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Total Products: 4,519
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
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N/A
31018-07-3418Advanced Micro DevicesIC FPGAFPGAsN/A4.75 V - 5.25 VN/A
Grade:
N/A
Number of Gates:
N/A
Number of I/O:
N/A
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
N/A
Qualification:
N/A
Total RAM Bits:
N/A
853
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N/A
5962-9957201NNAAdvanced Micro DevicesIC FPGA 260 I/O 352MBGAFPGAs352-MBGA (35x35)2.375 V - 2.625 V-55°C – 125°C
Grade:
Military
Number of Gates:
322970
Number of I/O:
260
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
812
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N/A
5962-9957201NUAAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V-55°C – 125°C
Grade:
Military
Number of Gates:
322970
Number of I/O:
316
Number of LABs/CLBs:
1536
Number of Logic Elements/Cells:
6912
Qualification:
N/A
Total RAM Bits:
65536
1,298
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N/A
5962-9957301NUAAdvanced Micro DevicesIC FPGA 316 I/O 432MBGAFPGAs432-MBGA (40x40)2.375 V - 2.625 V-55°C – 125°C
Grade:
Military
Number of Gates:
661111
Number of I/O:
316
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Qualification:
N/A
Total RAM Bits:
98304
1,525
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5962-9957401QXA
5962-9957401QXAAdvanced Micro DevicesIC FPGA 404 I/O 28CDIPFPGAs28-CDIP2.375 V - 2.625 V-55°C – 125°C
Grade:
Military
Number of Gates:
1124022
Number of I/O:
404
Number of LABs/CLBs:
6144
Number of Logic Elements/Cells:
27648
Qualification:
N/A
Total RAM Bits:
131072
509
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80186/BUC
80186/BUCAdvanced Micro DevicesIC MPU 8MHZ 52CLCCMicroprocessors52-CLCC (11.43x11.43)N/A-55°C ~ 125°C (TC)
Core Processor:
80186
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-55°C ~ 125°C (TC)
Mounting Type:
Surface Mount
Package / Case:
52-CLCC
Supplier Device Package:
52-CLCC (11.43×11.43)
1,779
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8086-2/BQA
8086-2/BQAAdvanced Micro DevicesIC MPU 8MHZ 40CDIPMicroprocessors40-CDIPN/A-55°C ~ 125°C (TC)
Core Processor:
8086
Number of Cores/Bus Width:
1 Core, 16-Bit
Speed:
8MHz
Voltage – I/O:
5V
Operating Temperature:
-55°C ~ 125°C (TC)
Mounting Type:
Through Hole
Package / Case:
40-CDIP (0.600″, 15.24mm)
Supplier Device Package:
40-CDIP
288
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8088-2/BQA
8088-2/BQAAdvanced Micro DevicesIC MPU 8MHZ 40CDIPMicroprocessors40-CDIPN/A-55°C ~ 125°C (TC)
Core Processor:
8088
Number of Cores/Bus Width:
1 Core, 8-Bit
Speed:
8MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-55°C ~ 125°C (TC)
Mounting Type:
Through Hole
Package / Case:
40-CDIP (0.600″, 15.24mm)
Supplier Device Package:
40-CDIP
16
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8753H/BQA
8753H/BQAAdvanced Micro Devices8-BIT, UVPROM, 8051 CPUMicrocontrollers40-CDIP4.5V - 5.5V-55°C – 125°C
Core Processor:
8051
Core Size:
8-Bit
Speed:
12MHz
Program Memory Size:
8KB (8K x 8)
Mounting Type:
Through Hole
1,765
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N/A
A80386DXL-25Advanced Micro DevicesIC MPU 25MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
Grade:
Commercial
906
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N/A
A80386DXL-33Advanced Micro DevicesIC MPU 33MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
Grade:
Commercial
1,170
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N/A
A80386DXL-40Advanced Micro DevicesIC MPU 40MHZ 132CPGAMicroprocessors132-CPGA (37.59x37.59)N/A0°C ~ 100°C (TC)
Core Processor:
Am386DXL
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
40MHz
Co-Processors/DSP:
Math Engine; 387DX
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Through Hole
Package / Case:
132-BCPGA
Supplier Device Package:
132-CPGA (37.59×37.59)
Grade:
Commercial
871
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N/A
AGXD466AAXD0CDAdvanced Micro DevicesIC MPU 333MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
333MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
1,250
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N/A
AGXD466AAXD0TDAdvanced Micro DevicesIC MPU 333MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
333MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
1,129
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N/A
AGXD500AAXE0CCAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
646
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N/A
AGXD500AAXE0CDAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
698
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N/A
AGXD500AAXE0TCAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
926
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QUOTE
N/A
AGXD500AAXE0TDAdvanced Micro DevicesIC MPU 366MHZ 368EBGAMicroprocessors368-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
368-BGA
Supplier Device Package:
368-EBGA (35×35)
Grade:
Commercial
688
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QUOTE
N/A
AGXD500EEXE0BCAdvanced Micro DevicesIC MPU 366MHZ 396TEPBGAMicroprocessors396-TEPBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
366MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
396-BBGA
Supplier Device Package:
396-TEPBGA (35×35)
Grade:
Commercial
817
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N/A
AGXD533EEXF0BCAdvanced Micro DevicesIC MPU 400MHZ 396TEPBGAMicroprocessors396-TEPBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX
Number of Cores/Bus Width:
1 Core
Speed:
400MHz
RAM Controllers:
DDR
Graphics Acceleration:
Yes
Display & Interface Controllers:
TFT, VGA
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
396-BBGA
Supplier Device Package:
396-TEPBGA (35×35)
Grade:
Commercial
1,258
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QUOTE

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