AGXD533EEXF0BC

The AGXD533EEXF0BC is an AMD Geode™ GX microprocessor in a 396-TEPBGA (35×35) package. It delivers a single-core 400 MHz processor platform tailored for embedded systems that require integrated display and I/O functionality.

Designed for commercial-grade embedded applications, this device combines a DDR memory controller, integrated display interfaces (TFT and VGA), PCI connectivity and graphics acceleration, operating on 3.3 V I/O and specified for 0–85 °C ambient.

Key Features

• Core Single-core AMD Geode™ GX processor running at 400 MHz for deterministic embedded computing.
• Memory DDR memory controller support for standard embedded DRAM interfaces.
• Display & Graphics Integrated TFT and VGA display controllers plus graphics acceleration to support local graphical user interfaces.
• Interfaces PCI interface and additional peripheral connectivity to integrate with standard embedded subsystems.
• Power and I/O 3.3 V I/O signalling compatible with common embedded peripheral voltages.
• Package & Mounting 396-TEPBGA (35×35) supplier device package, 396-BBGA package case, surface-mount mounting type for compact board-level integration.
• Environmental & Grade Commercial grade device specified for 0–85 °C operating temperature and RoHS compliant.

Typical Applications

• Embedded HMI and Kiosks Integrated TFT/VGA display controllers and graphics acceleration enable localized user interfaces and visual displays.
• Industrial Control Single-core deterministic processing with DDR support and PCI connectivity for control and I/O tasks in commercial embedded systems.
• Point-of-Sale and Thin Clients Compact BGA packaging and integrated graphics support make the device suitable for space-constrained systems that require display and peripheral integration.

Unique Advantages

• Integrated Display Subsystem: Native TFT and VGA controllers with graphics acceleration reduce external component count for display-equipped designs.
• Single-Core Determinism: A dedicated 400 MHz core provides predictable performance for embedded workloads.
• Standard Memory Support: DDR controller compatibility simplifies memory selection and enables common DRAM configurations.
• Compact Surface-Mount Package: 396-TEPBGA (35×35) surface-mount form factor supports dense board layouts and small system footprints.
• Commercial Temperature Range: Rated for 0–85 °C operation to meet typical commercial embedded environment requirements.
• RoHS Compliant: Meets environmental compliance needs for lead-free manufacturing processes.

Why Choose AGXD533EEXF0BC?

The AGXD533EEXF0BC combines a single 400 MHz AMD Geode™ GX core with integrated display, memory and peripheral interfaces in a compact 396-TEPBGA package, offering a balanced solution for commercial embedded designs that need onboard graphics and standard I/O. Its support for DDR memory, PCI connectivity, 3.3 V I/O and a 0–85 °C operating range make it suitable for systems where integration, predictable performance and a small board footprint are priorities.

This device is appropriate for engineers and procurement teams building commercial embedded products that require an integrated processor platform with display capabilities and standardized interfaces, delivering long-term value through simplified BOM, compact packaging and environmental compliance.

Request a quote or submit a purchase inquiry for the AGXD533EEXF0BC to receive pricing and availability details tailored to your project requirements.