STA1085ELA3S1
| Part Description |
ARM® Cortex®-R4 Microprocessor IC - 2 Core, 32-Bit 450MHz 361-LFBGA (16x16) |
|---|---|
| Quantity | 84 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | STA1085 (Telematics) |
| Manufacturer | STMicroelectronics |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 30 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M3 | Core Processor | ARM® Cortex®-R4 | Device Package | 361-LFBGA (16x16) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | LCD | ECCN | N/A | Grade | Automotive | ||
| Graphics Acceleration | No | HTS Code | N/A | Moisture Sensitivity Level | N/A | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 2 Core, 32-Bit | ||
| Operating Temperature | -40°C ~ 85°C (TA) | Package / Case | 361-LFBGA | RAM Controllers | SDRAM | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | Boot Security, Secure JTAG | ||
| Speed | 450MHz | Supplier Device Package | 361-LFBGA (16×16) | USB | USB 2.0 (2) | ||
| Voltage – I/O | 3.3V |
Overview of STA1085ELA3S1 – IC MPU 450MHZ 361LFBGA
The STA1085ELA3S1 from STMicroelectronics is an ARM® Cortex®-R4 based microprocessor IC featuring dual 32-bit cores operating at 450 MHz. It belongs to the STA1085 telematics series and targets embedded and automotive telematics applications that require balanced compute performance and system integration.
With integrated peripherals including USB 2.0, CANbus, LCD controller support and SDRAM memory control, the device is tailored for designs where on-chip connectivity, secure boot capabilities and automotive-grade qualification are important.
Key Features
- Core & Performance Dual ARM® Cortex®-R4 32-bit cores running at 450 MHz provide deterministic processing for real-time embedded workloads.
- Co-processor Integrated ARM® Cortex®-M3 co-processor for offloading control or auxiliary tasks and improving system partitioning.
- Memory & Display SDRAM controller and LCD display interface controllers allow direct management of external memory and display subsystems.
- Connectivity Two USB 2.0 ports and CANbus support enable robust peripheral and vehicle network integration for telematics and infotainment systems.
- Security & Debug Boot Security and Secure JTAG features provide device-level protection and secure development/debug capabilities.
- Power & I/O 3.3 V I/O voltage compatibility for common embedded interfaces.
- Package & Mounting Supplied in a 361-LFBGA (16 × 16 mm) ball grid array package, optimized for surface-mount PCB assembly.
- Automotive Qualification & Temperature Range AEC-Q100 qualified and specified for operation from −40°C to 85°C, supporting automotive and other temperature-demanding deployments.
- Compliance RoHS compliant to align with environmental requirements for electronic assemblies.
Typical Applications
- Automotive Telematics — On-board telematics units leveraging dual-core processing, CANbus connectivity and USB interfaces for data and connectivity services.
- Infotainment Systems — Integration with LCD controllers and external SDRAM for vehicle infotainment display and control functions.
- Vehicle Gateway and Networking — Centralized gateway applications using CANbus and USB to manage in-vehicle networks and peripherals.
- Embedded Control in Harsh Environments — Systems requiring AEC-Q100 qualification and extended temperature operation for reliable field performance.
Unique Advantages
- Dual-core real-time processing: Two ARM® Cortex®-R4 cores at 450 MHz enable partitioned workloads and responsive control for embedded telematics.
- Integrated peripheral set: Built-in USB 2.0 ports, CANbus and LCD interface reduce external component count and simplify system design.
- Security-first features: Boot Security and Secure JTAG help protect firmware integrity and secure the development/debug chain.
- Automotive-grade reliability: AEC-Q100 qualification and −40°C to 85°C operating range support deployment in automotive environments.
- Compact, assembly-ready package: 361-LFBGA (16×16 mm) BGA package supports high-density PCB layouts and surface-mount manufacturing.
- Standards-compliant I/O: 3.3 V I/O compatibility and RoHS compliance ease integration with common automotive and embedded subsystems.
Why Choose STA1085ELA3S1?
The STA1085ELA3S1 positions itself as a purpose-built microprocessor for telematics and embedded automotive applications, combining dual ARM® Cortex®-R4 cores with an ARM® Cortex®-M3 co-processor, on-chip memory control and a broad set of vehicle-facing interfaces. Its security features and AEC-Q100 qualification provide a clear path for robust, secure systems in temperature-challenging environments.
This device is well suited to designers who need integrated connectivity (USB, CANbus), display support and deterministic real-time processing in a compact, surface-mount form factor, backed by STMicroelectronics' platform approach and ecosystem support.
If you would like pricing, availability, or a formal quote for STA1085ELA3S1, request a quote or contact our sales team to submit your requirements and receive assistance with procurement and design-in support.

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