KMC7457RX1267LC

IC MPU MPC74XX 1.267GHZ 483BGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.267GHz 483-FCCBGA (29x29)

Quantity 1,736 Available (as of October 7, 2026)
Product CategoryMicroprocessors
Part SeriesMC7457
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package483-FCCBGA (29x29)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case483-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceRoHS non-compliantSpeed1.267GHz
Supplier Device Package483-FCCBGA (29×29)Voltage – I/O1.5V, 1.8V, 2.5V

Overview of KMC7457RX1267LC – IC MPU MPC74XX 1.267GHZ 483BGA

The KMC7457RX1267LC is a PowerPC G4 microprocessor IC from the MC7457 series by NXP Semiconductors. It implements a 32‑bit, single‑core PowerPC G4 core clocked at 1.267 GHz and is targeted at networking and computing systems applications.

Architected for high instruction throughput, the device includes an on‑chip 512‑Kbyte L2 cache, an internal L3 tag and controller with a dedicated backside L3 interface for external SRAM, and integrated multimedia SIMD and double‑precision floating‑point capabilities to support compute and packet‑processing workloads.

Key Features

  • PowerPC G4 Core Single 32‑bit core running at 1.267 GHz, implementing the PowerPC microprocessor architecture as used in the MC7457 family.
  • Superscalar Execution High instruction throughput with superscalar fetch/dispatch behavior; the implementation supports multiple‑instruction fetch and dispatch to improve processing efficiency.
  • Floating‑Point and Multimedia Integrated double‑precision floating‑point unit and SIMD multimedia unit for enhanced numeric and media processing.
  • On‑chip and Backside Cache Support 512‑Kbyte on‑chip L2 cache plus internal L3 tag and controller; dedicated high‑bandwidth backside L3 interface supports 1, 2, or 4 Mbytes of external SRAM for L3 cache or private memory use.
  • System Bus Support Memory storage subsystem supports the MPX bus protocol and a subset of the 60x bus protocol for connection to main memory and system resources.
  • Package and Mounting 483‑FCCBGA (29×29) surface‑mount package suitable for compact board designs.
  • Operating Range and Qualification Consumer qualification with an operating temperature range of 0 °C to 105 °C and RoHS compliance.

Typical Applications

  • Networking Equipment Suited for networking systems that require a PowerPC G4 core with high instruction throughput and backside L3 cache support for packet processing and buffering.
  • Computing Systems Designed for general computing platforms where a 32‑bit single core with FPU and SIMD multimedia acceleration is needed.
  • Embedded Systems Applicable to embedded designs that benefit from an integrated L2 cache and a dedicated L3 controller/interface to manage external SRAM for cache or private memory.

Unique Advantages

  • Integrated L2 and L3 Cache Support: 512‑Kbyte on‑chip L2 plus an internal L3 tag/controller and a glueless backside L3 interface simplify external cache integration and memory subsystem design.
  • Balanced Compute and Media Processing: The combination of a double‑precision FPU and SIMD multimedia unit provides native support for numeric and media workloads without separate co‑processors.
  • Superscalar Architecture: Multi‑instruction fetch and dispatch capability increases instruction throughput for compute‑intensive tasks.
  • Compact BGA Package: 483‑FCCBGA (29×29) surface‑mount package enables high‑density board layouts while maintaining robust electrical/thermal characteristics.
  • Vendor Backing and Series Consistency: Part of the MC7457 series from NXP Semiconductors, providing documented hardware specifications and family compatibility considerations.

Why Choose KMC7457RX1267LC?

The KMC7457RX1267LC combines a 1.267 GHz PowerPC G4 core with on‑chip L2 cache and a dedicated L3 controller/interface to address networking and computing system requirements where on‑chip cache and external SRAM-based L3 are important design elements. Its superscalar core with FPU and SIMD multimedia support provides a capable foundation for compute and media processing tasks within consumer‑qualified applications.

This part is suitable for designers who need a single‑core 32‑bit PowerPC solution with documented backside L3 support, a compact 483‑BGA footprint, and an operating range up to 105 °C. The MC7457 family documentation details system integration points such as MPX and subset 60x bus protocols to aid system design and validation.

Request a quote or submit a purchase inquiry today to evaluate the KMC7457RX1267LC for your next networking, computing, or embedded system design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up