EN35QXR256A-104FIP(2SC)
| Part Description |
256 Mbit SPI NOR Flash, 16‑pin SOP |
|---|---|
| Quantity | 1,362 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 16-pin SOP 300mil | Memory Format | DRAM | Technology | SPI NOR Flash | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 256 Mbit | Access Time | 8 ns | Grade | Industrial | ||
| Clock Frequency | 104 MHz | Voltage | 2.5V | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C – 85°C | Write Cycle Time Word Page | 500 µs | Packaging | 16-pin SOP 300mil | ||
| Mounting Method | Surface Mount | Memory Interface | Parallel | Memory Organization | 32M x 8 | ||
| Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | REACH Compliance | REACH Unknown | ||
| Qualification | N/A | ECCN | EAR99 | HTS Code | 8542.32.00.71 |
Overview of EN35QXR256A-104FIP(2SC) – 256 Mbit SPI NOR Flash, 16‑pin SOP
The EN35QXR256A-104FIP(2SC) is a 256 Mbit serial SPI NOR flash memory device designed for industrial-temperature embedded systems. It implements a serial interface architecture with support for Standard, Dual and Quad SPI modes and delivers fast read performance for code and data storage in constrained environments.
With a single-supply 2.7–3.6 V operating range, uniform 4-Kbyte sectors, and industry-grade endurance and retention characteristics, this device is suited for firmware storage, field updates and secure data segments where robust program/erase cycles and long-term data retention are required.
Key Features
- Memory Capacity & Organization — 256 Mbit (32,768 KByte) memory organized as 32M × 8 with 131,072 pages and 256 bytes per programmable page.
- Serial SPI Interface — Supports Standard, Dual and Quad SPI (CLK, CS#, DI, DO, DQ₂, DQ₃) with default QE=1 and WP#/HOLD# disabled for Quad I/O operation.
- High-Speed Read — Fast read operation up to 104 MHz for Single/Dual/Quad I/O and up to 133 MHz for Quad I/O Fast Read.
- Single-Supply Operation — Full operating voltage range 2.7–3.6 V for flexible system integration.
- Low Power — Typical active current ~12 mA and typical power-down current ~1 μA for energy-conscious designs.
- Program / Erase Performance — Typical page program time 0.5 ms; sector erase ~40 ms; half-block and block erase times around 200 ms and 300 ms respectively; chip erase ~120 s typical.
- Uniform Sector Architecture — 8,192 uniform 4-Kbyte sectors (also supports 32-Kbyte and 64-Kbyte block sizes) allowing flexible erase granularity and in-field updates.
- Reliability & Security — Minimum 100K program/erase cycles per sector, 20-year data retention, lockable 3×512 byte OTP security sector, Read Unique ID and Replay-Protected Monotonic Counter (RPMC).
- Addressing & Standards — Supports 3‑byte and 4‑byte address modes and SFDP (Serial Flash Discoverable Parameters) signature for interoperability.
- Package & Temperature — Available in industry-grade 16‑pin SOP 300 mil package with operating temperature range −40 °C to 85 °C and surface‑mount mounting.
Typical Applications
- Firmware & Code Storage — Reliable storage for system firmware and boot code with uniform sectors that support subroutine or module patching.
- Field Upgrades & Patching — Sector-level erase and program speeds suitable for in-field firmware updates and incremental code patches.
- Secure Data Segments — Lockable OTP and RPMC features for protected storage of device-specific data and counters.
- Industrial Embedded Systems — Industrial temperature range and robust endurance make it suitable for long-life embedded applications.
Unique Advantages
- Flexible I/O Modes: Standard, Dual and Quad SPI support enables scalable throughput for diverse system requirements.
- Fast Read Performance: Up to 104 MHz (and 133 MHz for Quad I/O Fast Read) reduces code fetch latency in performance-sensitive designs.
- Fine-Grained Erase Control: 4-Kbyte uniform sectors and multiple block sizes simplify firmware update strategies and minimize erase scope.
- Low Power Standby: Sub‑microamp power-down current helps maintain low overall system power when flash access is idle.
- Proven Longevity: 100K program/erase cycles and 20 years data retention support long-term product lifecycles.
- Industrial-Grade Packaging: 16‑pin SOP 300 mil surface-mount package with −40 °C to 85 °C rating fits a wide range of board-level designs.
Why Choose EN35QXR256A-104FIP(2SC)?
The EN35QXR256A-104FIP(2SC) combines high-density serial NOR flash architecture, flexible SPI I/O modes and industry-grade reliability to meet the needs of embedded and industrial designs that require field-update capability, secure data segments and long-term retention. Its uniform sector layout and proven program/erase endurance make it practical for systems that perform targeted firmware patches or maintain protected data regions.
This device is well suited for engineers specifying non-volatile code and data storage where predictable program/erase timings, low-power standby and standard SPI interoperability are important design criteria.
Request a quote or submit an inquiry to get pricing, lead-time information and technical support for EN35QXR256A-104FIP(2SC).
Date Founded: 1998
Headquarters: Hsinchu Science Park, Hsinchu, Taiwan
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