AS4C4M16SA-6BIN

IC DRAM 64MBIT PARALLEL 54TFBGA
Part Description

IC DRAM 64MBIT PARALLEL 54TFBGA

Quantity 155 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerAlliance Memory, Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time8 Weeks
Datasheet

Specifications & Environmental

Device Package54-TFBGA (8x8)Memory FormatDRAMTechnologySDRAM
Memory Size64 MbitAccess Time5.4 nsGradeIndustrial
Clock Frequency166 MHzVoltage3V ~ 3.6VMemory TypeVolatile
Operating Temperature-40°C ~ 85°C (TA)Write Cycle Time Word PageN/APackaging54-TFBGA
Mounting MethodVolatileMemory InterfaceParallelMemory Organization4M x 16
Moisture Sensitivity Level3 (168 Hours)RoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
QualificationN/AECCNEAR99HTS Code8542.32.0002

Overview of AS4C4M16SA-6BIN - 64Mbit SDRAM in Compact TFBGA Package

The AS4C4M16SA-6BIN is a 64-megabit synchronous dynamic random access memory (SDRAM) from Alliance Memory, Inc. Organized as 4M x 16, this parallel interface DRAM delivers reliable high-speed data storage for embedded systems and industrial applications. With a 166 MHz clock frequency and 5.4 ns access time, it provides efficient memory performance in a space-saving 54-TFBGA package.

Designed for extended temperature operation from -40°C to 85°C, this SDRAM meets the demands of industrial environments where consistent performance is critical. The compact 8x8mm TFBGA footprint enables high-density board designs while maintaining robust data integrity.

Key Features

  • Memory Architecture - 64-megabit capacity organized as 4M x 16 configuration provides flexible data width for 16-bit bus architectures commonly used in embedded processors and microcontrollers.
  • Performance Specifications - 166 MHz clock frequency with 5.4 ns access time delivers fast synchronous data transfers suitable for real-time applications and high-bandwidth operations.
  • Voltage Operation - Standard 3V to 3.6V supply voltage aligns with common embedded system power rails, simplifying power supply design and reducing component count.
  • Temperature Range - Extended -40°C to 85°C operating range ensures reliable operation in industrial, instrumentation, and outdoor equipment installations.
  • Package Format - 54-pin TFBGA in compact 8x8mm footprint saves valuable board space compared to traditional TSOP packages while maintaining robust signal integrity.
  • Interface Type - Parallel SDRAM interface provides deterministic timing and simple integration with a wide range of processors and FPGAs without complex serial protocols.

Typical Applications

  • Industrial Control Systems - This SDRAM provides working memory for programmable logic controllers (PLCs), distributed control systems, and human-machine interfaces where the extended temperature range ensures stable operation in factory floor environments.
  • Embedded Computing - The 4M x 16 organization matches common 16-bit processor architectures in networking equipment, point-of-sale terminals, and automation controllers, providing cost-effective main memory or frame buffers.
  • Instrumentation and Test Equipment - The SDRAM's fast access time and parallel interface support high-speed data acquisition and waveform storage in oscilloscopes, logic analyzers, and automated test systems.
  • Telecommunications Infrastructure - This memory serves as packet buffering and routing table storage in base stations, small cell equipment, and network switches where the compact TFBGA package enables high port density.
  • Medical Devices - The device provides data storage for patient monitoring systems, diagnostic equipment, and portable medical instruments where reliable operation across temperature variations is essential.

Unique Advantages

  • Space-efficient footprint: The 8x8mm TFBGA package reduces PCB area requirements by up to 40% compared to equivalent TSOP packages, enabling more compact product designs.
  • Simplified power management: Standard 3V to 3.6V operation eliminates the need for additional voltage regulators, reducing bill of materials cost and board complexity.
  • Wide availability: Active lifecycle status ensures long-term supply continuity for products with multi-year production cycles, reducing redesign risk and qualifying costs.
  • Proven SDRAM technology: Synchronous interface simplifies timing design and reduces glue logic compared to asynchronous DRAM, lowering development time and improving system reliability.
  • Industrial temperature qualification: Extended -40°C to 85°C range eliminates the need for temperature management in harsh environments, reducing system cost and improving reliability.
  • 16-bit native width: Direct 16-bit organization avoids the complexity and latency of memory interleaving or byte-lane multiplexing required with x8 devices.

Why Choose AS4C4M16SA-6BIN?

The AS4C4M16SA-6BIN represents an optimal choice for embedded designs requiring reliable, cost-effective memory in space-constrained applications. Its combination of proven SDRAM technology, industrial temperature range, and compact TFBGA packaging addresses the core requirements of industrial automation, instrumentation, and infrastructure equipment. Engineers benefit from straightforward integration with common 16-bit processor architectures and the design security of an active product with long-term availability.

This SDRAM is particularly well-suited for designs that prioritize board space efficiency, thermal performance, and supply chain stability. The parallel interface provides deterministic timing and simple integration, making it ideal for cost-sensitive applications where development time and component count matter.

Get Started with AS4C4M16SA-6BIN

Our technical sales team can provide detailed specifications, reference designs, and pricing information to support your project requirements. Contact us to request a quote or discuss how this SDRAM solution can meet your specific application needs.

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