 | | KMC68EN302AG25BT | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 905 | |
 | | KMC68EN360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 1,095 | |
 | | KMC68EN360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 805 | |
| N/A | | KMC68EN360RC33L | NXP Semiconductors | IC MPU M683XX 33MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 781 | |
 | | KMC68EN360VR25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,048 | |
 | | KMC68LC302AF16CT | NXP Semiconductors | IC MPU M683XX 16MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 23 | |
 | | KMC68LC302AF20CT | NXP Semiconductors | IC MPU M683XX 20MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,023 | |
 | | KMC68LC302AF25CT | NXP Semiconductors | IC MPU M683XX 25MHZ 100LQFP | Microprocessors | 100-LQFP (14x14) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-LQFP (14×14) | 1,168 | |
 | | KMC68MH360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 84 | |
 | | KMC68MH360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 18 | |
 | | KMC7447AHX1167NB | NXP Semiconductors | IC MPU MPC74XX 1.167GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 154 | |
 | | KMC7448HX1267ND | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,274 | |
 | | KMC7448HX1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 351 | |
 | | KMC7448THX1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | -40°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 653 | |
 | | KMC7448VS1400NC | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCLGA | Microprocessors | 360-FCCLGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CLGA, FCCLGA Supplier Device Package: 360-FCCLGA (25×25) | 742 | |
 | | KMC7448VU1267ND | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 360BGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 714 | |
 | | KMC7448VU1400NC | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 360-CBGA, FCCBGA Supplier Device Package: 360-FCCBGA (25×25) | 892 | |
 | | KMC7448VU1400ND | NXP Semiconductors | IC MPU MPC74XX 1.4GHZ 360FCCBGA | Microprocessors | 360-FCCBGA (25x25) | 1.5V, 1.8V, 2.5V | 0°C – 105°C | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,685 | |
 | | KMC7457RX1000NC | NXP Semiconductors | IC MPU MPC74XX 1.0GHZ 483FCCBGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,093 | |
 | | KMC7457RX1267LC | NXP Semiconductors | IC MPU MPC74XX 1.267GHZ 483BGA | Microprocessors | 483-FCCBGA (29x29) | N/A | 0°C ~ 105°C (TA) | Core Processor: PowerPC G4 Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Multimedia; SIMD Voltage – I/O: 1.5V, 1.8V, 2.5V Operating Temperature: 0°C ~ 105°C (TA) Mounting Type: Surface Mount Package / Case: 483-BCBGA, FCCBGA Supplier Device Package: 483-FCCBGA (29×29) | 1,176 | |