MTFC8GAMALNA-AIT
| Part Description |
IC FLASH 64GBIT MMC 100TBGA |
|---|---|
| Quantity | 758 Available (as of May 5, 2026) |
| Product Category | Memory |
|---|---|
| Manufacturer | Micron Technology Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 100-TBGA (14x18) | Memory Format | FLASH | Technology | FLASH - NAND | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 64 Gbit | Access Time | N/A | Grade | Automotive | ||
| Clock Frequency | N/A | Voltage | N/A | Memory Type | Non-Volatile | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Write Cycle Time Word Page | N/A | Packaging | 100-TBGA | ||
| Mounting Method | Non-Volatile | Memory Interface | MMC | Memory Organization | 8G x 8 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Qualification | N/A | ECCN | 3A991B1A | HTS Code | 8542.32.0071 |
Overview of MTFC8GAMALNA-AIT – IC FLASH 64GBIT MMC 100TBGA
The MTFC8GAMALNA-AIT is a 64 Gbit non-volatile NAND flash memory in an e•MMC™ configuration. It provides a 8G × 8 memory organization with an MMC interface in a compact 100-TBGA (14×18) package.
This device is suited for designs that require embedded flash storage with a wide operating temperature range (−40°C to 85°C) and a small-footprint BGA package, enabling integration into space-constrained systems.
Key Features
- Memory Core 64 Gbit NAND flash memory organized as 8G × 8 for high-density non-volatile storage.
- Memory Interface MMC interface configured for embedded memory applications using the e•MMC™ series specification.
- Package 100-TBGA package (14×18 mm) provides a compact footprint for board-level integration.
- Operating Temperature Range Specified for operation from −40°C to 85°C (TA), suitable for designs requiring extended ambient temperature capability.
- Memory Format & Organization FLASH - NAND memory format with an 8G × 8 organization designed for embedded storage use.
- Mounting / Supplier Package Supplied in a 100-TBGA (14×18) device package for surface-mount assembly.
Typical Applications
- Embedded Storage Non-volatile MMC flash for systems that require onboard storage in a compact BGA package.
- Firmware and Boot Storage NAND flash memory storage for firmware, boot code, and system images that must persist across power cycles.
- Industrial and Ruggedized Electronics Memory solutions for applications needing a wide ambient operating temperature range (−40°C to 85°C).
Unique Advantages
- High-density NAND Flash: 64 Gbit capacity enables substantial on-board storage within a small physical footprint.
- MMC Interface Simplifies Integration: e•MMC™ interface reduces system-level integration complexity for embedded memory applications.
- Compact BGA Package: 100-TBGA (14×18) package saves board space and supports high-density system designs.
- Extended Temperature Range: Rated for −40°C to 85°C, supporting deployments across a broad range of ambient conditions.
- Non-Volatile Storage: NAND FLASH technology provides persistent data retention for firmware and user data storage.
Why Choose MTFC8GAMALNA-AIT?
The MTFC8GAMALNA-AIT combines 64 Gbit NAND flash density with an MMC interface and a compact 100-TBGA package, positioned for designs that require embedded, non-volatile storage with extended temperature capability. Its memory organization and form factor make it appropriate for projects where board space and persistent storage are key considerations.
This device is a straightforward choice for engineers specifying e•MMC™ flash in space-constrained systems that operate across a wide temperature range, offering a clear path to integrate sizable on-board storage with a standardized memory interface.
Request a quote or submit an inquiry to obtain pricing, lead times, and availability for the MTFC8GAMALNA-AIT.
