Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68302CRC16CMC68302CRC16CNXP SemiconductorsIC MPU M683XX 16MHZ 132PGAMicroprocessors132-PGA (34.5x34.5)N/A-40°C ~ 85°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
132-BPGA Exposed Pad
Supplier Device Package:
132-PGA (34.5×34.5)
374
MC68302CRC20CMC68302CRC20CNXP SemiconductorsIC MPU M683XX 20MHZ 132PGAMicroprocessors132-PGA (34.5x34.5)N/A-40°C ~ 85°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
132-BPGA Exposed Pad
Supplier Device Package:
132-PGA (34.5×34.5)
1,872
MC68302EH16CMC68302EH16CNXP SemiconductorsIC MPU M683XX 16MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
661
MC68302EH16CR2MC68302EH16CR2NXP SemiconductorsIC MPU M683XX 16MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
1,809
MC68302EH20CMC68302EH20CNXP SemiconductorsIC MPU M683XX 20MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
207
MC68302EH20CR2MC68302EH20CR2NXP SemiconductorsIC MPU M683XX 20MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
1,875
MC68302EH25CMC68302EH25CNXP SemiconductorsIC MPU M683XX 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
26
MC68302EH25CB1MC68302EH25CB1NXP SemiconductorsIC MPU M683XX 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
1,507
MC68302EH25CR2MC68302EH25CR2NXP SemiconductorsIC MPU M683XX 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
63
MC68302FC16CMC68302FC16CNXP SemiconductorsIC MPU M683XX 16MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
948
MC68302FC20CMC68302FC20CNXP SemiconductorsIC MPU M683XX 20MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
1,401
MC68302FC25CMC68302FC25CNXP SemiconductorsIC MPU M683XX 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
397
MC68302PV16CMC68302PV16CNXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
1,431
MC68302PV16VCMC68302PV16VCNXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
1,896
MC68302PV20CMC68302PV20CNXP SemiconductorsIC MPU M683XX 20MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
564
MC68302PV25CMC68302PV25CNXP SemiconductorsIC MPU M683XX 25MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
25MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
177
MC68302PV33CMC68302PV33CNXP SemiconductorsIC MPU M683XX 33MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
33MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
24
MC68302RC16CMC68302RC16CNXP SemiconductorsIC MPU M683XX 16MHZ 132PGAMicroprocessors132-PGA (34.5x34.5)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
16MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
132-BPGA Exposed Pad
Supplier Device Package:
132-PGA (34.5×34.5)
839
MC68302RC20CMC68302RC20CNXP SemiconductorsIC MPU M683XX 20MHZ 132PGAMicroprocessors132-PGA (34.5x34.5)N/A0°C ~ 70°C (TA)
Core Processor:
M68000
Number of Cores/Bus Width:
1 Core, 8/16-Bit
Speed:
20MHz
Co-Processors/DSP:
Communications; RISC CPM
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
132-BPGA Exposed Pad
Supplier Device Package:
132-PGA (34.5×34.5)
1,010
MC68306AG16BMC68306AG16BNXP SemiconductorsIC MPU M683XX 16MHZ 144LQFPMicroprocessors144-LQFP (20x20)N/A0°C ~ 70°C (TA)
Core Processor:
EC000
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
RAM Controllers:
DRAM
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
144-LQFP
Supplier Device Package:
144-LQFP (20×20)
414

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