KMPC8245TZU350D

The KMPC8245TZU350D is a PowerPC 603e-based microprocessor from NXP Semiconductors, offered as a single 32-bit core running at 350 MHz. Designed for embedded applications, the device integrates an SDRAM controller and common peripheral interfaces to support system-level integration in industrial environments.

With 3.3 V I/O compatibility, a compact 352-TBGA (35×35) package and an industrial operating temperature range of −40 °C to 105 °C, this MPU is targeted at embedded system designers requiring a compact, industry-qualified processing element.

Key Features

• Core  PowerPC 603e single-core, 32-bit architecture operating at 350 MHz, providing a defined processing clock rate for embedded workloads.
• Memory and Controllers  Integrated SDRAM controller to interface with external SDRAM memories for system memory needs.
• Interfaces  Includes I2C for peripheral and system control communications.
• Power and I/O  3.3 V I/O voltage level compatibility for common embedded interfaces and system interconnects.
• Package and Mounting  352-TBGA (35×35) supplier device package in a 352-LBGA footprint, designed for surface-mount assembly.
• Qualification and Temperature  Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant to support regulatory environmental requirements.

Typical Applications

• Industrial Control  Used as the processing element in control systems where industrial temperature range and system integration are required.
• Embedded Communications  Suitable for embedded networking and protocol handling that leverage the 350 MHz PowerPC core and SDRAM controller.
• OEM System Controllers  Applied as a central controller in OEM equipment that requires a compact BGA package and 3.3 V I/O compatibility.

Unique Advantages

• Deterministic 350 MHz Clock  A defined 350 MHz core frequency provides predictable processing throughput for embedded designs.
• Industrial Temperature Rating  Rated from −40 °C to 105 °C to meet the thermal demands of industrial deployments.
• Integrated SDRAM Controller  On-chip SDRAM controller simplifies memory subsystem design and reduces external controller requirements.
• Compact Surface-Mount Package  352-TBGA (35×35) package offers a high-density footprint suitable for space-constrained boards.
• Standard 3.3 V I/O  3.3 V I/O voltage simplifies interfacing with common embedded peripherals and legacy boards.
• RoHS Compliant  Meets RoHS environmental requirements for regulatory and procurement needs.

Why Choose KMPC8245TZU350D?

The KMPC8245TZU350D positions a PowerPC 603e core, SDRAM controller, and standard peripheral interface set into a compact 352-TBGA package, delivering a balanced combination of processing capability and system integration for embedded and industrial applications. Its industrial qualification and wide operating temperature range make it suitable for designs that require robustness across varied environments.

Backed by NXP Semiconductors, this microprocessor is appropriate for engineers and OEMs building compact, industrially rated embedded systems that need a defined 350 MHz processing element, SDRAM support, and 3.3 V I/O compatibility.

Request a quote or submit a procurement inquiry to learn more about availability, pricing, and lead times for the KMPC8245TZU350D.