KMC7457VG1267LC

IC MPU MPC74XX 1.267GHZ 483BGA
Part Description

PowerPC G4 Microprocessor IC MPC74xx 1 Core, 32-Bit 1.267GHz 483-FCCBGA (29x29)

Quantity 1,058 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC7457
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; SIMDCore ProcessorPowerPC G4Device Package483-FCCBGA (29x29)
ECCN3A991A2Graphics AccelerationNoHTS Code8542.31.0001
Moisture Sensitivity Level1 (Unlimited)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 105°C (TA)Package / Case483-BCBGA, FCCBGA
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed1.267GHz
Supplier Device Package483-FCCBGA (29×29)Voltage – I/O1.5V, 1.8V, 2.5V

Overview of KMC7457VG1267LC – IC MPU MPC74XX 1.267GHZ 483BGA

The KMC7457VG1267LC is a PowerPC G4 microprocessor implementation in the MC7457 series, delivering a 1.267 GHz single‑core 32‑bit RISC architecture. Designed for networking and computing system applications, this device integrates on‑chip high‑performance compute elements and cache support to address embedded and system‑level processing tasks.

Engineered for surface‑mount deployment in a 483‑FCCBGA (29×29) package, the device offers embedded system designers a compact, RoHS‑compliant processor option with on‑chip L2 cache and support for an external L3 cache interface as described in the product hardware specification.

Key Features

  • Core and Architecture PowerPC G4 implementation providing a 32‑bit superscalar RISC core suitable for embedded computing workloads.
  • Clock Speed 1.267 GHz operating frequency for single‑core processing performance.
  • Cache and Memory Subsystem Includes an on‑chip 512‑Kbyte L2 cache and an internal L3 tag/controller that supports a glueless backside L3 cache via a dedicated high‑bandwidth interface (supports external SRAM configurations as documented).
  • Multimedia and DSP Support Integrated multimedia/SIMD unit and double‑precision floating point capabilities for signal and media processing acceleration.
  • Bus Interfaces Memory and system interface support including the MPX bus protocol and a subset of the 60x bus protocol for main memory and system resource access, as detailed in the hardware specification.
  • Package and Mounting 483‑FCCBGA package (29×29 ball array), surface mount suitable for compact board layouts.
  • Qualification and Environmental Consumer qualification with RoHS compliance and an operating temperature range of 0 °C to 105 °C.

Typical Applications

  • Networking Equipment Suited to routing, switching and network compute tasks where a high‑performance PowerPC core and cache hierarchy are required.
  • Computing Systems Appropriate for embedded servers and compute appliances that benefit from on‑chip L2 and supported L3 cache for memory‑intensive workloads.
  • System Appliances Useful in standalone embedded systems and appliances that require a compact, surface‑mount processor solution with multimedia acceleration.

Unique Advantages

  • Integrated Cache Subsystem: 512‑Kbyte L2 plus support for a dedicated L3 cache interface reduces dependency on external cache controllers and simplifies board design.
  • Single‑Core High Frequency: 1.267 GHz core frequency provides a clear performance point for single‑threaded embedded workloads.
  • Multimedia/SIMD Acceleration: On‑chip SIMD and floating‑point capabilities enable efficient processing of media and signal tasks without separate coprocessors.
  • Compact BGA Package: 483‑FCCBGA (29×29) surface‑mount package enables high‑density PCB layouts for space‑constrained designs.
  • Regulatory and Temperature Coverage: RoHS compliance and an operating range up to 105 °C supports deployment in a variety of consumer and industrial environments.

Why Choose KMC7457VG1267LC?

The KMC7457VG1267LC positions itself as a capable PowerPC G4 single‑core solution combining a 1.267 GHz processor core with an on‑chip 512‑Kbyte L2 cache and a dedicated L3 cache interface. Its multimedia and SIMD capabilities, together with documented bus support, make it suitable for embedded networking and computing systems that require a compact, surface‑mount processor with robust memory subsystem options.

This device is appropriate for designers seeking a proven architecture with explicit hardware specifications for cache, bus interfaces, and thermal operation. Its RoHS compliance and package format support reliable integration into production embedded systems.

Request a quote or submit an inquiry for availability and pricing to move forward with technical evaluation and procurement.

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