AGXD500EEXE0BC
| Part Description |
AMD Geode™ GX Microprocessor IC - 1 Core 366MHz 396-TEPBGA (35x35) |
|---|---|
| Quantity | 817 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Geode GX |
| Manufacturer | Advanced Micro Devices |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 1 Weeks |
| Datasheet |
Specifications & Environmental
| Core Processor | AMD Geode™ GX | Device Package | 396-TEPBGA (35x35) | Display & Interface Controllers | TFT, VGA | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Grade | Commercial | Graphics Acceleration | Yes | ||
| HTS Code | 0000.00.0000 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core | Operating Temperature | 0°C ~ 85°C (TC) | ||
| Package / Case | 396-BBGA | RAM Controllers | DDR | REACH Compliance | REACH Affected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 366MHz | Supplier Device Package | 396-TEPBGA (35×35) | ||
| Voltage – I/O | 3.3V |
Overview of AGXD500EEXE0BC – IC MPU 366MHZ 396TEPBGA
The AGXD500EEXE0BC is an AMD Geode™ GX microprocessor IC in a 396-TEPBGA (35×35) surface-mount package. It integrates a single-core 366 MHz processor core with on-chip DDR memory controller, display interfaces and graphics acceleration to address embedded application needs.
Targeted at embedded systems, this commercial-grade device provides 3.3 V I/O, PCI connectivity and support for TFT and VGA displays, making it suitable for designs that require integrated display capabilities and DDR memory support.
Key Features
- Core — AMD Geode™ GX single-core processor running at 366 MHz.
- Memory — Integrated DDR memory controller for external system memory support.
- Display — TFT and VGA display interface controllers with graphics acceleration.
- Interfaces & I/O — PCI interface and 3.3 V I/O voltage for peripheral connectivity.
- Package & Mounting — 396-TEPBGA (35×35) supplier device package; 396-BBGA case; surface-mount mounting type.
- Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Embedded systems — Single-core microprocessor option for compact embedded designs that require integrated CPU and peripheral support.
- Display-enabled devices — Devices needing TFT or VGA outputs and onboard graphics acceleration for UI or simple graphical tasks.
- Memory-centric applications — Systems that leverage DDR memory for local storage and buffering.
- PCI-enabled platforms — Designs that require PCI for peripheral expansion and connectivity.
Unique Advantages
- Integrated display and graphics — Built-in TFT and VGA controllers plus graphics acceleration reduce the need for separate display controllers.
- On-chip DDR support — DDR memory controller simplifies memory subsystem design and board routing.
- Compact, high-pin-count package — 396-TEPBGA (35×35) package enables a compact board footprint while supporting required I/O.
- Standard commercial temperature rating — Rated 0 °C to 85 °C for typical commercial deployments.
- Regulatory alignment — RoHS compliant to meet environmental material requirements.
Why Choose AGXD500EEXE0BC?
Manufactured by Advanced Micro Devices, the AGXD500EEXE0BC delivers a balance of processor capability and subsystem integration in a single-core AMD Geode GX solution running at 366 MHz. Its combination of DDR memory support, display controllers with graphics acceleration, PCI interface and compact 396-TEPBGA package makes it well suited for embedded designs that prioritize integrated display capability and straightforward peripheral expansion.
This part is aimed at developers and designers of commercial embedded platforms who need a consolidated microprocessor solution with defined operating-temperature limits and RoHS compliance for long-term product planning.
Request a quote or submit an inquiry to receive pricing and availability for the AGXD500EEXE0BC. Our team can provide the information you need to evaluate this component for your next embedded design.

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Headquarters: Santa Clara, California, USA
Employees: 25,000+
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








