AM3358BZCZ100

IC MPU SITARA 1.0GHZ 324NFBGA
Part Description

ARM® Cortex®-A8 Microprocessor IC Sitara™ 1 Core, 32-Bit 1.0GHz 324-NFBGA (15x15)

Quantity 1,206 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesSitara AM335x
ManufacturerTexas Instruments
Manufacturing StatusActive
Manufacturer Standard Lead Time6 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ SIMDCore ProcessorARM® Cortex®-A8Device Package324-NFBGA (15x15)
Display & Interface ControllersLCD, TouchscreenECCN5A992CEthernet10/100/1000Mbps (2)
GradeCommercialGraphics AccelerationYesHTS Code8542.31.0001
Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface MountMounting TypeSurface Mount
Number of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 90°C (TJ)Package / Case324-LFBGA
RAM ControllersLPDDR, DDR2, DDR3, DDR3LREACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 Compliant
Security FeaturesCryptography, Random Number GeneratorSpeed1.0GHzSupplier Device Package324-NFBGA (15×15)
USBUSB 2.0 + PHY (2)Voltage – I/O1.8V, 3.3V

Overview of AM3358BZCZ100 – IC MPU SITARA 1.0GHZ 324NFBGA

The AM3358BZCZ100 is a Sitara™ microprocessor from Texas Instruments featuring a single ARM® Cortex®-A8 core running at 1.0 GHz in a 324‑ball NFBGA (15×15) package. Designed for embedded applications, the device integrates multimedia acceleration, multiple high-speed interfaces, and hardware security features to support connected human‑machine interfaces, communications nodes, and industrial edge devices.

Key Features

  • Processor Core  Single ARM® Cortex®-A8 core, 32‑bit, operating at 1 GHz for application processing and control tasks.
  • Signal Processing  Includes multimedia co-processor support and NEON™ SIMD for accelerated multimedia and vector processing.
  • Memory Interfaces  Integrated memory controllers supporting LPDDR, DDR2, DDR3 and DDR3L memories for flexible system memory design.
  • Display and HMI  Display interface controllers for LCD and touchscreen support to enable graphical human‑machine interfaces.
  • Ethernet Connectivity  Two 10/100/1000 Mbps Ethernet interfaces for wired LAN and industrial networking applications.
  • USB  Two USB 2.0 ports with PHY to support host and device connectivity for peripherals and service interfaces.
  • Automotive/Field Bus  CAN interface included for vehicle networks and industrial fieldbus integration.
  • Security  On‑device cryptography and a hardware random number generator for secure communications and data protection.
  • Graphics Acceleration  Integrated graphics acceleration to assist with UI rendering and multimedia playback.
  • Package & Mounting  Supplier device package: 324‑NFBGA (15×15); package case listed as 324‑LFBGA; surface mount mounting type.
  • Operating Range  Commercial operating temperature range of 0 °C to 90 °C.
  • Environmental  RoHS compliant.

Typical Applications

  • Industrial HMI  Use the integrated LCD/touchscreen controllers and graphics acceleration to drive operator panels and graphical interfaces.
  • Networked Controllers  Dual Gigabit Ethernet and CAN support enable use as communication nodes or gateway devices in industrial networks.
  • Multimedia Embedded Devices  NEON SIMD and multimedia co-processor support make the device suitable for multimedia playback and processing in embedded appliances.
  • Embedded USB Systems  Dual USB 2.0 with PHY provides peripheral connectivity for data logging, service access, and accessory support.

Unique Advantages

  • Balanced Performance and Integration: A 1.0 GHz Cortex‑A8 core combined with multimedia and graphics acceleration delivers responsive application performance while consolidating system functions.
  • Flexible Memory Support: Support for LPDDR, DDR2, DDR3 and DDR3L provides designers options for performance, cost, and power tradeoffs.
  • Rich I/O Connectivity: Dual Gigabit Ethernet, dual USB 2.0 with PHY, and CAN reduce the need for external bridges and simplify board layout.
  • Built‑in Security Primitives: On‑chip cryptography and a hardware RNG help implement secure communications and device authentication without additional crypto ASICs.
  • Compact, Surface‑Mount Package: 324‑ball NFBGA (15×15) package enables high‑density board integration for space‑constrained embedded designs.
  • Commercial Temperature and RoHS Compliance: 0 °C to 90 °C operating range and RoHS compliance support deployments in a wide range of commercial embedded environments.

Why Choose AM3358BZCZ100?

The AM3358BZCZ100 positions itself as a versatile, integrated microprocessor for embedded designers seeking a single‑core ARM® Cortex®‑A8 solution with multimedia capability and broad peripheral support. Its combination of a 1.0 GHz core, memory flexibility, dual Gigabit Ethernet, USB, CAN, display controllers, and hardware security primitives make it suitable for connected HMIs, networked controllers, and multimedia edge devices.

Designed and supplied by Texas Instruments and delivered in a compact 324‑ball NFBGA package, the AM3358BZCZ100 provides a scalable building block for commercial embedded products where performance, integration, and supply-chain compatibility are key considerations.

Request a quote or submit a pricing inquiry to evaluate the AM3358BZCZ100 for your next embedded design project.

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