KMPC8245LVV350D
| Part Description |
PowerPC 603e Microprocessor IC MPC82xx 1 Core, 32-Bit 350MHz 352-TBGA (35x35) |
|---|---|
| Quantity | 294 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC8245 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Core Processor | PowerPC 603e | Device Package | 352-TBGA (35x35) | ECCN | 3A001A3 | ||
|---|---|---|---|---|---|---|---|
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 105°C (TA) | Package / Case | 352-LBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 350MHz | ||
| Supplier Device Package | 352-TBGA (35×35) | Voltage – I/O | 3.3V |
Overview of KMPC8245LVV350D – IC MPU MPC82XX 350MHZ 352TBGA
The KMPC8245LVV350D is a PowerPC 603e-based microprocessor integrated into a single-chip MPC8245 family device. It delivers a 32-bit, single-core processor running at 350 MHz with on-chip peripheral logic and a high-performance memory controller suitable for embedded and consumer applications.
Designed for systems that require on-chip PCI connectivity and SDRAM support, this device combines processor core functionality with integrated interfaces and system control features, operating from 3.3 V I/O and a 0 °C to 105 °C temperature range. The part is RoHS compliant and supplied in a 352‑TBGA (35 × 35 mm) surface-mount package.
Key Features
- Core and Architecture PowerPC 603e processor core, single 32-bit core operating at 350 MHz as specified for the MPC8245 family.
- Memory and Cache Integrated memory controller supports ROM and SDRAM. The device documentation describes 16‑KB instruction and 16‑KB data caches and memory management support.
- Peripheral Integration Peripheral logic integrates a PCI bridge, DUART, DMA controller, programmable interrupt controller (PIC), message unit (with I2O), and an I2C controller—providing on-chip system interfaces.
- I/O and Interfaces PCI bus interface and I2C controller are included in the peripheral block; DUART and serial interrupt facilities are also described in the hardware specification.
- System and Reliability Features On-chip ECC controller, MMU, floating-point support, JTAG/COP debug interface, and power management features are part of the documented processor implementation.
- Package, Power and Thermal 352‑TBGA (35×35 mm) surface-mount package, 3.3 V I/O, RoHS compliant, operating temperature range 0 °C to 105 °C.
Typical Applications
- Embedded Systems Use where a PowerPC 603e core with integrated PCI and SDRAM support is required for general embedded control and processing tasks.
- Consumer Electronics Suited for consumer-qualified designs that benefit from an integrated processor, memory controller, and standard peripheral interfaces.
- PCI-Based System Designs Systems that require on-chip PCI bridge functionality to interface with PCI peripherals and standard PCI subsystems.
- Networking and Communication Equipment Applications that leverage the MCU’s peripheral logic (DUART, DMA, interrupt controller) alongside SDRAM-based memory subsystems.
Unique Advantages
- Integrated PCI bridge and peripheral logic: Provides on-chip PCI connectivity with standard peripheral blocks described in the hardware specification.
- On-chip memory controller with SDRAM support: Documented support for SDRAM and ROM simplifies external memory architecture choices.
- PowerPC 603e core with floating-point and MMU: Processor-level features include floating-point support, MMU functionality, and separate instruction/data caches as documented.
- Comprehensive system interfaces: DUART, DMA controller, PIC, message unit (I2O), I2C controller, and JTAG/COP are integrated for system-level flexibility.
- Compact, high-density package and RoHS compliance: 352‑TBGA (35×35 mm) surface-mount package with RoHS compliance and a 0 °C to 105 °C operating range for consumer-grade deployments.
Why Choose KMPC8245LVV350D?
The KMPC8245LVV350D positions processor capability and system-level peripheral logic in a single integrated device, offering a combination of a PowerPC 603e core, on-chip PCI bridge, and a high-performance memory controller that supports SDRAM and ROM. Its documented system features—caches, MMU, ECC controller, DMA, and serial interfaces—make it suitable for embedded and consumer applications that require consolidated functionality.
This part is ideal for designers seeking a processor with built-in PCI connectivity and a broad set of peripheral and system-management features in a 352‑TBGA package. With RoHS compliance and a defined operating temperature window, it fits consumer-qualifying projects where integrated memory and peripheral support streamline hardware design.
Request a quote or submit an inquiry to check pricing and availability for KMPC8245LVV350D and to discuss how this integrated PowerPC solution can fit your next embedded design.

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