KMPC823VR66B2T

IC MPU MPC8XX 66MHZ 256BGA
Part Description

PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23)

Quantity 409 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC823
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; RISC CPMCore ProcessorPowerPCDevice Package256-PBGA (23x23)
Display & Interface ControllersLCD, VideoECCN3A001A3Ethernet10Mbps (1)
Graphics AccelerationNoHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-Bit
Operating Temperature0°C ~ 95°C (TA)Package / Case256-BBGARAM ControllersDRAM
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSpeed66MHz
Supplier Device Package256-PBGA (23×23)USBUSB 1.x (1)Voltage – I/O3.3V

Overview of KMPC823VR66B2T – IC MPU MPC8XX 66MHZ 256BGA

The KMPC823VR66B2T is an NXP Semiconductors PowerPC-based microprocessor in the MPC823 family, delivered in a 256‑pin PBGA (23×23) package. It integrates a single 32‑bit PowerPC core running at 66 MHz with an on‑chip communication processor module and a set of peripherals targeted at embedded and consumer applications.

Designed for low‑power, portable and image capture or personal communication products, the device combines processor performance with integrated I/O and display controllers to reduce board-level complexity and support compact system designs.

Key Features

  • Core  PowerPC single‑issue 32‑bit core; 1 core at 66 MHz as specified for this part.
  • Communication Processor Module (CPM)  On‑chip RISC CPM for communications and embedded signal processing; offloads peripheral and protocol tasks from the PowerPC core.
  • Memory and MMU  On‑chip caches and memory management features described for the MPC823 series, including instruction and data caches and translation lookaside buffers for virtual memory support.
  • Peripheral Controllers  Integrated LCD and video display controllers plus DRAM controller support to simplify graphics and memory interfacing.
  • Serial and Bus Interfaces  Includes USB 1.x channel, I2C, serial communication controllers and serial peripheral interface options; one 10 Mbps Ethernet interface supported.
  • DMA and I/O Acceleration  Virtual DMA channels and a DMA accelerator in the CPM enable efficient memory‑to‑memory and memory‑to‑I/O transfers.
  • Power and I/O  3.3 V I/O boundary as specified; designed for lower power operation in mobile and portable systems.
  • Package and Mounting  256‑pin PBGA (23×23) package, surface‑mount suitable for compact embedded assemblies.
  • Operating Range and Compliance  Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.

Typical Applications

  • Portable imaging devices  On‑chip CPM and video/LCD controllers provide direct support for image capture and display processing in handheld equipment.
  • Personal communications  Integrated USB, serial channels and CPM offload make the device suited for personal communication and mobile data products.
  • Compact embedded systems  Single‑chip integration of CPU, peripheral controllers and DMA reduces BOM and PCB footprint for space‑constrained designs.
  • Consumer electronics  Consumer‑grade qualification and multimedia peripherals support a range of consumer products requiring display and I/O integration.

Unique Advantages

  • Integrated communication and processing  The combination of a PowerPC core and a dedicated CPM enables concurrent application and communications processing to simplify firmware partitioning.
  • Reduced system complexity  On‑chip display, USB, serial interfaces and DRAM controller minimize external components and board‑level integration effort.
  • Efficient I/O transfers  Virtual DMA and DMA acceleration lower CPU overhead for memory and I/O operations, helping conserve power and improve responsiveness.
  • Compact, manufacturable package  256‑pin PBGA (23×23) surface‑mount package is suitable for compact embedded assemblies and automated production.
  • Designed for portable applications  3.3 V I/O and low‑power design elements make the device appropriate for battery‑conscious and portable system designs.

Why Choose KMPC823VR66B2T?

The KMPC823VR66B2T positions itself as a highly integrated microprocessor solution for embedded and consumer designs that require combined application processing, communications handling and display support. With a PowerPC core paired with a RISC‑based communication processor module and a broad set of on‑chip peripherals, this part helps reduce BOM count and simplifies system architecture for compact devices.

Its consumer qualification, RoHS compliance, and 0 °C to 95 °C operating range make it suitable for a range of portable and consumer electronics projects where integration, efficiency and compact packaging are priorities.

Request a quote or submit a pricing inquiry today to check availability and lead times for the KMPC823VR66B2T.

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