 | | MC68302CRC16C | NXP Semiconductors | IC MPU M683XX 16MHZ 132PGA | Microprocessors | 132-PGA (34.5x34.5) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 132-BPGA Exposed Pad Supplier Device Package: 132-PGA (34.5×34.5) | 374 | |
 | | MC68302CRC20C | NXP Semiconductors | IC MPU M683XX 20MHZ 132PGA | Microprocessors | 132-PGA (34.5x34.5) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Package / Case: 132-BPGA Exposed Pad Supplier Device Package: 132-PGA (34.5×34.5) | 1,872 | |
 | | MC68302EH16C | NXP Semiconductors | IC MPU M683XX 16MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 661 | |
 | | MC68302EH16CR2 | NXP Semiconductors | IC MPU M683XX 16MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 1,809 | |
 | | MC68302EH20C | NXP Semiconductors | IC MPU M683XX 20MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 207 | |
 | | MC68302EH20CR2 | NXP Semiconductors | IC MPU M683XX 20MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 1,875 | |
 | | MC68302EH25C | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 26 | |
 | | MC68302EH25CB1 | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 1,507 | |
 | | MC68302EH25CR2 | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 63 | |
 | | MC68302FC16C | NXP Semiconductors | IC MPU M683XX 16MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 948 | |
 | | MC68302FC20C | NXP Semiconductors | IC MPU M683XX 20MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 1,401 | |
 | | MC68302FC25C | NXP Semiconductors | IC MPU M683XX 25MHZ 132PQFP | Microprocessors | 132-PQFP (46x46) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 132-BQFP Bumpered Supplier Device Package: 132-PQFP (46×46) | 397 | |
 | | MC68302PV16C | NXP Semiconductors | IC MPU M683XX 16MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,431 | |
 | | MC68302PV16VC | NXP Semiconductors | IC MPU M683XX 16MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,896 | |
 | | MC68302PV20C | NXP Semiconductors | IC MPU M683XX 20MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 564 | |
 | | MC68302PV25C | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 177 | |
 | | MC68302PV33C | NXP Semiconductors | IC MPU M683XX 33MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 24 | |
 | | MC68302RC16C | NXP Semiconductors | IC MPU M683XX 16MHZ 132PGA | Microprocessors | 132-PGA (34.5x34.5) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 132-BPGA Exposed Pad Supplier Device Package: 132-PGA (34.5×34.5) | 839 | |
 | | MC68302RC20C | NXP Semiconductors | IC MPU M683XX 20MHZ 132PGA | Microprocessors | 132-PGA (34.5x34.5) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Package / Case: 132-BPGA Exposed Pad Supplier Device Package: 132-PGA (34.5×34.5) | 1,010 | |
 | | MC68306AG16B | NXP Semiconductors | IC MPU M683XX 16MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 414 | |