AM3357BZCZD30

IC MPU SITARA 300MHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 300MHz 324-NFBGA (15x15)

Quantity 759 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeIndustrialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed300MHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3357BZCZD30 – IC MPU SITARA 300MHZ 324NFBGA

The AM3357BZCZD30 is a Sitara™ ARM® Cortex®-A8 microprocessor from Texas Instruments, featuring a single 32‑bit core running at 300 MHz. Designed for embedded and industrial applications, it integrates multimedia acceleration, multiple memory controller options, and a range of I/O interfaces to support networked and display-oriented designs.

With industrial-grade operating range and a compact 324‑NFBGA (15×15) package, this device addresses use cases that require robust thermal performance, integrated security primitives, and broad peripheral connectivity.

Key Features

  • Processor Core  ARM® Cortex®‑A8 single core, 32‑bit architecture running at 300 MHz for general embedded compute tasks.
  • Multimedia Acceleration  Includes multimedia DSP capability and NEON™ SIMD for improving media and signal processing throughput.
  • Memory Interfaces  Integrated controllers supporting LPDDR, DDR2, DDR3 and DDR3L memory types to match a variety of system memory designs.
  • Display and HMI  Built‑in LCD and touchscreen display interface controllers plus graphics acceleration to simplify user‑interface and display designs.
  • High‑speed Connectivity  Dual Ethernet ports supporting 10/100/1000 Mbps and two USB 2.0 ports with PHY for wired networking and peripheral connectivity.
  • Additional Interfaces  CAN interface support for industrial communications and fieldbus integration.
  • Security  On‑device cryptography and a random number generator to support secure boot, encryption and other security tasks.
  • Package and Mounting  324‑pin NFBGA (15×15) supplier device package, surface‑mount mounting for compact board integration.
  • Industrial Temperature  Rated to operate from −40 °C to 90 °C for deployment in demanding environments.
  • Regulatory  RoHS compliant.

Typical Applications

  • Industrial Control and Automation  Use the AM3357BZCZD30 for networked controllers and I/O hubs that require industrial temperature operation and CAN/Ethernet connectivity.
  • Human‑Machine Interfaces (HMI)  Drive LCD/touchscreen displays with on‑chip graphics acceleration for operator panels and control displays.
  • Networked Embedded Gateways  Leverage dual Gigabit Ethernet and USB 2.0 interfaces to build communication gateways and protocol converters.
  • Multimedia and Signal Processing Devices  Apply the NEON™ SIMD and multimedia DSP capabilities for embedded audio/video processing and accelerated data handling.

Unique Advantages

  • Integrated connectivity: Dual Gigabit Ethernet and USB 2.0 with PHY reduce external components and simplify board layout for networked systems.
  • Flexible memory support: Multiple supported memory types (LPDDR, DDR2, DDR3, DDR3L) enable designers to choose cost or performance optimized memory subsystems.
  • HMI‑ready features: On‑chip LCD/touchscreen controllers plus graphics acceleration lower development effort for user interfaces.
  • Security primitives on‑chip: Built‑in cryptography and a random number generator help implement secure communication and data protection with fewer external devices.
  • Industrial thermal range: −40 °C to 90 °C rating supports deployment in harsh or temperature‑variable environments.
  • Compact surface‑mount package: 324‑NFBGA (15×15) package enables space‑constrained designs while maintaining rich peripheral integration.

Why Choose AM3357BZCZD30?

The AM3357BZCZD30 combines a proven ARM® Cortex®‑A8 core with targeted multimedia and security features in a compact industrial package from Texas Instruments’ Sitara AM335x family. Its combination of connectivity, display support, and flexible memory options makes it suitable for embedded and industrial applications that require a balanced mix of compute, I/O, and environmental robustness.

Designers looking for a scalable Sitara‑series solution with on‑chip peripherals and industrial temperature capability will find the AM3357BZCZD30 appropriate for gateways, HMI, control systems, and multimedia‑enabled embedded products, backed by TI’s product family ecosystem.

Request a quote or submit an inquiry to obtain pricing and availability for the AM3357BZCZD30.

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