KMPC823VR81B2T

IC MPU MPC8XX 81MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 81MHz 256-PBGA (23x23)

Quantity 415 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A001A3Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed81MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of KMPC823VR81B2T – IC MPU MPC8XX 81MHz 256BGA

The KMPC823VR81B2T is an NXP Semiconductors PowerPC-based microprocessor combining a 32-bit single core running at 81 MHz with an integrated communications processor module. It targets embedded, low-power and portable designs that require on-chip peripherals for display, imaging and serial communications.

With on-chip LCD and video controllers, a USB 1.x channel, Ethernet interface and multiple serial ports, this device provides a tightly integrated platform for mobile computing, image capture and personal communication applications while operating from a 3.3 V I/O boundary.

Key Features

  • PowerPC Core: Embedded single-issue 32-bit PowerPC core delivering the processing foundation for control and application tasks.
  • Clock Speed: 81 MHz core clock for embedded processing workloads.
  • Caches & MMU (from datasheet): Instruction and data cache architecture with on-chip memory management units and Translation Lookaside Buffers for virtual memory support.
  • Communication Processor Module (CPM): Dedicated RISC-based CPM handles imaging and communication tasks, offloading the main core and supporting embedded signal processing and DMA-style transfers.
  • Integrated Serial Peripherals: Seven serial channels including two serial communication controllers, two serial management controllers, one I2C port, one USB channel (USB 1.x) and one SPI-style serial peripheral interface.
  • Display & Video: On-chip LCD controller and video display controller for direct display interfacing and image handling.
  • Networking & USB: Single 10 Mbps Ethernet interface and one USB 1.x channel for basic networked and host/device connectivity.
  • Memory Controller: DRAM controller support for external system memory.
  • Package & Mounting: 256-ball PBGA package (23 × 23 mm) designed for surface-mount assembly.
  • Operating Conditions: Consumer-grade qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
  • Supply & I/O: 3.3 V I/O boundary for interfacing with common embedded peripherals.

Typical Applications

  • Mobile Computing: Compact portable devices that need integrated display, USB and serial connectivity combined with a PowerPC core.
  • Image Capture & Processing: Devices requiring on-chip imaging support and CPM-based signal processing for compression and decompression tasks.
  • Personal Communications: Handheld or communication products leveraging the CPM and multiple serial channels for protocol handling and offloaded communications tasks.
  • Embedded Display Systems: Systems needing LCD and video controller support for user interfaces and simple graphical output.
  • Networked Embedded Devices: Basic Ethernet-enabled applications that require 10 Mbps network connectivity alongside USB and serial interfaces.

Unique Advantages

  • Highly Integrated Peripheral Set: On-chip USB, Ethernet, LCD and video controllers reduce external components and simplify BOM and board design.
  • Offload Capable CPM: The communications processor module handles imaging and serial protocols to free the main PowerPC core for application logic.
  • Flexible Serial Connectivity: Multiple serial channels including I2C, SPI and dedicated serial controllers enable a wide range of peripheral interfaces.
  • Compact PBGA Package: 256-ball PBGA (23 × 23 mm) delivers a dense footprint for space-constrained embedded platforms.
  • Consumer-Grade Temperature Range and RoHS Compliance: Designed for consumer electronics temperature ranges and compliant with RoHS requirements for material restrictions.

Why Choose KMPC823VR81B2T?

The KMPC823VR81B2T positions itself as a compact, integrated microprocessor solution for embedded designs that require a PowerPC core and a rich set of on-chip peripherals. Its combination of a 32-bit 81 MHz core, a dedicated communications processor module, display controllers and multiple serial interfaces provides designers a balanced platform for portable, imaging and communication-focused products.

This NXP Semiconductors device is suited to teams seeking to reduce external component count while maintaining flexible interfacing options and adherence to consumer-grade operating ranges. RoHS compliance and the included DRAM controller, USB and Ethernet support help streamline development and deployment in targeted embedded applications.

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