AM3352ZCZD72

IC MPU SITARA 720MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 720MHz 324-NFBGA (15x15)

Quantity 593 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A002A1 TIEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed720MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3352ZCZD72 – IC MPU SITARA 720MHZ 324NFBGA

The AM3352ZCZD72 is an ARM® Cortex®-A8 Sitara™ microprocessor delivering a single 32-bit core at 720 MHz in a 324‑NFBGA (15×15) package. It targets embedded applications that require integrated connectivity, multimedia acceleration and industrial temperature operation.

With on-chip multimedia DSP/NEON SIMD acceleration, multiple memory-controller options and a broad set of peripheral interfaces, this device is suited for networked and human‑machine interface (HMI) designs in industrial and embedded markets.

Key Features

  • Core – Single ARM® Cortex®-A8 32‑bit core running at 720 MHz for general-purpose embedded processing.
  • Multimedia Acceleration – Integrated multimedia/DSP co-processor functionality with NEON™ SIMD support for media and signal-processing workloads.
  • Memory Controllers – Supports LPDDR, DDR2, DDR3 and DDR3L memory types to match a range of system memory requirements.
  • Display and Graphics – On-chip display interface controllers for LCD and touchscreen integration plus graphics acceleration for user interfaces.
  • Connectivity – Dual 10/100/1000 Mbps Ethernet ports and two USB 2.0 ports with PHY provide high-speed wired networking and peripheral connectivity; additional CAN interface for vehicle or industrial networks.
  • Security – Built-in cryptography and a random number generator to support device security functions.
  • Package and Mounting – 324‑NFBGA (15×15) supplier device package, surface-mount mounting type for compact board designs.
  • Operating Range – Industrial-grade operating temperature from –40 °C to 90 °C for harsh-environment deployments.

Typical Applications

  • Industrial Control – Dual Gigabit Ethernet and CAN support enable robust networking and fieldbus connectivity for control systems operating across an extended temperature range.
  • Human‑Machine Interfaces (HMI) – LCD/touchscreen controllers paired with graphics acceleration and NEON™ SIMD deliver responsive user interfaces and multimedia playback.
  • Embedded Networking Appliances – 10/100/1000 Mbps Ethernet ports and USB 2.0 with PHY support networked appliances and connected embedded devices.
  • Multimedia & Signal Processing – NEON™ SIMD and multimedia co-processor capabilities suit audio, video or signal-processing tasks within embedded platforms.

Unique Advantages

  • Single-chip integration: Combines processing, display controllers, security and multiple high-speed interfaces to reduce system BOM and simplify board-level design.
  • Flexible memory support: Compatibility with LPDDR, DDR2, DDR3 and DDR3L gives designers options to balance performance, power and cost.
  • Industrial temperature capability: –40 °C to 90 °C rating supports deployments in demanding environmental conditions.
  • High-speed wired connectivity: Dual 10/100/1000 Mbps Ethernet and dual USB 2.0 + PHY enable robust network and peripheral integration.
  • Hardware security primitives: On-chip cryptography and a random number generator help implement secure boot, encryption and trusted communications.
  • Compact BGA package: 324‑NFBGA (15×15) SMD package allows high‑density board layouts for space-constrained designs.

Why Choose AM3352ZCZD72?

The AM3352ZCZD72 positions itself as a high‑integration embedded MPU that pairs a 720 MHz Cortex‑A8 core with multimedia acceleration, broad memory compatibility and extensive connectivity. Its industrial temperature rating and surface‑mount 324‑NFBGA package make it appropriate for rugged embedded systems that require networking, UI and security features in a compact footprint.

Choose this device for designs that need predictable single‑core performance with integrated peripherals and hardware security primitives, particularly where operating temperature range and multiple memory/interface options are important design drivers within the Sitara AM335x family.

Request a quote or submit an RFQ to get pricing and availability details for the AM3352ZCZD72.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1930


    Headquarters: Dallas, Texas, USA


    Employees: 34,000+


    Revenue: $17.52 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up