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Total Products: 5,357
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Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AFS32V234CKN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
63
N/AFS32V234CKN2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,216
FS32V234CMN1VUBFS32V234CMN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
273
N/AFS32V234CMN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
324
FS32V234CON1VUBFS32V234CON1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-A53, ARM® Cortex®-M4
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
Speed:
1GHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
Yes
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
1Gbps
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TA)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
567
N/AFS32V234CON1VUBRNXP SemiconductorsISP GPU CSE 1GHZ 4 COMicroprocessorsN/AN/A-40 °C – 125 °C
Speed:
1 GHz
Voltage – I/O:
1 V
Core Processor:
ARM® Cortex®-M4, ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 64-Bit/1 Core, 32-Bit
RAM Controllers:
DDR3, DDR3L, LPDDR2
Ethernet:
1 Gbps + IEEE 1588 + AVB
Graphics Acceleration:
Yes
Co-Processors/DSP:
Multimedia; NEON™ MPE
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Qualification:
Industrial
821
N/AFS32V234CON2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
446
N/AFS32V234CON2VUBRNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
876
N/AFS32V234CTN1VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
1,153
N/AFS32V234CTN2VUBNXP SemiconductorsIC MPU FS32V23 1GHZ 621FCPBGAMicroprocessors621-FCPBGA (17x17)N/A-40°C ~ 125°C (TJ)
Core Processor:
ARM® Cortex®-A53
Number of Cores/Bus Width:
4 Core, 32/64-Bit
Speed:
1GHz
Co-Processors/DSP:
ARM® Cortex®-M4
RAM Controllers:
DDR3, DDR3L, LPDDR2
Graphics Acceleration:
No
Display & Interface Controllers:
APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU
Ethernet:
GbE
Voltage – I/O:
1V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 125°C (TJ)
Security Features:
AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Mounting Type:
Surface Mount
Package / Case:
621-FBGA, FCBGA
Supplier Device Package:
621-FCPBGA (17×17)
960
N/AFV8050366200IntelIC MPU INTEL 200MHZ PPGA296Microprocessors296-PPGAN/A72°C (TC)
Core Processor:
Intel® Pentium® Processor
Speed:
200MHz
Voltage – I/O:
2.7V, 2.9V
Operating Temperature:
72°C (TC)
Mounting Type:
Through Hole
Package / Case:
296-BFPGA
Supplier Device Package:
296-PPGA
143
FW80321M400SL6R2N/AFW80321M400SL6R2IntelIC MPU XSCALE 400MHZ 544BGAMicroprocessors544-BGA (35x35)N/A0°C ~ 105°C (TC)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
No
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 105°C (TC)
Mounting Type:
Surface Mount
Package / Case:
544-BGA
Supplier Device Package:
544-BGA (35×35)
Grade:
Commercial
82
FW80960VH100N/AFW80960VH100IntelIC MPU I960 100MHZ 324BGAMicroprocessors324-BGAN/A0°C ~ 95°C (TC)
Core Processor:
i960
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TC)
Mounting Type:
Surface Mount
Package / Case:
324-BGA
Supplier Device Package:
324-BGA
Grade:
Commercial
1,030
FWIXP420BBFWIXP420BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
755
FWIXP420BCFWIXP420BCIntelIC MPU 400MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
835
FWIXP420BDFWIXP420BDIntelIC MPU 533MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
904
FWIXP421BBFWIXP421BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
566
N/AFWIXP422ABBIntelIC MPU INTEL 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Commercial
167
FWIXP422BBFWIXP422BBIntelIC MPU 266MHZ 492BGAMicroprocessors492-BGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Xscale
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply-Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-BGA (35×35)
Grade:
Commercial
1,250
N/AFWIXP425ABBIntelIC MPU IXP425 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Commercial
1,544

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