ATSAMA5D24C-CUR
| Part Description |
ARM® Cortex®-A5 Microprocessor IC SAMA5D2 1 Core, 32-Bit 500MHz 256-TFBGA (8x8) |
|---|---|
| Quantity | 575 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | SAMA5D2 |
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 7 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Multimedia; NEON™ MPE | Core Processor | ARM® Cortex®-A5 | Device Package | 256-TFBGA (8x8) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | Keyboard, LCD, Touchscreen | ECCN | 5A992C | Ethernet | 10/100Mbps (1) | ||
| Grade | Industrial | Graphics Acceleration | Yes | HTS Code | 8542.31.0001 | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | Mounting Type | Surface Mount | ||
| Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 256-TFBGA | ||
| RAM Controllers | LPDDR1, LPDDR2, LPDDR3, DDR2, DDR3, DDR3L, QSPI | REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | ||
| Security Features | ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC | Speed | 500MHz | Supplier Device Package | 256-TFBGA (8×8) | ||
| USB | USB 2.0 + HSIC | Voltage – I/O | 3.3V |
Overview of ATSAMA5D24C-CUR – IC MPU SAMA5D2 500MHZ 256TFBGA
The ATSAMA5D24C-CUR is an ARM® Cortex®-A5 microprocessor from Microchip Technology’s SAMA5D2 series. It provides a single 32‑bit core running at 500 MHz in a compact 256‑TFBGA (8×8) package for embedded system integration.
Designed for industrial embedded applications, this device combines processing performance with a broad set of memory controllers, interfaces and hardware security features to support integrated, secure designs operating from −40 °C to 85 °C.
Key Features
- Core Single ARM® Cortex®‑A5 core, 32‑bit, operating at 500 MHz for general embedded processing tasks.
- Memory Support On‑chip support for multiple memory types including LPDDR1/LPDDR2/LPDDR3, DDR2, DDR3, DDR3L and QSPI, enabling flexibility in system memory selection.
- Multimedia & DSP Includes multimedia co‑processor support and NEON™ MPE for media and signal processing acceleration.
- Display & HMI Display interface controllers for keyboard, LCD and touchscreen enable human‑machine interface implementations.
- Connectivity Integrated 10/100 Mbps Ethernet (1) plus USB 2.0 with HSIC provides common wired communications options; I2C is available for peripheral control.
- Security Hardware security features include ARM TrustZone (TZ), boot security, cryptography, RTIC, secure fusebox, secure JTAG, secure memory and a secure RTC to support protected boot and runtime operation.
- Graphics Acceleration Built‑in graphics acceleration to assist with rendering and display tasks.
- Power & IO 3.3 V I/O voltage for compatibility with common embedded peripherals; surface‑mount device for PCB assembly.
- Package & Temperature 256‑TFBGA (8×8) package and industrial operating temperature range of −40 °C to 85 °C for robust deployments.
- Environmental RoHS compliant.
Unique Advantages
- Integrated security suite: A broad set of hardware security features (TrustZone, secure JTAG, secure memory, secure RTC, secure fusebox, cryptography, boot security) reduces the need for external security components.
- Flexible memory interface: Support for multiple DRAM generations and QSPI lets designers choose memory density and performance that match application requirements.
- Compact, production‑ready package: 256‑TFBGA (8×8) surface‑mount package simplifies board layout for space‑constrained embedded systems.
- Industrial temperature rating: −40 °C to 85 °C operation enables use in industrial environments without additional thermal qualification.
- Rich peripheral set: Ethernet, USB 2.0 + HSIC, I2C and display controller support provide common interfaces for networking, HMI and peripheral connectivity.
- Multimedia acceleration: Dedicated DSP and NEON MPE support offloads media and signal processing workloads from the main CPU core.
Why Choose ATSAMA5D24C-CUR?
The ATSAMA5D24C-CUR positions itself as a compact, secure and connected microprocessor for embedded industrial designs that require a balance of processing capability, graphics/multimedia support and extensive hardware security. Its single ARM Cortex‑A5 core at 500 MHz, broad memory compatibility and integrated interfaces simplify system architecture while maintaining an industrial operating range.
Choose ATSAMA5D24C-CUR when you need a Microchip SAMA5D2 series MPU that integrates security, connectivity and display support in a RoHS‑compliant 256‑TFBGA package—helping to reduce BOM complexity and accelerate development for embedded platforms.
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