectural features that simplify integration of displays, multimedia processing and networked peripherals while enabling choices across memory and power/performance trade‑offs.

Request a quote or submit an inquiry to receive pricing and availability information for the MCIMX508CVM8BR2.

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