KMPC823VR66B2T
| Part Description |
PowerPC Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 256-PBGA (23x23) |
|---|---|
| Quantity | 409 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC823 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; RISC CPM | Core Processor | PowerPC | Device Package | 256-PBGA (23x23) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Video | ECCN | 3A001A3 | Ethernet | 10Mbps (1) | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | ||
| Operating Temperature | 0°C ~ 95°C (TA) | Package / Case | 256-BBGA | RAM Controllers | DRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Speed | 66MHz | ||
| Supplier Device Package | 256-PBGA (23×23) | USB | USB 1.x (1) | Voltage – I/O | 3.3V |
Overview of KMPC823VR66B2T – IC MPU MPC8XX 66MHZ 256BGA
The KMPC823VR66B2T is an NXP Semiconductors PowerPC-based microprocessor in the MPC823 family, delivered in a 256‑pin PBGA (23×23) package. It integrates a single 32‑bit PowerPC core running at 66 MHz with an on‑chip communication processor module and a set of peripherals targeted at embedded and consumer applications.
Designed for low‑power, portable and image capture or personal communication products, the device combines processor performance with integrated I/O and display controllers to reduce board-level complexity and support compact system designs.
Key Features
- Core PowerPC single‑issue 32‑bit core; 1 core at 66 MHz as specified for this part.
- Communication Processor Module (CPM) On‑chip RISC CPM for communications and embedded signal processing; offloads peripheral and protocol tasks from the PowerPC core.
- Memory and MMU On‑chip caches and memory management features described for the MPC823 series, including instruction and data caches and translation lookaside buffers for virtual memory support.
- Peripheral Controllers Integrated LCD and video display controllers plus DRAM controller support to simplify graphics and memory interfacing.
- Serial and Bus Interfaces Includes USB 1.x channel, I2C, serial communication controllers and serial peripheral interface options; one 10 Mbps Ethernet interface supported.
- DMA and I/O Acceleration Virtual DMA channels and a DMA accelerator in the CPM enable efficient memory‑to‑memory and memory‑to‑I/O transfers.
- Power and I/O 3.3 V I/O boundary as specified; designed for lower power operation in mobile and portable systems.
- Package and Mounting 256‑pin PBGA (23×23) package, surface‑mount suitable for compact embedded assemblies.
- Operating Range and Compliance Consumer qualification with an operating temperature range of 0 °C to 95 °C and RoHS compliance.
Typical Applications
- Portable imaging devices On‑chip CPM and video/LCD controllers provide direct support for image capture and display processing in handheld equipment.
- Personal communications Integrated USB, serial channels and CPM offload make the device suited for personal communication and mobile data products.
- Compact embedded systems Single‑chip integration of CPU, peripheral controllers and DMA reduces BOM and PCB footprint for space‑constrained designs.
- Consumer electronics Consumer‑grade qualification and multimedia peripherals support a range of consumer products requiring display and I/O integration.
Unique Advantages
- Integrated communication and processing The combination of a PowerPC core and a dedicated CPM enables concurrent application and communications processing to simplify firmware partitioning.
- Reduced system complexity On‑chip display, USB, serial interfaces and DRAM controller minimize external components and board‑level integration effort.
- Efficient I/O transfers Virtual DMA and DMA acceleration lower CPU overhead for memory and I/O operations, helping conserve power and improve responsiveness.
- Compact, manufacturable package 256‑pin PBGA (23×23) surface‑mount package is suitable for compact embedded assemblies and automated production.
- Designed for portable applications 3.3 V I/O and low‑power design elements make the device appropriate for battery‑conscious and portable system designs.
Why Choose KMPC823VR66B2T?
The KMPC823VR66B2T positions itself as a highly integrated microprocessor solution for embedded and consumer designs that require combined application processing, communications handling and display support. With a PowerPC core paired with a RISC‑based communication processor module and a broad set of on‑chip peripherals, this part helps reduce BOM count and simplifies system architecture for compact devices.
Its consumer qualification, RoHS compliance, and 0 °C to 95 °C operating range make it suitable for a range of portable and consumer electronics projects where integration, efficiency and compact packaging are priorities.
Request a quote or submit a pricing inquiry today to check availability and lead times for the KMPC823VR66B2T.

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