AM1808EZCE3

The AM1808EZCE3 is a Sitara AM18xx series microprocessor from Texas Instruments featuring a single ARM926EJ-S 32-bit core running at 375 MHz. It integrates memory controllers, a broad set of connectivity and storage interfaces, and a programmable real-time unit subsystem, making it suitable for embedded designs that require a compact, well-connected application processor in a 361-ball NFBGA (13×13) package.

Key Features

• Core  Single ARM926EJ-S 32-bit RISC core operating at 375 MHz with ARM9 memory architecture and ARM Jazelle support.
• Memory Subsystems  Dual external memory interfaces (EMIFA) with support for DDR2/mDDR and LPDDR; NOR and NAND support via EMIF for flexible boot and code/data storage.
• On-chip Memory and Caches  16 KB instruction cache, 16 KB data cache, 64 KB on-chip ROM, 128 KB on-chip memory, and small dedicated RAM blocks (including 8 KB vector table RAM and per-PRU RAM) for low-latency code and data.
• Programmable Real-Time Unit Subsystem (PRUSS)  Two independent PRU cores with dedicated instruction/data RAM; the PRUSS can be disabled via software to reduce power consumption.
• Enhanced DMA  EDMA3 controller with multiple transfer controllers, 64 independent DMA channels and 16 quick DMA channels for high-performance peripheral-to-memory data movement.
• Connectivity and Serial Peripherals  Multiple UARTs (three configurable 16550-type), two SPI interfaces, I2C master/slave support, MMC/SD/SDIO with secure data I/O, and an HPI (host-port interface) with a 16-bit multiplexed address/data bus.
• USB and Storage  Integrated USB 2.0 OTG port with PHY plus USB 1.1 OHCI host with integrated PHY; single SATA 3 Gbps interface for high-speed storage connectivity.
• Networking and Display  10/100 Mbps Ethernet MAC and an integrated LCD controller for display subsystem support.
• Timers, PWM and Audio  Multiple general-purpose timers and watchdog, enhanced PWM modules, and an audio serial port with oversampling options for multimedia and control tasks.
• Power Management and IO  1.8 V or 3.3 V LVCMOS I/O (exceptions for USB and DDR2), standard power management mechanisms with clock gating and PSC domains to support power optimization.
• Package and Temperature  361-ball NFBGA (13×13) surface-mount package, commercial grade with operating temperature range of 0 °C to 90 °C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the AM1808EZCE3 to handle real-time control tasks and fieldbus or Ethernet connectivity for machines and process controllers.
• Human-Machine Interfaces (HMIs)  Drive LCD displays and manage touch/key inputs while coordinating peripheral interfaces for interactive operator panels.
• Embedded Storage and Gateway Devices  Combine the SATA interface, USB OTG, and MMC/SD support to build compact storage-enabled gateways and data loggers.
• Communications and Networking Appliances  Utilize the integrated 10/100 Mbps Ethernet MAC and multiple serial interfaces for protocol bridging, device servers, and networked sensors.

Unique Advantages

• Integrated Peripheral Set: Consolidates Ethernet, USB OTG, SATA, MMC/SD, UART, SPI and I2C on one device to reduce BOM and simplify board design.
• Deterministic Real-Time Processing: The PRU subsystem provides separate programmable real-time cores for offloading time-critical tasks from the main CPU.
• Flexible Memory Options: Support for DDR2, mDDR, LPDDR, NOR and NAND through EMIFA enables scalable memory configurations for varied application needs.
• High-throughput DMA: EDMA3 with numerous channels and transfer controllers enables efficient, low-overhead data movement between peripherals and memory.
• Power Management Controls: Software-disableable PRU, clock gating and PSC domain control help optimize power usage in deployed systems.
• Compact, Surface-Mount Package: 361-ball NFBGA (13×13) delivers a dense footprint suitable for space-constrained embedded assemblies.

Why Choose AM1808EZCE3?

The AM1808EZCE3 positions a 375 MHz ARM926EJ-S core alongside a broad set of integrated peripherals and memory interfaces, offering a balanced combination of processing capability and system-level integration for compact embedded applications. Its programmable real-time subsystem, robust DMA engine, and support for mainstream memory types make it well suited to designs that require deterministic control, flexible storage options, and multiple connectivity paths in a single commercial-grade package.

Backed by Texas Instruments’ documented silicon and packaged in a 361-ball NFBGA, the AM1808EZCE3 delivers a clear upgrade path for projects that need an integrated application processor with on-chip resources and power management features to streamline system design and accelerate time to market.

Request a quote or submit an inquiry to get pricing and availability for the AM1808EZCE3 and support materials to evaluate the device in your designs.