FEMC008GMA-E440

XTRA III 5.1 153ball eMMC (MLC/pSLC)
Part Description

FEMC008GMA-E440 8GB eMMC 5.1 MLC

Quantity 609 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package153-FBGAMemory FormatFLASHTechnologyMLC
Memory Size64 GbitGradeAutomotive grade 3Clock FrequencyN/A
VoltageVCCQ: 1.8V/3.3V VCC: 3.3VMemory TypeNon-VolatileOperating Temperature-25°C - 85°C
Packaging153-FBGAMounting MethodSurface MountMemory InterfaceeMMC 5.1
Memory Organization8G x 8Moisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationAEC-Q100 Grade 3ECCNEAR99
HTS Code8542.32.00.71

Overview of FEMC008GMA-E440 – 8GB Automotive-Grade eMMC 5.1 Embedded Flash Memory

The FEMC008GMA-E440 from Flexxon is an 8GB embedded MultiMediaCard (eMMC) storage solution built on eMMC 5.1 interface technology and MLC (Multi-Level Cell) NAND flash. As part of Flexxon's XTRA III 5.1 153-ball eMMC series, this device delivers 64 Gbit of non-volatile memory organized in an 8G × 8 configuration, packaged in a compact 153-FBGA surface-mount format. Designed to meet AEC-Q100 Grade 3 qualification standards and rated for automotive-grade operation from -25°C to 85°C, the FEMC008GMA-E440 is engineered for embedded applications where reliable, long-term data storage is critical.

This embedded flash memory module combines the performance benefits of eMMC 5.1 architecture with the endurance characteristics of MLC technology, making it well-suited for industrial control systems, automotive infotainment, telematics, and edge computing devices that demand consistent read/write performance and robust environmental tolerance.

Key Features

  • 8GB MLC NAND Flash Storage
    Delivers 64 Gbit of non-volatile memory with MLC technology, offering a balance of density, endurance, and cost-effectiveness for embedded applications requiring persistent data retention.
  • eMMC 5.1 Interface
    Provides a standardized, high-performance memory interface that simplifies integration, reduces design complexity, and ensures compatibility with a wide range of host controllers.
  • Automotive-Grade Quality and Qualification
    AEC-Q100 Grade 3 qualified and rated for -25°C to 85°C operation, this device meets stringent automotive industry standards for reliability and environmental resilience.
  • Dual Voltage Support
    Operates with VCC at 3.3V and VCCQ configurable for either 1.8V or 3.3V, offering flexible integration into systems with varying I/O voltage requirements.
  • Compact 153-Ball FBGA Package
    Surface-mount 153-FBGA package delivers a small footprint ideal for space-constrained designs while maintaining robust solder joint reliability for industrial and automotive environments.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, supporting eco-conscious design and regulatory requirements for global markets.

Typical Applications

  • Automotive Infotainment and Telematics
    Provides reliable, high-capacity storage for navigation databases, multimedia content, user settings, and vehicle diagnostics data in connected car systems.
  • Industrial Control and Automation
    Stores firmware, configuration files, operational logs, and sensor data for programmable logic controllers (PLCs), human-machine interfaces (HMIs), and edge gateways operating in factory automation environments.
  • Transportation and Fleet Management
    Serves as embedded storage for onboard computers, dashcams, fleet tracking systems, and transit vehicle control units that require dependable data retention across wide temperature ranges.
  • Building Automation and Smart Infrastructure
    Enables persistent storage of control logic, event logs, and system configurations for HVAC controllers, access control systems, and energy management devices.
  • Medical and Healthcare Devices
    Supports embedded storage needs in diagnostic equipment, patient monitoring systems, and portable medical devices where data integrity and long-term reliability are essential.

Unique Advantages

  • Simplified Integration with eMMC 5.1 Standard:
    The standardized eMMC 5.1 interface reduces development time and risk by providing a well-documented, widely supported protocol that eliminates the need for custom NAND controller design and wear-leveling software.
  • Enhanced Endurance with MLC Technology:
    MLC flash architecture offers higher program/erase cycle endurance compared to TLC alternatives, extending product lifetime and reducing field maintenance requirements for write-intensive applications.
  • Automotive-Qualified Reliability:
    AEC-Q100 Grade 3 qualification provides design confidence for automotive and industrial systems, ensuring the device has passed rigorous stress testing for thermal cycling, moisture resistance, and long-term reliability.
  • Flexible I/O Voltage Configuration:
    Dual VCCQ voltage support (1.8V/3.3V) allows seamless integration into both legacy 3.3V systems and modern low-voltage designs, reducing the need for level shifters and simplifying PCB layout.
  • Wide Operating Temperature Range:
    Rated for -25°C to 85°C operation, the FEMC008GMA-E440 maintains stable performance across industrial and automotive temperature extremes without requiring active cooling or thermal management.
  • Compact, Space-Efficient Form Factor:
    The 153-ball FBGA package minimizes board real estate while maintaining excellent thermal and electrical performance, enabling higher-density designs in size-constrained applications.

Why Choose the FEMC008GMA-E440?

The FEMC008GMA-E440 combines proven eMMC 5.1 technology with automotive-grade quality and MLC endurance, making it an ideal choice for designers developing industrial, automotive, and edge computing systems that demand long-term reliability and consistent performance. Its AEC-Q100 Grade 3 qualification and -25°C to 85°C operating range ensure robust operation in challenging thermal environments, while the standardized eMMC interface accelerates time-to-market by eliminating the complexity of raw NAND integration.

With 8GB of non-volatile storage, dual voltage I/O support, and a compact surface-mount package, the FEMC008GMA-E440 delivers the capacity, flexibility, and ruggedness required for mission-critical embedded applications. Whether you're designing next-generation automotive systems, industrial controllers, or connected infrastructure devices, this embedded flash memory module provides the foundation for reliable, scalable data storage.

Ready to integrate reliable automotive-grade eMMC storage into your next design? Request a quote today to learn more about how the FEMC008GMA-E440 can meet your embedded memory requirements.

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    Date Founded: 2007


    Headquarters: Singapore


    Employees: 51-200


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