UCB1H330MNL1GS

The UCB1H330MNL1GS is a chip-type aluminum electrolytic capacitor in a radial, can-style SMD package. It delivers 33 µF capacitance at a 50 V rated voltage and is designed for surface-mount assembly using carrier tape for automatic placement.

Engineered for elevated-temperature operation, this part is specified for -25 °C to +105 °C and offers a rated load life of 7000 hours at +105 °C. It is RoHS compliant and AEC-Q200 qualified. Note: this product is scheduled for discontinuation and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 33 µF nominal capacitance with a 50 V rated voltage and ±20% tolerance, suitable where mid-range capacitance and higher voltage handling are required.
• Long-life, High-temperature Rating — Rated for operation from -25 °C to +105 °C with a load life specification of 7000 hours at +105 °C.
• Automotive Qualification — AEC-Q200 qualified and listed for automotive applications in the product data.
• Surface-mount, Tape-fed Assembly — Chip-type radial can SMD package designed for automatic mounting machines fed with carrier tape; recommended land pattern L: 8.3 × W: 8.3 mm.
• Ripple Performance — Ripple current ratings provided for low and high frequencies: 77 mA at 120 Hz and 115.5 mA at 10 kHz.
• Regulatory Compliance — Compliant with the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Specified for automotive use and AEC-Q200 qualified, suitable where temperature endurance and component qualification are required.
• Surface-mount Power Assemblies — Chip-type, tape-fed SMD format enables automated placement in compact power and control modules.
• High-temperature Environments — Rated and endurance-tested for continuous operation at elevated temperatures up to +105 °C (7000 h load life).

Unique Advantages

• Long-life assurance: 7000 hours rated load life at +105 °C provides predictable aging characteristics for thermal stress environments.
• Automated assembly ready: Designed for carrier-tape feeding and automatic mounting to streamline PCB production and reduce assembly complexity.
• Automotive-grade qualification: AEC-Q200 qualification supports deployment in qualified automotive applications as defined by the product data.
• Compact SMD can package: Chip-type radial can SMD footprint (L: 1.0 × D: 0.8 cm) and defined land size (8.3 × 8.3 mm) aid in space-constrained board layouts.
• Regulatory compliance: RoHS compliance supports use in regulated manufacturing environments.

Why Choose UCB1H330MNL1GS?

The UCB1H330MNL1GS combines a compact chip-type SMD can with automotive-grade qualification and extended high-temperature endurance. Its specified 33 µF/50 V rating, explicit ripple current figures, and tape-fed surface-mount form factor make it suitable for designs that require validated performance under elevated temperatures and automated assembly processes.

This part is appropriate for teams seeking a proven electrolytic solution backed by clear specification data and regulatory compliance. Note that the product is scheduled for discontinuation and is not recommended for new designs; evaluate current availability and lifecycle considerations before specifying.

Request a quote or submit an availability inquiry to receive pricing and current stock information for UCB1H330MNL1GS.