AM3354BZCZ60

IC MPU SITARA 600MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 600MHz 324-NFBGA (15x15)

Quantity 1,051 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed600MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3354BZCZ60 – IC MPU SITARA 600MHZ 324NFBGA

The AM3354BZCZ60 is a Sitara™ microprocessor featuring a single ARM® Cortex®-A8 32‑bit core running at 600 MHz, designed for embedded applications. It integrates multimedia co‑processing (NEON™ SIMD), graphics acceleration and a broad set of peripheral interfaces for networked and human‑machine interface designs.

As a commercial‑grade, RoHS‑compliant surface‑mount device supplied in a 324‑NFBGA (15×15) package, this MPU targets embedded systems that require balanced compute performance, hardware acceleration and multiple high‑speed I/O options.

Key Features

  • Core  Single ARM® Cortex®‑A8 32‑bit core operating at 600 MHz for general application processing.
  • Multimedia and DSP  Includes multimedia co‑processor support and NEON™ SIMD for accelerated media and signal processing tasks.
  • Memory Interfaces  Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L memory types to support flexible memory subsystem choices.
  • Display  Display interface controllers for LCD and touchscreen enabling graphical user interfaces and touch control.
  • High‑speed Networking  Dual Ethernet interfaces supporting 10/100/1000 Mbps for wired network connectivity.
  • USB  Two USB 2.0 controllers with PHY for host and device connectivity.
  • Additional Interfaces  CAN interface for robust serial communications in embedded control systems.
  • Security  On‑chip cryptography and a random number generator to support secure communications and trusted functions.
  • Package and Mounting  Supplier device package: 324‑NFBGA (15×15); package case listed as 324‑LFBGA; surface mount mounting type.
  • Operating Range and Grade  Commercial grade device with an operating temperature range of 0 °C to 90 °C.
  • Environmental  RoHS compliant.

Typical Applications

  • Embedded controllers  Single‑core ARM processing for general embedded compute and control tasks in equipment and appliances.
  • Graphical user interfaces  LCD and touchscreen support combined with graphics acceleration for responsive HMI designs.
  • Networked devices  Dual gigabit Ethernet and USB 2.0 interfaces for connected devices, gateways and appliances requiring wired connectivity.
  • Industrial control and connectivity  CAN and multiple memory interface options for industrial control modules and communications endpoints.

Unique Advantages

  • Balanced compute and media acceleration: Single 600 MHz Cortex‑A8 core with NEON SIMD and multimedia co‑processor support enables a mix of application and media processing without extra external accelerators.
  • Broad memory support: Integrated controllers for LPDDR, DDR2, DDR3 and DDR3L simplify BOM choices and support a range of performance and power targets.
  • Versatile I/O set: Dual 10/100/1000 Mbps Ethernet, two USB 2.0 + PHY ports and CAN provide multiple high‑speed connectivity options on a single device.
  • Secure foundations: Built‑in cryptography and a random number generator help implement secure communications and device integrity features.
  • Compact surface‑mount package: 324‑NFBGA (15×15) package offers a dense footprint suitable for space‑constrained embedded boards.
  • Commercial operating range and compliance: Commercial grade with a 0 °C to 90 °C operating range and RoHS compliance for standard embedded product lines.

Why Choose AM3354BZCZ60?

The AM3354BZCZ60 positions itself as a capable, integrated MPU for embedded designs that require a 600 MHz ARM® Cortex®‑A8 core alongside multimedia acceleration, comprehensive memory support and a wide range of connectivity options. Its integrated security primitives and compact 324‑NFBGA package make it suitable for designs that prioritize system integration and predictable thermal and mechanical packaging.

This part fits development and production projects where balanced processing, display capability, wired networking and standard commercial operating conditions are the key requirements. Its RoHS compliance and surface‑mount packaging support streamlined manufacturing and regulatory needs.

Request a quote or submit an inquiry to receive pricing, lead‑time and availability information for the AM3354BZCZ60.

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