AGXD500AAXE0TD

The AGXD500AAXE0TD is an embedded microprocessor IC based on the AMD Geode™ GX core, delivering a single 366 MHz processing core for compact embedded systems. Designed for integration into display-driven and expansion-capable designs, it combines core processing, DDR memory support, display controllers and graphics acceleration in a surface-mount BGA package.

This device targets embedded applications that require integrated display output, moderate processing throughput and standard peripheral connectivity while operating within a commercial temperature range.

Key Features

• Core Single AMD Geode™ GX processor core clocked at 366 MHz for embedded processing tasks.
• Memory DDR memory controller support for system memory interfacing.
• Display Integrated TFT and VGA display interface controllers plus on-chip graphics acceleration for display-driven applications.
• Interfaces Includes PCI as an additional interface to support system expansion and peripheral connectivity.
• Power and I/O 3.3 V I/O voltage for compatibility with common embedded logic levels.
• Package & Mounting 368-EBGA (35 × 35 mm) package, surface-mount BGA footprint for compact board integration.
• Environmental & Grade Commercial grade device with RoHS compliance and an operating temperature range of 0 °C to 85 °C.

Typical Applications

• Embedded HMI and Control Panels Integrated TFT/VGA controllers and graphics acceleration make the device suitable for display-driven human-machine interfaces and control panels.
• Industrial Embedded Systems Single-core processing with DDR support and PCI expansion fits compact industrial controllers and instrumentation within commercial temperature limits.
• Kiosks and Point-of-Sale Terminals Display output and onboard graphics acceleration provide the core features needed for interactive kiosks and POS devices.

Unique Advantages

• Integrated Display and Graphics: On-chip TFT and VGA controllers plus graphics acceleration reduce external component count for display applications.
• Compact Surface-Mount Package: 368-EBGA (35×35) surface-mount package enables small form-factor board designs.
• Standard 3.3 V I/O: 3.3 V I/O voltage simplifies integration with common embedded peripherals and logic families.
• DDR Memory Support: Built-in DDR controller streamlines memory interfacing for system designs.
• Expansion Capability: PCI interface provides options for peripheral and I/O expansion without redesigning core logic.
• Commercial Temperature Range: Rated for 0 °C to 85 °C to meet typical commercial embedded deployment requirements.

Why Choose AGXD500AAXE0TD?

The AGXD500AAXE0TD positions itself as an integrated embedded processor solution that brings together an AMD Geode™ GX single core, DDR memory support, display controllers and graphics acceleration in a compact BGA package. Its feature set is focused on applications that require display capability, moderate processing and standard expansion via PCI while maintaining a simple power I/O profile.

This part is well suited to designers building commercial embedded systems—especially those with display and expansion needs—who value a compact surface-mount package, RoHS compliance and predictable operating temperature range backed by Advanced Micro Devices.

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