UCD1A221MCL6GS

The UCD1A221MCL6GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface mounting on high‑density printed circuit boards. It delivers 220 µF nominal capacitance at a 10 V rating in a compact φ8 × 6.2 mm SMD can package and is produced in carrier tape for automatic placement.

Engineered for demanding environments, the device is RoHS compliant and AEC‑Q200 qualified, supports an operating temperature range of −55 °C to +105 °C, and provides industry‑relevant endurance (2000 hours at 105 °C) for reliable operation in regulated systems.

Key Features

• Core Type Chip‑type, low‑impedance aluminum electrolytic capacitor optimized for surface mount assembly.
• Capacitance & Voltage 220 µF nominal capacitance with tolerance −20% to +20% at 120 Hz, 20 °C; rated voltage 10 V.
• Electrical Performance Low impedance specification of 260 mΩ and tangent of loss angle (tan δ) of 0.19 (measured at 10 V, 120 Hz, 20 °C).
• Ripple & Leakage Low‑frequency ripple current 150 mA (120 Hz), high‑frequency ripple current 300 mA (10 kHz), and leakage current specified at 22 µA.
• Reliability & Endurance Rated for 2000 hours at 105 °C; AEC‑Q200 qualified for applications requiring automotive‑grade reliability.
• Package & Mounting Surface mount radial can (SMD) in φ8 × 6.2 mm size, supplied in embossed carrier taping. Recommended land size L × W: 8.3 × 8.3 mm.
• Environmental RoHS compliant.

Typical Applications

• Automotive Electronics Suited for automotive electronic modules where AEC‑Q200 qualification and extended temperature range (−55 °C to +105 °C) are required.
• High‑Density Surface‑Mount Assemblies Designed for placement on high‑density PCBs where compact SMD components and embossed carrier tape feeding are used.
• Automated SMT Production Compatible with automatic mounting machines and carrier‑tape handling for volume production and repeatable assembly.

Unique Advantages

• Low Impedance Performance: 260 mΩ impedance and a tan δ of 0.19 at 10 V / 120 Hz deliver predictable AC behavior for power filtering and decoupling requirements.
• Compact SMD Form Factor: φ8 × 6.2 mm can package and surface‑mount compatibility minimize board area while supporting automated placement.
• Automotive‑Grade Reliability: AEC‑Q200 qualification and 2000 hours endurance at 105 °C provide validated reliability for regulated and harsh environments.
• High Ripple Handling: Specified ripple currents of 150 mA (120 Hz) and 300 mA (10 kHz) enable stable operation across low and high frequency stress conditions.
• Manufacturing‑Ready Packaging: Embossed carrier taping and surface‑mount land recommendations support high‑throughput SMT assembly processes.
• Standards Compliance: RoHS compliance supports regulatory requirements for many commercial and industrial designs.

Why Choose UCD1A221MCL6GS?

The UCD1A221MCL6GS balances compact size with electrical performance and endurance, making it suitable for designs that need a low‑impedance SMD aluminum electrolytic capacitor with automotive‑grade reliability. Its combination of 220 µF capacitance at 10 V, specified impedance and loss characteristics, and rated endurance at elevated temperature positions it for use in robust, high‑density electronic assemblies.

This part is a practical choice for engineers designing systems that require predictable ripple handling, automated assembly compatibility, and compliance with RoHS and AEC‑Q200 requirements. Its supplied embossed carrier taping and surface‑mount form factor support production scalability and consistent manufacturing yields.

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