AM3354BZCZ60
| Part Description |
ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15) |
|---|---|
| Quantity | 1,051 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | Sitara AM335x |
| Manufacturer | Texas Instruments |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 6 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ SIMD | Core Processor | ARM® Cortex®-A8 | Device Package | 324-NFBGA (15x15) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD, Touchscreen | ECCN | 5A992C | Ethernet | 10/100/1000Mbps (2) | ||
| Grade | Commercial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 90°C (TJ) | Package / Case | 324-LFBGA | ||
| RAM Controllers | LPDDR, DDR2, DDR3, DDR3L | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | Cryptography, Random Number Generator | Speed | 600MHz | Supplier Device Package | 324-NFBGA (15×15) | ||
| USB | USB 2.0 + PHY (2) | Voltage – I/O | 1.8V, 3.3V |
Overview of AM3354BZCZ60 – IC MPU SITARA 600MHZ 324NFBGA
The AM3354BZCZ60 is a Sitara™ microprocessor featuring a single ARM® Cortex®-A8 32‑bit core running at 600 MHz, designed for embedded applications. It integrates multimedia co‑processing (NEON™ SIMD), graphics acceleration and a broad set of peripheral interfaces for networked and human‑machine interface designs.
As a commercial‑grade, RoHS‑compliant surface‑mount device supplied in a 324‑NFBGA (15×15) package, this MPU targets embedded systems that require balanced compute performance, hardware acceleration and multiple high‑speed I/O options.
Key Features
- Core Single ARM® Cortex®‑A8 32‑bit core operating at 600 MHz for general application processing.
- Multimedia and DSP Includes multimedia co‑processor support and NEON™ SIMD for accelerated media and signal processing tasks.
- Memory Interfaces Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L memory types to support flexible memory subsystem choices.
- Display Display interface controllers for LCD and touchscreen enabling graphical user interfaces and touch control.
- High‑speed Networking Dual Ethernet interfaces supporting 10/100/1000 Mbps for wired network connectivity.
- USB Two USB 2.0 controllers with PHY for host and device connectivity.
- Additional Interfaces CAN interface for robust serial communications in embedded control systems.
- Security On‑chip cryptography and a random number generator to support secure communications and trusted functions.
- Package and Mounting Supplier device package: 324‑NFBGA (15×15); package case listed as 324‑LFBGA; surface mount mounting type.
- Operating Range and Grade Commercial grade device with an operating temperature range of 0 °C to 90 °C.
- Environmental RoHS compliant.
Typical Applications
- Embedded controllers Single‑core ARM processing for general embedded compute and control tasks in equipment and appliances.
- Graphical user interfaces LCD and touchscreen support combined with graphics acceleration for responsive HMI designs.
- Networked devices Dual gigabit Ethernet and USB 2.0 interfaces for connected devices, gateways and appliances requiring wired connectivity.
- Industrial control and connectivity CAN and multiple memory interface options for industrial control modules and communications endpoints.
Unique Advantages
- Balanced compute and media acceleration: Single 600 MHz Cortex‑A8 core with NEON SIMD and multimedia co‑processor support enables a mix of application and media processing without extra external accelerators.
- Broad memory support: Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L simplify BOM choices and support a range of performance and power targets.
- Versatile I/O set: Dual 10/100/1000 Mbps Ethernet, two USB 2.0 + PHY ports and CAN provide multiple high‑speed connectivity options on a single device.
- Secure foundations: Built‑in cryptography and a random number generator help implement secure communications and device integrity features.
- Compact surface‑mount package: 324‑NFBGA (15×15) package offers a dense footprint suitable for space‑constrained embedded boards.
- Commercial operating range and compliance: Commercial grade with a 0 °C to 90 °C operating range and RoHS compliance for standard embedded product lines.
Why Choose AM3354BZCZ60?
The AM3354BZCZ60 positions itself as a capable, integrated MPU for embedded designs that require a 600 MHz ARM® Cortex®‑A8 core alongside multimedia acceleration, comprehensive memory support and a wide range of connectivity options. Its integrated security primitives and compact 324‑NFBGA package make it suitable for designs that prioritize system integration and predictable thermal and mechanical packaging.
This part fits development and production projects where balanced processing, display capability, wired networking and standard commercial operating conditions are the key requirements. Its RoHS compliance and surface‑mount packaging support streamlined manufacturing and regulatory needs.
Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for the AM3354BZCZ60.

Date Founded: 1930
Headquarters: Dallas, Texas, USA
Employees: 34,000+
Revenue: $17.52 Billion
Certifications and Memberships: ISO9001:2015, ISO14001:2015, IATF16949:2016