AGXD500AAXE0CD

IC MPU 366MHZ 368EBGA
Part Description

AMD Geode™ GX Microprocessor IC - 1 Core 366MHz 368-EBGA (35x35)

Quantity 698 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesGeode GX
ManufacturerAdvanced Micro Devices
Manufacturing StatusActive
Manufacturer Standard Lead Time1 Weeks
Datasheet

Specifications & Environmental

Core ProcessorAMD Geode™ GXDevice Package368-EBGA (35x35)Display & Interface ControllersTFT, VGA
ECCN3A991A2GradeCommercialGraphics AccelerationYes
HTS Code0000.00.0000Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 CoreOperating Temperature0°C ~ 85°C (TC)
Package / Case368-BGARAM ControllersDDRREACH ComplianceREACH not applicable
RoHS ComplianceROHS3 CompliantSpeed366MHzSupplier Device Package368-EBGA (35×35)
Voltage – I/O3.3V

Overview of AGXD500AAXE0CD – IC MPU 366MHz 368-EBGA

The AGXD500AAXE0CD is an AMD Geode™ GX single-core microprocessor optimized for embedded applications. Running at 366 MHz, it integrates a Geode GX core with display and memory interfaces suited to compact, commercial-grade embedded systems.

Designed for embedded markets, this device targets applications that require on-chip graphics support, DDR memory interfacing and PCI connectivity in a surface-mount 368-EBGA (35×35) package.

Key Features

  • Core — AMD Geode™ GX single-core processor operating at 366 MHz, providing deterministic single-threaded processing for embedded workloads.
  • Memory — DDR memory controller support for system memory interfacing.
  • Display & Graphics — Integrated display interface controllers for TFT and VGA plus hardware graphics acceleration to support embedded user interfaces and display output.
  • Interfaces — PCI interface available for expansion and peripheral connectivity.
  • Power — 3.3 V I/O voltage specification for system-level power planning and I/O compatibility.
  • Package & Mounting — 368-BGA supplier device package supplied as 368-EBGA (35×35); surface-mount package suitable for compact board designs.
  • Operating Range & Grade — Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Compliance — RoHS compliant.

Typical Applications

  • Embedded HMI and Displays — Use the on-chip TFT and VGA controllers with graphics acceleration to drive embedded user interfaces and display panels.
  • Industrial Control — Integrate the Geode GX core and DDR memory interface in control systems requiring a commercial temperature grade.
  • Thin Clients and Boxed Appliances — Leverage the single-core 366 MHz processor and display capabilities for compact client devices and dedicated appliances.
  • Expansion-Enabled Systems — Deploy PCI for add-on cards or peripheral interfaces in embedded platforms.

Unique Advantages

  • Integrated Display Subsystem: Built-in TFT and VGA controllers plus graphics acceleration reduce external video components and simplify display system design.
  • Memory Interface Ready: DDR controller support enables straightforward connection to standard DDR memory for system performance and responsiveness.
  • Compact Surface-Mount Package: 368-EBGA (35×35) package offers a high-density footprint suitable for space-constrained embedded boards.
  • Standard I/O Voltage: 3.3 V I/O simplifies integration with common peripheral voltage domains.
  • Commercial Temperature Rating: 0 °C to 85 °C operation aligns with a wide range of indoor and controlled-environment embedded deployments.
  • RoHS Compliant: Meets RoHS requirements for environmentally conscious designs.

Why Choose AGXD500AAXE0CD?

The AGXD500AAXE0CD positions itself as a compact, integrated solution for embedded designs that require on-chip graphics, DDR memory support and PCI connectivity in a commercial-temperature device. Its AMD Geode™ GX core at 366 MHz provides predictable single-core performance while the integrated display and graphics capabilities reduce system complexity.

This part is suitable for embedded designers and OEMs developing HMIs, thin clients, control appliances and other systems where display functionality, a small BGA footprint and common 3.3 V I/O are important. Backed by Advanced Micro Devices, the device offers a focused combination of integration and standard interfaces for reliable deployment in commercial embedded applications.

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